Showing results: 181 - 195 of 685 items found.
-
IntelliJet® -
Nordson Corporation
The IntelliJet® Jetting System with patented ReadiSet® Jet Cartridge delivers cutting-edge reliability and micro dot dispensing for manufacturing advanced semiconductor and mobile electronics packages
-
Echo -
Onto Innovation
The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
-
DENKEN Co., Ltd.
External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
-
Test Tooling Solutions Group
Hand socket lid is normally used to run evaluation tests on semiconductor devices prior to High Volume Manufacturing mode. It can also be used as a trouble shooting tool at bench test.
-
MOS Capacitance-Time Measurement and Analysis -
Materials Development Corporation
The Capacitance-Time transient resulting from an MOS device pulsed into deep depletion reveals important information about bulk properties of the semiconductor and about damage or contaminants introduced during processing.
-
Alpes Lasers sa
are operating in the range from 1 to 5 THz. Coherent polarized THz radiation is generated as a result of direct stimulated optical transitions of electrons within the conduction band of a semiconductor heterostructure.
-
Nidec-Read Corporation
MEMS Spring Probe is developed by NIDEC-READ original ultra-fine 3D processing technology and enables our customer to supply advanced and innovative test solutions at PCB & semiconductor testing market.
-
IT-470F-H -
HORIBA, Ltd.
The IT-470F-H is a built-in type, non-contact infrared thermometer with industry-leading* accuracy. It contributes to improve process stabilization, for which requires high accuracy temperature measurement, such as semiconductor and FPD production.
-
Tokyo Seimitsu Co., Ltd.
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
-
Materials Analysis Technology Inc.
This technology is used to identify the electrical characteristics, such as resistance, capacitance and inductance, of semiconductor devices. Characteristics measured from fail and normal chips could provide important clues for further failure analysis.
-
RiKO Opto-Electronics Technology Co
Easy to install.Numeric displays, interactive prompts.Applications focus on many industries,such as semiconductor assembly, handling technology and packing.Depends on the mounting direction, the digital display of BR1 can be inverted.Response time selectable:(20050010005000)s.
-
The Optoelectronics Company Ltd
USHIO OPTO's new 705nm, 40mW laser diodes, HL7001MG and HL7002MG are the first ever 705nm semiconductor lasers and are suitable for biomedical light sources. For more information, see HL7001MG/7002MG overview.
-
The ZT-Series -
Avionics Interface Technologies
The ZT-Series brand of Modular Digitizers, Digital Storage Oscilloscopes, and Waveform Generators support a number of test and measurement applications found in the Defense and Aerospace, Semiconductor Test, and Industrial Control and Automation spaces.
-
Fluke Process Instruments
Monitor the temperatures for every soldering application – including wave, reflow, vapor phase, selective and rework stations – in real-time with the Datapaq Reflow Tracker Systems. Ideal for the electronics manufacturing and semiconductor applications.
-
HE-960LF / FS-09F-1/2 -
HORIBA, Ltd.
It is effective to keep the dilution of Slurry constant. Maintaining an appropriate conductivity value contributes to process stability in the wafer polishing process. Even highly viscous sample liquids such as CMP Slurry can be measured without problems because they use a sensor structure that reduces the risk of the sample liquid sticking to the electrodes. In addition, the sensor is made of a wetted material with excellent chemical resistance, which meets the cleanliness requirements of semiconductor processes. In addition to the above, it can also be used for introduction at the semiconductor process development stage and conductivity control of special chemicals.