Showing results: 676 - 685 of 685 items found.
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PZ2131A -
Keysight Technologies
The Keysight PZ2131A is a high-channel density precision source / measure unit (SMU) having 5 channels per module and saving space for a wide range of applications requiring numerous precision power supplies. The narrow-pulse function and fast Digitizer Mode allow the PZ2131A to expand the conventional static DC measurements to emerging dynamic measurements. Its seamless current measurement ranging function eliminates the time it takes to change the range and expands the dynamic range to cover multiple measurement ranges, which reduces test duration. These capabilities make the PZ2131A suitable for applications that require numerous precision power supplies, such as semiconductor reliability tests and integrated circuit (IC) tests. The Keysight PX0107A low noise filter adapter lowers its voltage source noise level, which makes the PZ2131A suitable for noise-sensitive applications such as quantum computing as well.
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Model 6000 -
OAI
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Bruker Corporation
rom the very compact FTIR spectrometer to the world’s highest resolution: Bruker offers the industry's largest selection for demanding routine and High End FTIR research application including the new and unique verTera cw THz functionality.Process monitoring with FTIR / FT-NIR process spectrometers.A complete line of Near Infrared Spectrometers to fit all your needs, including Process Monitoring.FTIR Microscopy and Raman Microscopy and Spectral Imaging for high sensitivity at high spatial resolution.High spectral resolution, high performance Raman and FT-Raman spectrometers for advanced routine solutions.FTIR Gas Analyzers for the fully automated and high precision real-time monitoring of gas compoundsImaging Remote Sensing systems for analysis of gases, liquids and solids.CryoSAS semiconductor material quality control for photovoltaic and electronics industry.OPUS, the "all-in-one" IR and Raman spectroscopy software consists of a suite of software packages that cover both standard and specialized applications.ONET, software for the setup, administration and control of large FT-NIR spectrometer networks.
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Wildcat+ 640 TE0 and WL Series -
Xenics
The Wildcat+ 640 TE0 and WL series is based upon a state-of-the-art uncooled InGaAs detector with 640×512 pixels and 20 μm pixel pitch. The WL version uses a special windowless sensor package for laser beam analysis applications. The camera offers superior, high-resolution SWIR imaging capabilities, comes in a versatile and industry-proven Wildcat camera package (GenICam compliant) and offers advanced on-board image processing.The Wildcat+ 640 TE0 and WL cameras output full frame images at 220 Hz via either a CameraLink or USB3 Vision interface.The Wildcat+ 640 TE0 and WL is suitable for semiconductor inspection, display inspection (mobile phone and TV), microscopy and laser beam analysis.Benefits & Features- Compact and industry-proven camera design- High resolution SWIR imaging- Advanced on-board image processing performance- GenICam complaint- Flexible optical mount and lens options
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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NplusT -
Saniffer
NplusT was created in December 2002 by Tams Kerekes' 20-years experience in the field of electrical semiconductors and reliability testing.The company started with the sales representation of semiconductor equipment and consumable suppliers. In the meantime, qualified engineering services, linked to the represented products, were provided in Europe.In 2003 NplusT started to market "RIFLE", the non-volatile memory engineering tester, and related services. In a few years, this product has become a reference platform for many memory makers.In 2005 Liliom Laboratories, a Hungarian software development company, merged into NplusT. Thanks to this operation, the company became leader in the test data collection and processing segment.From 2008 a dominant portion of NplusTs turn-over derived from licensing software products. Today almost every European along with several Far East semicon companies license our software products and make use of qualified engineering services.From 2011, NplusT provides turn-key solutions for device testing and characterization, including hardware, software and support.
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EV Group
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Fairview Microwave Inc.
Our lines of high frequency VNA test cables display excellent electrical properties such as wonderful phase stability of +/- 6° at 50 GHz and +/- 8° at 67 GHz as well as VSWR of 1.3:1 at 50 GHz and 1.4:1 at 67 GHz. The 50 GHz assemblies are terminated with 2.4mm connectors while the 67 GHz versions utilize 1.85mm connectors. The braided stainless steel armoring surrounding the coax provides a rugged, but flexible cable with a flex life exceeding 100,000 cycles, making these test cables ideal for use in semiconductor probe testing, precise bench top testing as well as lab/production testing where the need for a highly flexible, yet durable cable solution is required. The VNA test cables are also equipped with rugged stainless steel connectors that provide up to 5,000 mating cycles when attached with proper care. Additionally, the flexibility of these cables makes it easier and safer to test a Device Under Test (DUT). A swept right angle 2.4mm and 1.855mm connector option allows these cables to fit in tight spaces and can reduce the length of cable required in many applications.
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Klocke Nanotechnik
In light microscopy it is natural to use toolsets like tweezers, knives, probes and several different measurement tools. Without this many present-day products and methods would not exist. The operators of SEM/FIB-Systems generally work without toolsets, although the wavelength limit of light is no physical boundary. It can be imagined how technology would be pushed when a SEM/FIB Workbench reaches the same degree of practicability and utilization as toolsets for light microscopes. The Nanoworkbench is the first system substituting the eye-hand coordination effectively with nm precision in a SEM/FIB-system. The Nanoworkbench features a set of applications including TEM lamella preparation, nano probing, nano cutting, nano cleaning, force distance measurement, particle sorting and material preparation. Every application supports automated processes so almost no user interaction is needed. Even complex processes can be done within seconds and even by untrained users. Applications can be combined to create new and more complex processes. Expanding the SEM/FIB to a material processing system and a nano-analytical workbench by utilizing the Klocke Nanoworkbench enables new applications in research and production of material research, live sciences, tribology, environmental & forensic research and semiconductor technology.
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AX92351 -
Axiomtek Co., Ltd.
The AX92351 is a 64-ch isolated digital I/O PCI Express card with 2,000VDC isolation protection. This high-density digital I/O card with high-speed PCI Express x1 bus is excellent for use in applications requiring digital control or monitoring, such as semiconductor machinery, PC-based industrial machinery, programmable I/O logic control, and process status monitoring. The AX92351 features 32 isolated digital input channels and 32 isolated digital output channels with isolation protection of 2,000V for industrial applications where high-voltage isolation is required. It is equipped with a board ID feature for easy identification of multiple cards in single system. There is a digital filter function to prevent input signals from carrying noise or a chattering. Each isolated input has a sink or source current which supports dry and wet contact for maximum application flexibility. The card has a wide range of input voltage from 10 to 30V to meet most industrial application needs. The AX92351 also provides two interrupt sources on digital input channels. Digital output has open controller and supports maximum 30VDC. The read-back function is another useful function that allows monitoring each output port.
