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Showing results: 46 - 60 of 163 items found.

  • 3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade

    cPCI-3630 - ADLINK Technology Inc.

    The ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.

  • 6U CompactPCI 6th/7th Gen Intel® Xeon® E3 and Core™ i3/i7 Processor Blade

    cPCI-6636(KL) Series - ADLINK Technology Inc.

    The ADLINK cPCI-6636 Series is a 6U CompactPCI® processor blade based on the 6th/7th Generation Intel® Xeon® E3 and Intel® Core™ i3/i7 Processors with Intel® HM170 or CM236 Chipsets. The cPCI-6636 supports up to 16GB onboard DDR4-2133 memory and 16GB DDR4-2133 via SODIMM. Total memory capacity is up to 32GB of DDR4-2133. The cPCI-6636 is a highly integrated processor blade fit for mission critical applications in industries ranging from automation to defence.

  • Rugged Conduction Cooled 6U CompactPCI Processor Blade with 4th Gen Intel® Core™ i7

    CT-6530 - ADLINK Technology Inc.

    The CT-6530 is a rugged conduction cooled 6U CompactPCIR processor blade in single-slot (4HP) width form factor featuring enhanced graphics, computing power, energy efficiency, system manageability and data security provided by the 4th generation IntelR Core? i7/i5 processor (4C/2C), and soldered DDR3L-1600 ECC memory up to 8GB. The CT-6530 supports -40ºC to +85ºC operating temperature range at wedge locks, offers outstanding performance and is an ideal solution for mission-critical defense and aviation applications.

  • Rugged 3U VPX 3rd Gen Intel® Core™ i7 Processor Blade for Radar or ISR

    VPX3001 - ADLINK Technology Inc.

    The VPX3001 Series is a 3U VPX processor blade featuring the 3rd Generation Intel® Core™ i7 processor with Mobile Intel® QM77 Express Chipset. The VPX3001 provides up to 8GB DDR3-1066/1333 dual channel ECC memory soldered onboard, one PCI Express x8 XMC.3 site with VITA 46.9 rear IO, and onboard soldered 32GB SLC SATA solid state drive. Rear I/O via P1 and P2 includes 2x 1000BASE-T or 2x 1000BASE-BX (BOM option), 1x SATA 6 Gb/s, 1x SATA 3 Gb/s, 2x USB 2.0, 6x GPIO, VGA, 1x RS-232, and 1x RS-232/422.

  • Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade

    VPX3020 - ADLINK Technology Inc.

    *Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)*DDR4-2666 soldered ECC SDRAM up to 16GB*Optional SATA SLC SSD, up to 64GB*Up to PCIe x16 Gen3 interface supporting non-transparent bridge

  • SOSA-aligned, Rugged 3U VPX Processor Blade with Intel® Xeon® W-11000E

    VPX3-TL - ADLINK Technology Inc.

    ADLINK VPX3-TL 3U VPX processor blade is powered by Intel® Xeon® W-11000E Series Processor, formerly Tiger Lake-H and delivers a greater than generational improvement in performance for enhanced data and graphics and the AI acceleration capabilities required for next-generation mission-critical applications. The SOSA-aligned design of the VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, highly cost-effective, and quick to develop and deploy.

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6314 - Advantech Co. Ltd.

    The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.

  • 3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade

    MIC-3332 - Advantech Co. Ltd.

    MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.

  • Rugged Conduction Cooled 3U CompactPCI 4th Generation Intel® Core™ i7 Processor Blade with ECC (Formerly Haswell)

    CT-3510 - ADLINK Technology Inc.

    The ADLINK CT-3510 Series is a rugged conduction cooled 3U CompactPCI® PlusIO compatible processor blade in single-slot (4HP) with soldered DDR3L-1600 ECC memory up to 8GB. The ADLINK CT-3510 features an Intel® Core™ i7 processor with Mobile Intel® QM87 Express Chipset.

  • 3U CompactPCI Serial Processor Blade with 6 COres/12 Thread Core i7 and Xeon Processor

    MIC-330 Series - Advantech Co. Ltd.

    MIC-330 is a 3U CompactPCI® serial processor blade with 6 cores/12 thread Core™ i7 and Xeon® processor and configured with Intel® CM246 PCH to support dual-channel 32GB DDR4-2666, up to 16GB on board memory for rugged applications, and another 16GB are available via the SO-DIMM socket for expansion.

  • 3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family

    MIC-6330 - Advantech Co. Ltd.

    Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.

  • 3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade

    cPCI-A3525 Series - ADLINK Technology Inc.

    CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.

  • 6U CompactPCI 5th/4th Generation Intel® Core™ Processor Blade with two PMC/XMC sites

    cPCI-6530(BL) Series - ADLINK Technology Inc.

    The cPCI-6530(BL) Series is a 6U CompactPCI processor blade in single-slot (4HP) width form factor featuring enhanced graphics, computing power, energy efficiency, system manageability and data security provided by the 5th/4th generation Intel Core i7/i5 processor (4C/2C), and soldered and socket type DDR3L-1067/1600 ECC memory up to 32GB. The cPCI-6530(BL) offers outstanding performance and is an ideal solution for defense, aviation, transportation and industrial applications.

  • Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor

    CT-3620 - ADLINK Technology Inc.

    The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).

  • 6U CompactPCI 4th Generation Intel® Core™ i3/i5/i7 Processor Blade with ECC support

    MIC-3396 - Advantech Co. Ltd.

    Using 4th generation Intel® Core™ i3/i5/i7 processors based on 22nm process technology supporting up to four cores / eight threads at 2.4GHz and 6MB last level cache, the MIC-3396 blade boosts computing performance deploying the latest virtualization, techniques and CPU enhancements. Onboard soldered low voltage DRAM (1.35V) with ECC support and optional memory expansion via an SODIMM socket extend the memory to a maximum of 16GB supporting the most demanding applications in high performance or virtualized environments. Dual channel design and memory speeds up to 1600MT/s along with increased cache size and cache algorithms guarantee maximum memory performance. Combined with the powerful Intel® QM87 chipset, the 4th generation Intel® Core™ processors offer improved I/O performance by leveraging 5GT/s DMI and 3rd generation PCIe interfaces. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines such as the MIC-3666 dual 10GE XMC card. With SATA-III support and up to 7Gbps I/O. the latest enhancements in storage technology such as high speed SSDs or traditional HDDs can be used on the MIC-3396. Five gigabit Ethernet ports based on Intel® GbE controllers for front and rear,including two PICMG 2.16, ensure best in class network connectivity The processor’s integrated enhanced graphics engine (Iris) offers twice the performance over previous generations. With triple independent display support, the MIC-3396 is an ideal fit for demanding workstation applications. RASUM features integrated in the CPU and chipset combined with PICMG 2.9, IPMI-based management make the MIC-3396 a highly available and reliable computing engine. The RIO-3316 RTM module supports one PS/2 connector with both keyboard and mouse ports, one USB 3.0, two USB 2.0 ports, two RS-232 ports, two SATA ports, two DVI ports, and two Gigabit Ethernet ports. In case of the SATA disk drives and SATA RAID support of the QM87 do not meet performance and reliability requirements, the RIO-3315 SAS version supports a 4-port SAS controller with RAID and fail over support.

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