Showing results: 271 - 283 of 283 items found.
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MTI Instruments
MTI Instruments offers high resolution capacitance sensors, probes and systems that generate low noise, highly accurate and high stable measurements. Our Capacitance sensor line-up offers accurate measurements for automated inspection applications such as thread quality inspection, disk drive run-out, leveling or flatness measurement, lens alignment, tire run-out and bulging. Our Accumeasure capacitive sensors offer large stand-off distance that includes single and multiple channel rack systems that connect up to 10 capacitive sensors or capacitance probes with individual analog measurement outputs. We also offer cost-effective customized capacitive sensor amplifier board and probe system for easy integration. Our inspection systems linearity exceeds 0.01% full scale measurement (FSM) and resolution to sub nanometers.
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LumiSun-50 -
Innovations In Optics Inc.
The LumiSun-50™ is a high power, multi-wavelength LED solar simulator that meets IEC 60904-9 Class AAA for spectral match, uniformity of irradiance, and temporal stability. The LumiSun-50 achieves a spatially uniform illumination field from a chip-on-board (COB), multiple-wavelength LED die array. The field of illumination is 50 x 50 mm at a working distance of 200 mm. The LumiSun-50 includes a driver/controller which individually provides constant current to each die in the COB array. Total irradiance of 1.1 sun units is provided and can be decreased to 0.1 suns. The LED light source of the LumiSun-50 is contained within an air-cooled housing that can rotate the angular beam alignment. Adjustment and setting of the optimum light path working distance is visually facilitated by a converging pair of red dot laser pointers.
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ficonTEC Service GmbH
Our machines employ industry-proven production technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and automated optical inspection. ficonTEC also provides a suite of test capabilities for individual components and hybrid opto-electronic devices, both on and off-wafer. Moreover, with everything being orchestrated by our flexible PROCESS CONTROL MASTER software, the machine platforms and product lines described below become so much more than just the sum of their parts. The technologies and capabilities implemented in all machine platforms translate into a broad and established spectrum of production process expertise. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet and exceed efficiency and yield requirements even for cutting-edge production processes. For the team here at ficonTEC, we face your challenges every day.
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TA-3320 -
Tech-Aid Products
This NAV test fixture is specific to the requirements for testing Becker Avionics NAV, RMI and RMU products. The panel incorporates specific functionality required for testing these Becker products by the book including special requirements for the RMU 5000 and the IN 3300 series of nav indicators. This BAEE NAV test fixture also facilitates resolver alignment and discrete meter testing through the PG 3300 interface connector. The RM 3300 portion of the panel tests the Becker RMI indicators and allows for sourcing the composite signal from the paired radio or from an external generator. The DME channeling outputs are monitored with discrete LED's as well as the ILS, V/LOC, Glideslope and NAV TEST valids. Discrete test jacks are provided for all the meters and the resolver of the NAV indicator and a dimming source is also provided. When testing the RMU 5000 computer access is through a dedicated connector.
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Ironwood Electronics
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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CIS -
Nidec SV Probe Pte. Ltd.
CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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OPTOKON HMA -
OPTOKON a.s.
The OPTOKON HMA optical modules are designed for connection of the nodes of harsh environmental network by the help of cables with optical fibers. The used „Expanded beam technology“ preserves all advantages of signals transmission through the optical lines in field harsh environmental conditions. Benefiting from expanded beam technology, with a long and proven industry track record, the precision optical alignment system creates immunity from water, mud, dust, oil and other contaminants. The HMA Hermaphroditic coupling eliminates the need for adaptors and male and female mating halves. Hermaphroditic housings allow for rapid deployment, creating low loss Single mode, Multimode and Hybrid daisy chained links in a variety of planforms ranging from simplex fiber to a copper Hybrid. The OPTOKON HMA is ideally suited for environmental extremities where low maintenance and quick repairabilty is necessary, the connectors are uniquely field installable and rapidly field repairable.There are two different types of OPTOKON HMA connection modules:
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Model 7123 -
Chroma ATE Inc.
