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Semiconductor

active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.

See Also: iJTAG


Showing results: 541 - 555 of 685 items found.

  • C-V Plotters

    Materials Development Corporation

    MDC will tailor your CSM/Win Semiconductor Measurement System for your exact requirements. Choose the best capacitance meter, output device, and probe station for your needs. All CSM/Win C-V plotters feature the latest Dell Computers. The computer and capacitance meters are rackmounted in one compact enclosure. When ordered with a hot chuck or probe station, MDC can deliver a turnkey system of unparalleled performance.

  • Ozonated Water Delivery System

    LIQUOZON® DI-O3 - MKS Instruments

    MKS' LIQUOZON® DI-O3 is a dissolved ozone gas delivery system providing high purity ozone in ultrapure water for Semiconductor and Electronic Thin Film applications like contaminant removal and surface conditioning via wet clean or rinsing methods. The high redox potential of ozone causes rapid conversion back to oxygen making it an environmentally friendly alternative to other chemical processes.

  • Patented DPEM Process for ​Die Removal

    DPA Components International

    DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.​

  • RF & Microwave Signal Generator

    SMA100B - Rohde & Schwarz GmbH & Co. KG

    The R&S®SMA100B RF and microwave signal generator delivers uncompromising maximum performance. It provides the purest output signals while maintaining the highest output power levels with the lowest harmonics, far outpacing the competition. As the world's leading signal generator, it can handle the most demanding module and system T&M tasks in the RF semiconductor, wireless communications, aerospace and defense industries.

  • Streak Camera

    OptoScope S3C-1 - Optronis GmbH

    The S3C-1 is a streak camera based on a semiconductor sensor. Like tube-based streak cameras, the S3C-1 captures changes in light along a line and records the change over time. To record the intensity values, they are sampled and stored with up to 2 GSamples/sec. The line is 65 µm wide and consists of 200 elements along its 5 mm length. Each element consists of a sensitive photodiode with a downstream amplifier.A new and special camera feature is continuous recording. This makes it possible to take recordings of events for which precise information about the time of their occurrence only becomes available after they have taken place. This "post-triggering" simplifies or allows certain applications.

  • Systems Integration

    Libra Industries

    Libra delivers customized manufacturing solutions for high complexity system integration requirements. No matter the industry, we most likely have experience in it across our 85 years of delivering solutions. We have expertise in large complex electro mechanical assemblies, both at the final product level as well as subassembly levels. From advanced robotics to intricate semiconductor capital equipment requirements, we combine system level capabilities with vertical capabilities and know how, that allows us to understand the technical underpinnings of your product. Our well equipped clean room facility allows us to deliver to the cleanliness standards that your product requires.

  • Mixed Signal Test Systems

    MTS1010i - Applied Test Resources

    The MTS-1010i is a more economical version of the MTS-2010i & MTS-1020i testers. It has a reduced platform size and reduced power supplies. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process.

  • Non-Contact Mapping Life Time System

    MWR-2S-3 - HenergySolar

    The device is designed for express non-destructive contactless local measurement of non-equilibrium charge carrier effective lifetime in silicon substrates, epi-wafers and solar cells at different stages of manufacturing cycle. It can be used for incoming and outcoming inspection of silicon ingots and wafers, tuning and periodic inspection of semiconductor and solar cell technology quality. Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as a probe.

  • 4K Multi-Camera System (TRICAM)

    E-CAM130_TRICUTX2 - e-con Systems Inc.

    e-CAM130_TRICUTX2 (TRICamera) is a multiple camera solution for NVIDIA® Jetson TX2 developer kit that consists of three 13 MP 4-Lane MIPI CSI-2 camera board and an base board to interface with the J22 connector on the Jetson TX2. Each camera is based on the camera module e-CAM137_CUMI1335_MOD, 1/3.2" AR1335 color CMOS image sensor from ON Semiconductor® and integrated high performance Image Signal Processor (ISP).

  • Air Core Line & Load Reactors

    Hilkar

    Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.

  • LV Iron Core Line & Load Reactors

    Hilkar

    Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.

  • PXIe-6571, 1-Slot, 100 MVector/s PXI Digital Pattern Instrument

    786320-01 - NI

    1-Slot, 100 MVector/s PXI Digital Pattern Instrument - The PXIe‑6571 is designed for semiconductor characterization and production test. It includes the Digital Pattern Editor for configuring pin maps, specifications, levels, timing, and patterns. It also includes debugging tools … like Shmoo, digital scope, and viewers for history RAM, pin states, and system status. The PXIe-6571 requires a chassis with 82 W slot cooling capacity, such as the PXIe-1095.

  • Edge Grinding Machines

    Tokyo Seimitsu Co., Ltd.

    The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.

  • Power Module Test Cells

    SPEA S.p.A.

    SPEA’s Power Module Test Cells are the complete industrial equipment oriented to the production test requirements of IGBT semiconductor power modules for consumer, transportation, energy production, industrial applications.SPEA’s Power Module Test Cells provide a turnkey solution for the automated handling, contacting and testing of these products, with the capability to force and measure the very high current (up to 1000 A) and voltage (up to 2500 V) values required for a complete, reliable test.

  • Dummy Components

    TopLine Corp.

    BGA and CCGA Column Grid Array, solder columns and a wide range of daisy chain semiconductor packages, and test vehicle PC boards. TopLine assists thousands of customers define and refine their SMT and microelectronics assembly processes. ver 1000 different dummy packages and practice kits. Typical applications include machine evaluation, acceptance testing, solder training, temperature profiling, re-certification, prototype design, practice and demonstrations.

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