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Xeon E3 Processor AMC, 10/40GbE
AMC757
The AMC757 is a Processor AMC (PrAMC) in a single module, mid-sizeAdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.2 and AMC.3 specifications.
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Intel Xeon E3 Processor AMC, PCIe Gen3
AMC758
The AMC758 is a Processor AMC (PrAMC) in a double module, mid-size AdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Intel Xeon E3 Processor AMC, PCIe Gen3
AMC756
The AMC756 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Intel Xeon E3 Processor AMC, SRIO Gen2
AMC759
The AMC759 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.2, AMC.3 and AMC.4 specifications.
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Intel Xeon E3 Processor, PCIe Gen3, 3U VPX
VPX756
The VPX756 is a Processor VPX (PrVPX) in 3U form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz.
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PCIe Gen 3 ATCA Carrier Low-Power Xeon E3
ATC122
The ATC122 is a Carrier Module with an on board x16 PCIe Gen3 slot to accept any standard PCIe edge type module. The module has dual 10GbE connected to the Fabric channels and dual GbE to the base channels. It comes with 32 GB of ECC memory. It also has an option for Trusted Platform Management (TPM).
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PCIe Gen 3 ATCA Carrier With Low-Power Xeon E3
ATC123
The ATC123 is a Carrier Module with an onboard x16 PCIe Gen3 slot (only x8 PCIe is routed to the slot) to accept any standard PCIe edge type module.
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PCIe Gen 3 ATCA Carrier W/ Xeon E3
ATC121
The ATC121 is a PCIe Gen3 Carrier Module. The ATC121 has an on board x16 PCIe Gen3 slot to accept any standard PCIe edge type module. The ATC121 comes with 32GB of ECC memory. It has dual on-board Display Port (DP) to DVI-D converter. The on-board processor provides DP output with dual GbE on the front panel. The ATC121 has an option for the TPM (Trusted Platform Management).
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Xeon E3 Processor, 10GbE, MTCA.4, Double Module, AMC
AMC725
The AMC725 is a Processor AMC (PrAMC) in a MTCA.4 double-module, mid-size AMC form factor. It features an Intel® Xeon E3 Processor with Cave Creek PCH, and on-board dual RAID options. The module provides PCIe Gen3 x4 or single x8 on ports 4-11 per AMC.1, dual GbE on ports 0 and 1 per AMC.2, and SATA on ports 2 and 3 per AMC.3. Dual 10 GbE ports are included on the front panel.
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CompactPCI® PlusIO CPU Card, Intel® XEON® E3 v6 Family
PC7-FESTIVAL
The PC7-FESTIVAL is a feature-rich high performance 3U CompactPCI® PlusIO CPU board with an Intel® Xeon® E3 mobile workstation processor for demanding applications. Also available with a 7th Generation Intel® CoreT processor.
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SC5-FESTIVAL 3U cPCI Serial Intel® 7th Gen XEON® E3 SBC
SC5-FESTIVAL
The SC5-FESTIVAL is a feature-rich high performance 4HP/3U CompactPCI® Serial CPU board with an Intel® Xeon® E3 familiy mobile workstation processor. Also available with a 7th Generation Intel® Core™ Kaby Lake processor.
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Intel® Xeon® E3 Quad-Core 10 Gigabit Ethernet AdvancedTCA® Processor Blade
aTCA-9300
The ADLINK aTCA-9300 is a high performance AdvancedTCAR (ATCA) processor blade featuring dual 4-core IntelR XeonR processor E3 1275V2 /1225V2, IntelR C216 Chipset, four channel memory up to 32 GB of DDR3 memory and 300 W power supply subsystem. Versatile connectivity includes dual 10GbE Fabric Interfaces, dual GbE Base Interfaces, quad front panel GbE egress ports, front panel dual COM and USB 2.0 ports and front panel VGA connector. An onboard SATA connector supports CFast up to 32 GB and the optional RTM (aTCA-R6270/R6280) supports an 8-channel mini-SAS port, dual 10GbE SFP+ ports, dual USB ports and dual hot-swappable SATA bays providing additional network throughput and storage capacities.
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6U CompactPCI 6th/7th Gen Intel® Xeon® E3 and Core™ i3/i7 Processor Blade
cPCI-6636(KL) Series
The ADLINK cPCI-6636 Series is a 6U CompactPCI® processor blade based on the 6th/7th Generation Intel® Xeon® E3 and Intel® Core™ i3/i7 Processors with Intel® HM170 or CM236 Chipsets. The cPCI-6636 supports up to 16GB onboard DDR4-2133 memory and 16GB DDR4-2133 via SODIMM. Total memory capacity is up to 32GB of DDR4-2133. The cPCI-6636 is a highly integrated processor blade fit for mission critical applications in industries ranging from automation to defence.
