Showing results: 361 - 375 of 429 items found.
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Wewon Environmental Chambers Co, Ltd.
In Wewon, We have 2 powerful Vibration Testing Equipment. The Vibration Testing Equipment A is : EV210H0808VCSusb-E; The Vibration Testing Equipment B is: EV232H0809VCSusb-E. Technical parameters as below blank forms mentioned, The mainly difference is Sine Excitation Force, Frequency Range, Vibration Table’s size. Application for Vibration Test Equipment : The vibration test is to inspire or impact a part or device to see how it reacts in a real environment. The application of vibration test is very extensive, from the circuit board, aircraft, ships, rockets, missiles, automobiles and household appliances and other industrial products.
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HD-T1 -
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Environment Associates Inc.
We service most industry segments with harsh environment, salt fog corrosion testing.If your product is coated or painted for the marine, automotive or military industries, we are equipped to provide accredited testing within multiple chambers.We provide ASTM sample preparation for coated and painted articles to ensure that your test is performed correctly.We also provide custom configurations with varied salt concentrations and temperatures for many customers with products that are used in unique environments. Products like circuit boards, electronic devices and sensors may all have specialized testing requirements.
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Santa Barbara Infrared, Inc.
The FPA Test Set (FPATS) interface to the detectors under test (DUT’s) is via a custom pedestal plate which provides both a conductive heat path to both the individual DUT’s as well as the field of view limiting aperture plate. This custom pedestal plate protrudes through the customer provided DUT interface printed circuit board (PCB) and makes physical contact with the rear of the DUT packages and the aperture plate when the FPATS is in the closed position. The pedestal plate is mounted to the ambient source plate and its temperature is actively driven by this subsystem.
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National Technical Systems
NTS electronics failure analysis capabilities can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices as well as materials and assemblies.Electronics F/A can provide detailed information regarding the performance of materials and devices in their intended end-use application. When a device or material does not meet its performance expectations, a F/A should be performed to identify the root cause of failure. The information presented in the root cause F/A will allow the product designer, manager, test and process engineers, or end-user to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased F/A performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products.
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Ironwood Electronics
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Pine Research Instrumentation
Specializing in low-mid volume electronic manufacturing services, Pine Electronics, Inc. offers a wide range of printed circuit board assembly (PCB assembly), cable and box build assembly solutions. Our equipment, engineering and technical talent serves both multi-national and regional customers throughout the United States. Known for full-service PCB assembly work, Pine Electronics, Inc. is highly integrated and responsive. Each customer has a designated representative for all commercial and technical questions. This personalized service model enhances communication, expedites project development, and represents Pine’s commitment to customer service.
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ATX Networks Corp.
Specializing in low-mid volume electronic manufacturing services, Pine Electronics, Inc. offers a wide range of printed circuit board assembly (PCB assembly), cable and box build assembly solutions. Our equipment, engineering and technical talent serves both multi-national and regional customers throughout the United States. Known for full-service PCB assembly work, Pine Electronics, Inc. is highly integrated and responsive. Each customer has a designated representative for all commercial and technical questions. This personalized service model enhances communication, expedites project development, and represents Pine’s commitment to customer service.
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EverythingPCB
ATE, ICT, semiautomatic & manual electronic test fixtures, PCB test fixtures, cable test fixture, wiring harness test fixtures, dedicated test fixtures, functional test fixtures, electronic test fixture programming. PADS Schematic capture, circuit board layout, PCB design prototype, solder paste stencils, X-Y coordinate data, B.O.M. maintenance, and manufacturing documentation, Gerber data.
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National Technical Systems
The use of Scanning Electron Microscopy / Energy Dispersive X-Ray Spectroscopy (SEM/EDS) in the analysis of failure related issues of printed circuit boards (PCBs), assemblies (PCAs), and electronic components (BGA, capacitors, resistors, inductors, connectors, diodes, oscillators, transformers, IC, etc.) is a well-established and accepted protocol. As opposed to or simply in addition to normal optical microscopy, SEM/EDS allows for the “inspection” of areas of interest in a much more informative way.
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LKZ-720 -
Sonel S.A.
*Detection of wires and cables (live or not)**detection of cables in ceilings, walls and floors,**detection of breaks in cables,**tracing cables in building installation,**locating power points and switches in buildings,**locating short circuits between leads,**tracing shielded cables,**tracing cables in metal ducts.*Identification of fuses on the distribution board.*Tracing underground cables.*Tracing conductive water and heating pipelines.*Non-contact detection of live cables.
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Analog Devices Inc.
Analog Devices provides designers with a robust portfolio of high speed triple, differential, and single-ended input to differential output CAT-5 video drivers. We designed the technology for the highest resolution component video signals, but it can be used for any type of analog signals or high speed data transmission over either Category 5 UTP cable or differential printed circuit board (PCB) transmission lines. Manufactured with our second generation XFCB bipolar process, the drivers have large signal bandwidths of 700 MHz, fast slew rate, and output amplitude and phase matching balanced to –60 dB at 50 MHz.
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SafEye (Quasar 900) -
Teledyne Gas & Flame Detection
The Open Path Combustible system detects hydrocarbon gases by analyzing the absorption of radiation caused by gases in the atmosphere and comparing it to background atmospheric absorption. This is accomplished between a pair of units: a Flash Source and a Detector that can monitor a distance of up to 200 meters.Open Path Combustible Gas Detectors are robustly designed and can handle the toughest environments: 316L stainless steel housings that meet IP66/IP68 and NEMA 250 6P egress standards; circuit boards epoxy coated for protection; MIL-C-810C testing for humidity, salt, fog, vibration, mechanical shock and temperature extremes; and SIL-2 approval per IEC61508 is a final statement in reliability.
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VictoryPCB
Your product descrVictory is a professional Advanced Circuit Manufacturer, We provide 3OZ ~ 6OZ Heavy Copper PCB.Heavy Copper PCB are generally used for high power distribution, heat dissipation, planar transformers, and power convertors. We can make up to 6oz Heavy Copper PCB.iption goes here.Monthy Capability: 3500 Sq M/MonthLayer: 4 LayersMaterial: FR4 TG170Dimension: 350.56mm*580mmFinished board thickness: 2.3mmOuter layer Finished copper thickness: 6ozInner layer base copper thickness: 6ozMin Trace Width/Space: 14milMin hole size: 0.2mmMin hole wall copper: ≥25UMSoldermask Color: Gloss BlackSilkscreen Color: WhiteSurface finishing: HALApplication field: Communication Field
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40-110-121 -
Pickering Interfaces Ltd.
Our 40-110 and 40-115 range of reed relay switching modules are available in both Changeover (SPDT) and Normally Open (SPST & DPST) configurations. Connections are made via a front panel 96 pin male micro-D connector. For applications requiring improved bandwidth and crosstalk performance please look at our 40-120/125 range of shielded reed relay cards. General purpose reed relays are suitable for the construction of small switching networks, for slaving up to larger switches or for operating external devices (e.g. lamps, solenoids etc.). To simplify inter-relay wiring, interconnection points are built onto the circuit board thus easing the construction of complicated wiring.
