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register the presence of a stimuli.

See Also: Metal Detectors, Particle Detectors, Sensors, Charge Sensitive Preamplifiers


Showing recent results 541 - 543 of 543 products found.

  • Domestic Direct Reading Spectrometer

    CS-8610 - Wuxi Tianmu Instrument Technology Co., Ltd.

    1. Convenient, practical and reliable: unique combustion device, equipped with infrared detection system, direct connection, remote control operation.2 , patented burner design (using utility model patent technology)The burner electrode upgrading system adopts a spring structure, the electrode adjustment is convenient, and the double sealing ring guarantee the pressure balance in the furnace cavity without tempering.3 , to ensure accurate measurement results◆Using low-noise, high-sensitivity, high-stability pyroelectric infrared detectors.◆Specially-made new platinum infrared light source, continuous heating and high spectral efficiency.The modular design of the whole machine, the electronic circuit is highly integrated, which improves the reliability of the instrument.◆Industrial-grade integrated linear module power supply, stable output, no fault.◆The infrared detection part and the combustion furnace are connected by optical fiber, and cooperate with multi-level concealed isolation circuit to completely eliminate arc interference.◆Double filter device to reduce the impact of dust on the analysis results.4 , electronic balance is not quantitative sample: you can choose different brands of electronic balance, automatic online, to achieve non-quantitative weighing.

  • Laser Photonic Integrated Circuits

    MAOP-L284CN - Macom Technology Solutions Inc.

    MACOM’s MAOP-L284CN features four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer, with each channel operating at up to 28 Gbps. The L-PIC™ transmitter operates on a standard single mode optical fiber, and includes integrated tap detectors for fiber alignment, system initialization and closed loop control. A single fiber aligned to the output edge coupler of this 4.0 x 6.6 mm die is the only optical connection required for integrating this device into QSFP28 transceiver applications. A bidirectional coupler is provided on the multiplexed output to facilitate both fiber coupling and to monitor output power via an integrated photodiode. The MAOP-L284CN is available as part of a complete MACOM chipset platform, including the MAMF-011095 silicon PIC controller and the MASC-37053A high-speed, low-power modulator driver. Optimized to work together, this chipset solution offers customers improved performance, eliminates the need for assembly of discrete components, reduces configuration and test costs, and accelerates time to market.

  • Ultra-Fast Micro-/Nano- FIB Machining

    XEIA3 - TESCAN Brno, s.r.o.

    Powerful ultra-high resolution SEM column equipped with a high brightness Schottky emitter for high currents, low noise and extraordinary imagingIn-Beam detectors for excellent imaging and very short working distancesUltra-fast xenon plasma ion source FIB high beam currents for outstanding milling speeds and an excellent performance in sputtering large volumes of material, and low beam currents for smooth polishingLess implantation, doping or degradation of insulator deposition, a valuable feature for semiconductor industrySimultaneous SEM imaging during FIB milling or deposition (the whole process can be observed directly) Unique and advanced TESCAN's technologies in terms of automated operations such as the In-Flight Beam TracingTM designed to accurately compute and adjust all the optimal parameters for high resolution imagingAdvanced patterning and 3D characterisations capabilities powered by DrawBeam, a pattern editing tool that also provides a real-time visualisation during milling or lithographic processesHigh-performance electronics for faster image acquisition up to 20 ns/pxl, an excellent deposition rate and ultra-fast scanningNovel solution for fast 3-dimensional microanalysis such as 3D EDX and 3D EBSD sample reconstructions12'', 8'' and 6'' wafer inspection by means of an extended chamber; an exclusive feature of TESCANUnique integration with TOF-SIMSGas Injection System (GIS) for enhancing your FIB applicationsPowerful turbomolecular and dry fore vacuum pump for keeping the chamber clean. Electron gun pumping by ion getter pump in ultra-high vacuum