Showing results: 361 - 375 of 582 items found.
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AVIOR Series -
MPI Photonics Automation
The MPI AVIOR series offers a broad lineup of high performance prober systems targeting the Optical Communications market. Our prober systems are available in Top emitting (TP), Flip chip (FP) emitting and Die/Package (DP) configurations to meet your specific test requirements. Whether it be R&D or mass production, MPI has a solution that will meet your needs for accurate and reliable measurements in conjunction with a reduced cost-of-test.
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LEC-BW -
ADLINK Technology Inc.
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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cPCI-8554 -
ADLINK Technology Inc.
- PICMG 2.0 Rev 3.0- Four 82C54 programmable timer/counter chips- Up to 12-CH 16-bit timer/counter- 1-CH 32-bit cascaded timer based on 8 MHz clock source- Four programmable clock sources for each timer/counter- Programmable de-bounce filters for external clock & external interrupt inputs- 8-CH TTL digital inputs & 8-CH TTL digital outputs- +12 V and +5 V power available on the connector
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ETF-SERIES -
Envisys Technologies
Precise Temperature Accuracies with Reliable Test Results Temperature Limits: -40/-60 °C to 30 °C Temperature Accuracies: ±2-3°C Temperature Rate of Change: 20-25 deg /min (Non-linear) Maintenance Free Access to The System Self-Sufficient System Compact with small footprints suitable for any space constraint laboratories Low decibel system Suitable for testing electronic chips / devices Environmentally friendly refrigerants Efficient heating Microprocessor based single set point PID temperature controller with data logging Flexible hose up to 2.5-3.0m Interchangeable heads according to chip size. Inbuilt electrical control panel with switchgear system
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HPX1S -
Manncorp
Produce high-quality semiconductor chips in your manufacturing facility with our HPX1S Die Attach Machine. This die bonding machine is great for high-accuracy, low-volume, die attach manufacturing needs. Customization options are also available for unique applications. It is equipped with 3 sets of CCD cameras and a bottom camera to help with component alignment. Easily and accurately handle die sizes from 1.4 x 1.4 mm to 7 x 7 mm.
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PCIe-DIO-120 -
Acces I/O Products, Inc.
This product is a x1 lane PCIe DIO board available in economy to high-performance models ranging from basic 72-, 96, and 120 DIO lines to advanced COS detection. The card emulates 8255 compatible chips using FPGA technology, providing up to 120 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs.
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TySOM -
Aldec, Inc.
The TySOM Embedded Development Kit is for the embedded designer who needs a high-performance RTL simulator/debugger for their embedded applications such as IoT, Factory Automation, UAV and Automotive. The kit includes Riviera-PRO Advanced Verification Platform and a Xilinx Zynq development board that contains single Zynq chip (FPGA + Dual ARM Cortex-A9), memories (DDR3, uSD), communication interfaces (miniPCIe, Ethernet, USB, Pmod, JTAG) and multimedia interfaces (HDMI, audio, CMOS camera).
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PCIe-DIO-24HC -
Acces I/O Products, Inc.
This product is a x1 lane PCIe DIO board with basic DIO, Counter/Timers and interrupt generation capabilities. The card uses an 8255 compatible chip, providing 24 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs. Port C is further broken into two 4-bit nybbles via software, configured as either inputs or outputs.
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Arasan Chip Systems, Inc.
Arasan Chip Systems provides a complete suite of USB-compliant IP including low speed, high speed and super speed USB products. Arasan became a member of the USB-IF standards body in 1996 and delivered its first USB 1.0 IP product in that year. The offering expanded to USB 2.0 products in 2000 and USB 3.0 products in 2009. Arasan's customer base includes many major systems and SoC companies in variety of industries.
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Cadence Design Systems
Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges. This has given way to a viable alternative of exploring the third dimension in design and manufacturing: 3D-ICs with through-silicon vias (TSVs).
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Express-DN7 -
ADLINK Technology Inc.
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Analog Devices Inc.
Analog Devices Automotive Audio Bus (A2B®) technology provides critical support to the vehicle infotainment systems of tomorrow. Our A2B products deliver high fidelity audio while increasing fuel efficiency, thanks to upward of 75% less cabling weight. The A2B portfolio helps enables multiple applications such as voice recognition and active noise cancellation. A2B is a single-master, multiple-slave system where the transceiver chip at the host controller is the master.
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Teledyne Labtech
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Concept Engineering GmbH
GateVision PRO is the third generation of graphical gate-level netlist analyzers and netlist viewers from Concept Engineering. Please check out the Demo Video: Basic Features. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips and SoCs with intuitive design navigation, netlist viewing, waveform viewing, logic cone extraction, interactive logic cone viewing for netlist debugging and design documentation.
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Teledyne Defense Electronics
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.