Showing results: 2791 - 2805 of 3415 items found.
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PICO842 -
Axiomtek Co., Ltd.
The PICO842, an extreme-compact fanless pico-ITX motherboard, is designed to support the Intel® Celeron® processors quad-core J1900 and dual-core N2807 (codename: ). Its system memory supports up to 8GB of DDR3L. The extreme compact-size fanless embedded board supports dual display outputs through HDMI or VGA, and 18/24-bit single/dual channel LVDS. With improved media and graphics performance, the Axiomtek PICO842 is suitable for any graphics, imaging, and video intensive application. Its ultra slim size also makes it perfectly suitable for IoT, medical, automation, and embedded systems.
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PCIE-5565PIORC -
Abaco Systems Inc
The PCIE-5565PIORC low profile PCI Express (PCIe) Reflective Memory node card provides a high-speed, low latency, deterministic interface that allows data to be shared between up to 256 independent systems (nodes) at rates up to 170 Mbyte/s. Each Reflective Memory board may be configured with 128 MB or 256 MB of onboard SDRAM.The local SDRAM provides fast Read access times to stored data. Writes are stored in local SDRAM and broadcast over a high speed fiber-optic data path to other Reflective Memory nodes.
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8900 -
Georg Fischer Signet
The Signet 8900 Multi-Parameter Controller takes the concept of modularity to the extreme. Each 8900 Controller is field-commissioned with the users-specified combination of inputs, outputs, and relays using simple-to-install modular boards into the base unit. Configure the system by selecting either two, four, or six input channels which accepts any of the Signet sensors listed below, and/or other manufacturer's sensors via a 4 to 20 mA signal converter (Signet Model 8058). To complete your unit, choose a power module with universal AC line voltage or 12 to 24 VDC.
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AMG8833 (Qwiic) -
SparkFun Electronics
Get ready to be able to see like the Predator! The SparkFun Grid-EYE Infrared Array Breakout board is an 8x8 thermopile array, meaning you have a square array of 64 pixels capable of independent temperature detection. It’s like having a thermal camera, just in a lower resolution. To make it even easier to to get your low-resolution infrared image, all communication is enacted exclusively via I2C, utilizing our handy Qwiic system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.
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SparkFun Electronics
Have you ever wanted to control something powerful or have you ever needed to turn on/off a high power device from your Arduino or another low powered microcontroller? The SparkFun Qwiic Single Relay provides you with the easiest to use relay yet. The Single Relay board can handle up to 5.5A at 240VAC for long periods of time and allows you to control large power loads with simple I2C commands. Utilizing our handy Qwiic system, and on-board screw terminals, no soldering is required to connect it to the rest of your system!
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GX7927 Series -
Marvin Test Solutions, Inc.
The GX7927 is a Single Board Computer (SBC) that features the high performance, highly integrated Core i7 processor platform from Intel. Core i7 offers an integrated graphics and memory controller plus dual core processing, operating at speeds up to 2.53 GHz. Coupled with the Mobile Intel QM57 Express Chipset, the GX7927 provides an unmatched level of I/O bandwidth for both onboard and off-board functions. The module is supplied with 4 GB of DDR3 SDRAM and 16 GB of NAND Flash memory. Both standard and extended temperture operation range versions are available.
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JT 2147/eDAC for MAC Panel -
JTAG Technologies Inc.
The JT 2147/eDAK is a new variant of the JTAG Technologies QuadPOD signal conditioning interface specifically designed for use within a MAC Panel ‘Scout’ mass interconnect interface. The unit integrates both the JT 2148 transceiver circuitry plus four independent, programmable TAP modules (two of type JT 2149 and two of type JT2149/MPV) on a single board that matches the MAC Panel Direct Access Kit (DAK) form factor. Overall this configuration offers four Test Access Ports, 64 Digital IO Scan channels and reconfigurable (SCIL) capabilities
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ADF-D2000 -
Delphi Engineering Group, Inc
This FPGA Mezzanine Card (FMC) converts two channels of up to 2.8GHz analog input bandwidth at 1.0, 1.6, 1.8, or 2.0 Gsps and 12-bit resolution. Additionally, this FMC can be used in an interleaved mode to convert a single channel at 2.0, 3.2, 3.6, or 4.0 Gsps and 12-bit resolution. Based on the VITA 57 specification, the ADF-D1600 enables direct coupling of unparalleled analog-digital conversion capability with the VME/VXS/AMC/VPX/PCI-E carrier board of your choice. DEG engineers have designed this product and associated HDL firmware to work with both Altera and AMD FPGAs.
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Virginia Panel Corporation
VPC's Snap-In-Modular (SIM) inserts offer multiple protocols, but share the same footprint, making them all compatible with VPC's 90 Series SIM module, iSeries SIM module, and i2 MX SIM model.SIM Infinity® inserts revolutionized the way PCB connections were made to the board with pass-thru technology and the ability to intermix multiple protocols in one module. SIM wired inserts expand that technology by offering even more protocols including micro coax, micro power, QuadraPaddle and VTAC; and coming soon, 20/26 GHz coax.
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HDPMU -
Salland Engineering
Today cost efficiency is more important than ever. Many manufacturers are working on maximizing multi-site testing. Often maximization can’t be done because of limited tester resources. Salland’s HDPMU gives you up to 192 additional independent parametric measurement units (PMU) channels on a single board. Our solution will increase parallel testing without the need for creating complex device interface board (DIB). It can be used for continuity, functional or parametric tests or simply for device setup or loading. Full integration with the Teradyne IG-XL™ Software, easy set-up and high parallel measurement capability will reduce test costs significantly.
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Acces I/O Products, Inc.
A small form factor embedded computer board, typically intended for use in small, space-constrained industrial control or vehicles systems. The standard size of these modules is just 3.550 × 3.775 inches (90 × 96 mm). The name PC/104 comes from the original IBM computer known as the "PC", and the number of pins used to connect the cards together (104). PC/104 boards are typically stacked on top of each other using stackable bus connectors and four mounting holes at the corner of each module. This provides a much more rugged, embedded computer that can be used in harsh environments such as those found in military or industrial applications.
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ScanExpress JET -
Corelis, Inc.
Functional circuit board testing presents many challenges that are often costly and time consuming. Most functional tests need to be customized for each design, limiting reusability. This results in software engineers vying for time between development code and test code. Even when functional tests become available, the diagnostic details are often inadequate to give clear visibility on a given problem.ScanExpress JET is a tool designed to overcome these challenges by automating the functional test generation process on CPU–based IEEE-1149.1 compliant circuit boards. Coined JTAG Embedded Test, JET is the preferred method for at-speed, non-intrusive functional testing.
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Neff Instrument Corporation
Identified by its ADC per channel and on-board memory, it typically operates at per channel sampling rates which in aggregate would overwhelm any communication system. Data is stored on board during a test and transmitted to a host computer following completion.
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605-00007 -
Parallax Inc.
The CO Gas Sensor is used in gas detection equipment for detecting Carbon Monoxide in home, automotive or industrial settings. When paired with our Gas Sensor Board (#27983) it provides a development system and test platform for CO gas sensor design.
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TestStation LX2 -
Teradyne, Inc.
TestStation LX2 is Teradyne's largest pin count in-circuit test system. Configurable up to 15,360 pins, TestStation LX2 utilizes the new UltraPin II 128HD pin card for testing large, complex, and heavily-integrated printed circuit board assemblies.
