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Semiconductor

active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.

See Also: iJTAG


Showing results: 391 - 405 of 685 items found.

  • Test Sockets

    Petracarbon Pte Ltd

    World’s most comprehensive offering of spring probe based solutions, including: contacts, connectors, interposers, semiconductor test sockets, and ATE interfaces. Proven off-the-shelf and custom products deliver the best solution for the customer’s specific application

  • Epi Thickness & Composition

    Onto Innovation

    FTIR (Fourier Transform Infrared) is the most important technology for measuring epitaxial film (Epi) thickness, measuring impurities in Silicon and monitoring dielectrcis, like Borophosphosilicate glass (BPSG), FSG, PSG, etc in semiconductor industry. FTIR is evolving from a primarily quality control (wafer supply chain) technology to a tool/process/chamber (test wafers) monitoring technology and more importantly, a device (product wafers) monitoring tool.

  • Software

    MOS Doping Profile Analysis - Materials Development Corporation

    MDC uses the comprehensive Ziegler algorithm toconvert pulsed MOS C-V data to a doping profile. The doping profile is accurate from the oxide semiconductor interface to the maximum depletion depth and is therefore useful for low dose ion implant monitoring. Peak doping, range, and total active dose are computed. The technique is sensitive enough to resolve changes in the substrate doping profile due to redistribution during oxidation.

  • Stand-Alone Type Chemical Concentration Monitor

    CS-100 Series - HORIBA, Ltd.

    The CS-100 Series offers a complete lineup of high precision chemical solution concentration monitors for various solutions in cleaning and etching processes during semiconductor manufacturing. In addition to the high-speed response and compact design, measurement of each component concentration is conducted in real-time and the timing of chemical solution changes and automatic supply is warned with an alarm. The ability to perform short measurement cycles allows for accurate monitoring of concentration changes.

  • 5.0 MP NVIDIA® Jetson Nano™ Camera

    E-CAM50_CUNANO - e-con Systems Inc.

    e-CAM50_CUNANO is a 5.0 MP 2-lane MIPI CSI-2 fixed focus color camera for NVIDIA® Jetson Nano™ developer Kit. This camera is based on 1/2.5" AR0521 CMOS Image sensor from ON Semiconductor® with built-in Image Signal Processor (ISP). This powerful ISP helps to brings out the best image quality from the sensor and making it ideal for next generation of AI devices.

  • Micro Volume pH Monitor

    UP-100 - HORIBA, Ltd.

    Redevelops HORIBA's founding pH measurement technology using new ultra-small capillary electrode. HORIBA's UP-100 affords ultra-low sample consumption of just 500 uL/measurement, enabling continuous pH monitoring for a variety of critical manufacturing processes that include Semiconductor (Cleaning, Etching and Plating); Chemical Manufacturing, Bio, Pharm, Food Processing, etc.Designed for 6 month continuous operation without operator intervention for minimizing downtime.

  • Wave Inverter - New Compact, High-performance Series

    CSI 280-F3 Series - Absopulse Electronics Ltd.

    ABSOPULSE Electronics has released the CSI 280-F3 Series of ultra-compact, high-performance dc/ac sine wave inverters. The units introduce new semiconductor technology and a unique design topology that simplifies the circuitry and enables significantly more compact construction, lower weight and cost, and higher MTBF than previous 300VA inverter designs. The total footprint of each unit is 132 x 64 x 300 mm.

  • Low-leakage Switch Matrix Family

    Keysight Technologies

    Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test.  Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution.  Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested.  This reduces both test time and cost.  Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.

  • µHELIX® Test Probes

    Series S200, S300, S400, and S500 - AlphaTest Corp.

    Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.

  • High Voltage Isolation Test Systems

    HT 9460 and 9464 - HARRIS TUVEY

    Accurate and non-destructive production testing of ac Isolation Voltage and Partial Discharge. With over 450 systems installed worldwide the 946X series of test systems are the standard and system of choice used by the majority of semiconductor manufacturers that produce optically isolated devices.

  • Asynchronous System Level Test Platform

    Titan - Teradyne, Inc.

    The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.

  • Caibration Equipment For Lab Use

    Ponovo Power Co., Ltd.

    In the field of high-power semiconductor testing, PONOVO has launched a smart test platform with high-speed high-frequency, high-voltage, high-current power sources, combined with high-speed, high-precision high-voltage, high-current analog acquisition technology and high-speed digital processing control system. The platform can complete the testing of dynamic parameter parameters, static parameters, thermal parameters and mechanical parameters, and power life parameter of various types of high-power semiconductor devices, modules, and chips, which could meet different testing requirements. It is the universal testing platform for automated testing for different application purpose, such as the research and development testing, engineering acceptance test, factory acceptance test, etc.

  • FCB Probe Card

    MPI Probe Card Technology

    The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor production tests from early engineering pilot-runs to high volume manufacturing (HVM). FCB is ready for device requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the world’s best overall cost-of-ownership (COO) for various DUT applications.

  • Software Development Projects

    Precision Development Consulting Inc

    Automation of new process tool prototype in startup environment, Complex R&D Gasbox Automation, Semiconductor System Control Software, Wafer Transfer Control Software, 300mm Factory Automation, Complete port of Spectrometer software to windows, HSMS Protocol

  • Diode Lasers

    Laser Diode Micro-Modules - Advanced Photonic Sciences LLC

    Advanced Photonic Sciences (APS) has introduced a new product line of Laser Diode Micro-Modules (LDMM’s) that address the need for a simple, robust, reliable, and cost-effective platform on which to mount, provide heatsinking for, collimate, and power semiconductor laser diodes. The use of laser diodes in scores of applications has become ubiquitous, and our new products make mounting, collimating, heatsinking, and providing power leads for such applications easier than ever.

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