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Showing results: 31 - 45 of 48 items found.

  • Semi-Automatic Probe Station

    P300A - The Micromanipulator Company

    The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.

  • Tabletop Front & Backside Mask Aligner

    Model 200IR - OAI

    The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.

  • ECHO VS System with Image Enhancement

    Echo VS - Sonix Inc.

    The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.

  • High Frequency/Microwave

    SemiProbe

    SemiProbe high frequency probing solutions provide a broad array of capabilities for measurements ranging from DC to over 300 GHz. We design PS4L systems for high frequency applications with carefully selected components including chucks, probe arms, probes, cables, tuner modules, and calibration suites that are optimized for the frequency range that the application will operate in.

  • Fully Automatic Rubber Tensile Testing System

    Shimadzu Corp.

    Compactly Integrating Functions Required for Quality Control of Rubber Shimadzu Fully-Automatic Tensile Testing System This system provides full automation, from measurement of specimen dimensions, supply to the testing machine, and fixing of chucks to measurement of extension between standard lines and data processing. The system can be used for continuous nighttime testing, which helps save labor costs.

  • Optical Fiber Identifier

    OrienTek Optical Technology Ltd.

    Optocal Fiber Identifier Economical Solution for Integrated Fiber Preparation Tool Demand● 4 easy-change chucks for:bare fiber, patch cords & ribbon fiber● Identifies 3 common test tones● Identifies dominant traffic direction, audible alarm● Approximate core power reading● Low false detection & insertion loss● Very easy to operate● Battery low indication

  • Coordinate Measuring Machines

    ScopeCheck® V - Werth Inc.

    Precise measurement of cylindrical workpieces (tools, shafts etc.) using application-specific sensors in a production environmentHeavy duty granite base with CNC air bearing rotary axisIntegrated vertical rotary axis for rapid measurement of diameters, planes, holes, and cutting and clearance angles with optical and tactile sensorsAll industry standard tool holders and chuck systems are available on the rotary axisUnique design allows easy integration of additional sensors for increased flexibilityProtected enclosure for measurement on the production floor

  • Probe System for Life

    PS4L - SemiProbe

    The Probe System for Life, or PS4L, is SemiProbe’s patented adaptive probe system architecture. Unlike traditional probe systems, all of the basics components of our systems, including the bases, stages, chucks, microscope mounts, and manipulators, are interchangeable, upgrade-able, and configurable. The PS4L Adaptive Architecture ensures and optimal test configuration for each individual customer application.

  • Pyroelectric and Thermal Testing

    Radiant Technologies, Inc.

    The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.

  • Probing Solutions

    ES62X-CMPS - ESDEMC Technology LLC

    The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.

  • Spring Stiffness Testing Machine

    STB Series - Jinan Testing Equipment IE Corporation

    STB Computer Control Spring Stiffness Testing Machine Under Axial and Lateral Load is to measure the displacement stiffness of spring under both axial and lateral load, complying with the standard EN13298 Railway applications - Suspension components - Helical suspension springs, steel. The Spring Stiffness Testing Machine measures both axial and lateral stiffness of spring, displacement for both lateral and axial, both loads, offset angle etc. The Spring Stiffness Testing Machine is an ideal testing equipment for spring of chuck and train.

  • C-V Plotters

    Materials Development Corporation

    MDC will tailor your CSM/Win Semiconductor Measurement System for your exact requirements. Choose the best capacitance meter, output device, and probe station for your needs. All CSM/Win C-V plotters feature the latest Dell Computers. The computer and capacitance meters are rackmounted in one compact enclosure. When ordered with a hot chuck or probe station, MDC can deliver a turnkey system of unparalleled performance.

  • TLP Probe Arm Kit

    TPA-95 - High Power Pulse Instruments GmbH

    *Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements

  • Voltage Voltmeter

    Voltstik - SensorLink

    The Voltstik is a distribution voltage voltmeter designed for use on lines and in substations. This meter is employed onto a line by using a hot stick and universal chuck adapter. It is capable of measuring voltage phase to phase, and phase to ground. This high impedance instrument is an excellent choice for solving multiple problems associated with operating a medium voltage system. Its key applications are defined under three groups, safety confirmation of the voltage present, troubleshooting voltage problems, and phasing.

  • Tabletop Mask Aligner

    Model 200 - OAI

    The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.

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