Luminance and chromaticity measurement of Color Display0.005 cd/m2low luminance measurement (A712301)Wide luminance range: 0.0001 to 25,000 cd/m2 (A712301) 0.01 to 200,000 cd/m2 (A712302)High accuracy measurementMaximum 9 display modes: xyY, TΔuvY, u’ v’ Y, RGB, XYZ, Contrast, ProgramAble to control Video Pattern Generator and UUT (Unit Under Test)Built-in contrast measurement function to calculate the contrast ratio directlyEquipped with programmable test items that can complete the planned tests with one single buttonSupport USB flash disk that can copy the test procedures to other station for useJudgment function embedded to judge the test result automatically with one single buttonCalibration period setting and reminding functionMemory for storing 100 channels of standard color data and calibration dataBuilt-in flat display calibration data LCD-D65 & LED-D65* to be applied for chromaticity measurement instantlyOptional display white balance alignment system can be used to integrate all optical test stations to one single station
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Ironwood Electronics
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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HMA-J -
OPTOKON a.s.
The OPTOKON HMA-J connector series, a medium size „Expanded Beam“ connector is designed for connection of the nodes of harsh environmental network by the help of cables with optical fibers. The used expanded beam technology preservers all advantages of signals transmission through the optical lines in field harsh environmental conditions. Additionally to ruggedized optical networks the HMA-J is suited for a vast array of applications, like heavy industry connections, petrochemical application, broadcasting temporary optical lines. The innovative designs ensure its ability for deployment in the toughest environments where high performance and total reliability are critical. Benefiting from expanded beam technology the precision optical alignment system creates immunity from water, mud, dust oil and other contaminants. The HMA-J Hermaphroditic coupling eliminates the need for adaptors and male and female mating halves. Hermaphroditic housings allow for rapid deployment, creating low loss Singlemode and Multimode daisy chained links in a variety of planforms ranging from simplex fiber to a four fibers. The OPTOKON HMA-J is ideally suited for environmental extremities where low maintenance and quick repairability is necessary.
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HMA-M -
OPTOKON a.s.
The OPTOKON HMA-M connector series, a mini size „Expanded Beam“ connector is designed for connection of the nodes of harsh environmental network by the help of cables with optical fibers. The used expanded beam technology preservers all advantages of signals transmission through the optical lines in field harsh environmental conditions. Additionally to ruggedized optical networks the HMA-M is suited for a vast array of applications, like heavy industry connections, petrochemical application, broadcasting temporary optical lines. The innovative designs ensure its ability for deployment in the toughest environments where high performance and total reliability are critical. Benefiting from expanded beam technology the precision optical alignment system creates immunity from water, mud, dust oil and other contaminants. The HMA-M Hermaphroditic coupling eliminates the need for adaptors and male and female mating halves. Hermaphroditic housings allow for rapid deployment, creating low loss Singlemode and Multimode daisy chained links in a variety of planforms ranging from simplex fiber to a four fibers. The OPTOKON HMA-M is ideally suited for environmental extremities where low maintenance and quick repairability is necessary.
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Solo 365 -
Detectortesters
The fire industry’s most popular range of detector test equipment is about to get even better. Solo, the test equipment used world-wide to functionally test fire detectors has a new tester in its range – Solo 365. This exciting innovation provides fire safety professionals with an array of stand-out features which make for faster, simpler and cleaner functional testing of smoke detectors. Key features include automatic generation of smoke which ensures only the amount of smoke needed to activate the detector is produced – minimizing smoke wastage and eliminating the risk of detector contamination. In addition, Solo 365 is light in weight and has a slim-line design which allows easy access into tight spaces – making it possible to test detectors which are hard to access with other portable testers. In response to market feedback, Solo 365 features an LED torch which automatically illuminates when light levels drop, making for easy detector alignment and testing in dark environments. Smoke is generated via newly designed smoke cartridges which fit neatly into the rear of the tester. With no reliance on pressurised aerosol cans, the cartridges can be easily shipped and stored and are unaffected by new regulations, set for 2018, which will affect availability of some pressurised smoke aerosols.
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Xeltek
※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput:4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning:Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers: 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices:Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time:I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software:Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control:Remote project loading, quality monitoring, volume control, file security.