Showing results: 136 - 150 of 1599 items found.
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DB9TWX67 -
Andor Design Corp.
The DB9TWX67 is an adapter for converting the DB9 outputs of ANDOR Design’s MIL-STD-1553 cards to the Twin Axial connector used in MIL-STD-1553. Two adapters are supplied with each dual redundant channel card.
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Mountz Inc.
Testing power torque tools is essential for product quality and regulatory compliance. A run down adapter is designed is to simulate the fastening process of a screw. Mountz run down adapters improve testing repeatability by adjusting for the impact force and irregular peaks of power tools. Mounted in-line between the tool's driver and transducer, a run down adapter provides consistent and reliable torque readings.
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INGUN Prüfmittelbau GmbH
Vacuum test adapters (VA) are suitable for contacting electronic assemblies with large quantities (mass testing) and a small number of variants. INGUN vacuum test adapters are available as standard as a single system without an exchangeable replacement kit.
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2450-CAL-30 -
The Eastern Specialty Company
The MTB Calibration Adapter (Catalog No. 2450-CAL-30)is a socket adapter that’s designed to bring phase A, B, and C current and potentials of a TESCO Multi-Position Test Board to an external RD-30 reference standard for calibration of the Test Board.
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RAMCHECK Sync -
INNOVENTIONS, Inc.
The RAMCHECK Sync Chip Adapter tests popular TSOP SDRAM memory chips in sizes of 16Mx16, 4Mx16, 32Mx8, 8Mx8, 64Mx4, 16Mx4 and more. Picture above shows the adapter with all optional sockets for 54, 50 and 44-pin.
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Giga-snaP™ -
Ironwood Electronics
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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PSAT -
ATEQ Aviation
PSAT UNIVERSAL Ps is a static adaptor for virtually ANY KIND OF AIRCRAFT.PSATUNIVERSAL Ps is very easy to use on the plane: power ON the Succion Unit place the Universal adapter on the aircraft and adjust the Ps port release the Security Valve (blue): You are ready to test your static port !Pneumatic insulation is made with rubber tube. PSAT UNIVERSAL Ps is fittedwith a quick connector, which allows to use the adaptor as a cap for special tests.
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Series 651000 -
Aries
SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
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Series 351000 -
Aries
SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
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3390 -
Technobox, Inc.
PMC to PCI adapter - permits operation of PMC in a PCI slot for engineering development
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INGUN Prüfmittelbau GmbH
Pneumatic test adapters from INGUN are particularly suitable for contacting medium-sized electronic assemblies (series testing) and a large number of variants. The test adapters are designed as a replacement kit system, are connected to an existing test system and operated with replacement kits that are specially designed for the electronic assembly to be tested.