Showing results: 46 - 60 of 80 items found.
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Quadra 3 -
Nordson Corporation
Quadra™ 3 is your partner for high quality X-ray inspection for production line quality control. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening. High quality, high magnification inspection for product applications.
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MC889 -
Manncorp
The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
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Series S200, S300, S400, and S500 -
AlphaTest Corp.
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Ironwood Electronics
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Ironwood Electronics
Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Columbia Elektronik AB
Most defects in circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition of to lead free soldering, a whole new spectra of problems have emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits, are failure modes that has increased in frequency since the transition to lead-free soldering.
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Z-Axis Europe
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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CrossLinkPlus -
Lattice Semiconductor
*Instant-on (< 10 ms) configuration with integrated flash memory*Integrated flash enables flexible reprogramming in the field*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per port*11 programmable, source synchronous I/O pairs for camera and display interfacing*Available in small 3.5 mm x 3.5 mm BGA package with 0.4 mm pitch*Comprehensive library of IP and reference designs, compatible with CrossLink
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Analog Devices Inc.
Analog Devices buffered video crosspoint switches offer multiple configurations from 8x8 up to 32x32 channels with gain of 1 or 2 and are offered in LQFP, LFCSP, and BGA packages. These crosspoint switches can be programmed either in serial or parallel modes and are used primarily for routing high speed signals, including composite video (NTSC, PAL, SECAM) and component video (YUV, RGB) in applications such as studios, video on demand, in-flight entertainment, surveillance, and video teleconferencing.
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LatticeXP2 -
Lattice Semiconductor
*Up to 885 Kbits sysMEM™ embedded block RAM and up to 83 Kbits distributed RAM*sysCLOCK™ PLLs up to four analog PLLs per device that enable clock multiply, divide and phase shifting*Three to eight sysDSP blocks for high performance multiply and accumulate.*Pre-engineered source synchronous IOs for DDR/DDR2 up to 200 MHz and 7:1 LVDS interface support up to 600 Mbps*Available in csBGA, TQFP, PQFP and BGA packaging
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TopLine Corp.
Daisy Chain provides engineers with a simple tool to learn valuable information about causes of failures. Such failure analysis paves the way for scientists and engineers to improve assembly processes. Critical applications involving environmental life cycle testing require daisy chain packages with dummy silicon die. The Daisy Chain permits electrical continuity testing, while the dummy silicon die replicates the thermal mass of a "live" device. Si Die, QFN, Lead Frame Packages and BGA devices and more.
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MachXO3 -
Lattice Semiconductor
*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch
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National Technical Systems
Fourier Transform Infrared Spectroscopy (FTIR) is a standard technique used in the identification of contaminating materials on the surface of printed circuit boards (PCBs) and around the leads of electronic components (BGA, capacitors, resistors, inductors, connectors, diodes, oscillators, transformers, IC, etc.) on printed circuit assemblies (PCAs). Additionally, FTIR can be used for “simpler” identifications, such as determining a specific type of plastic or rubber compound.
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National Technical Systems
Fourier Transform Infrared Spectroscopy (FTIR) is a standard technique used in the identification of contaminating materials on the surface of printed circuit boards (PCBs) and around the leads of electronic components (BGA, capacitors, resistors, inductors, connectors, diodes, oscillators, transformers, IC, etc.) on printed circuit assemblies (PCAs). Additionally, FTIR can be used for “simpler” identifications, such as determining a specific type of plastic or rubber compound.
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MXE-5600 Series -
ADLINK Technology Inc.
*9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset*Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory*Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0*2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0*Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280