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LGA 1151 Intel® Xeon® E3 v5/v6 & 6th/7th Generation Core™ Series Micro ATX Server Board with 4 DDR4, 1 PCIe x16, 3 PCIe x4, Quad LANs, USB 3.0
ASMB-585
- Supports LGA 1151 Intel® Xeon® E3-1200 v5/v6 and 6th/7th generation Core™ i7/i5/i3 processors- DDR4 ECC/non-ECC 2400/2133/1866/1600 MHz DIMM up to 64GB- One PCIe x16 slot (Gen3 x16 link), three PCIe x4 slots (2 Gen3 x4 link, 1 Gen3 x1 link)- Triple display - two DVI-D and one VGA ports- Supports up to ten RS-232 or six RS-232 and four RS-422/485 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C ambient operation temperature range
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LGA 1151 Intel® Xeon® E3 v5/v6 & 6th/7th Generation Core™ ATX Server Board with 4 DDR4, 4 PCIe, 3 PCI, 6 USB 3.0, 6 COM, 6 SATA3, Quad/Dual LANs, IPMI
ASMB-785
- Supports LGA 1151 Intel® Xeon® E3-1200 v5/v6 and 6th/7th Generation Core™ i7/i5/i3 processors- DDR4 2400/2133/1866/1600/1333 MHz ECC/Non-ECC UDIMM up to 64 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCI slots- Triple display - two DVI-D and one VGA ports- Supports up to ten RS-232 or six RS-232 and four RS-422/485 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C ambient operation temperature range
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Fault Detection and Classification (FDC)
E3™
Fault detection and classification (FDC) transforms sensor data into summary statistics and models that can be analyzed against user defined limits to identify process excursions. For process and equipment engineers, maximizing equipment effectiveness, reducing yield excursions, improving product cycle time and enhancing the overall output of the factory are key success metrics. SmartFactory FDC is built on Applied's equipment control technology, the E3 platform, which promotes information sharing.
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Analog Platforms
(T1/E1/T3/E3/OC-3/OC-12/STM-1/STM-4)
Almost all T1 E1 T3 E3 Testers can be accommodated into rack-based units. Multiple rack units can be stacked together for greater scalability. Shown below is a rack based tProbe™ T1 E1 / T3 E3 Analyzer unit, and a Channelized T3 E3 Analyzer unit supporting 6 T3s (6 * 672 DS0s). Such customized rack serves the purpose of handling multiple communications lines and test complex functionalities.
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Fixed Ultrasonic Heat Meter
E3
Gentos Measurement & Control Co.
In times of increasing energy costs, it is important to measure and control energy consumption accurately. Energy Meters, commonly referred to as BTU meters or heat/ cold meter, can be defined by the measurement of heat/chilled water energy consumption.
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T3/E3, OC3/OC12, & STM1/STM4 Testing
T3 E3 Analysis software compliments the hardware and supports simultaneously monitoring up to 12 x T3 E3 lines (2x Rack units) for all alarms, frame errors, signalling and data. If one adds the Channelized T1 Analyzer software to the system, then the T1s within the T3s can also be analysed in software, 12 x T3 E3 lines (=12*28 T1s) constituting 336 full duplex T1s, or 672 simplex T1s monitored simultaneously using a single Rack unit.
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E1 T1 Tester
NetProbe 2000 PDH
New Generation Analyzer for Legacy PDH networksThe NetProbe 2000 E1E3 is newest, state-of-the-art handheld analyzer on the market for testing the legacy E1 and E3 in PDH networks. It includes all features for E1 & E3 BERT and E1 physical layer testing. Automated line monitoring performs autocheck of essential alarms and errors.
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High Performance Intel Mission Computer
ComSys-5363
The ComSys-5362 is a rugged COTS mission computer. A server grade Intel Core™ i7-7820EQ Xeon E3 CPU supports signal processing for critical applications. Highly configurable, application-specific I/O. Removable drive bay for two 2.5“ SSDs.
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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WAN Tester lllD
It can test a wide variety of communications facilities and equipment including T-1, fractional T-1, E-1, fractional E-1, T-3 and E-3 modems, multiplexers, CSU/DSUs, T-1 CSUs, DDS CSUs, DDS CSU/DSUs, DTUs, NTUs and TIUs. The Ds3 tester is supplied with user-changeable nickel metal hydride batteries and a built-in charger.
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WAN Tester III
The Telinc WAN Tester III is a sophisticated bit error rate tester in a compact, hand held package. It can test a wide variety of communications facilities and equipment including T-1, fractional T-1, E-1, fractional E-1, T-3 and E-3 modems,multiplexers, CSU/DSUs, T-1 CSUs, DTUs, NTUs and TIUs. It is supplied with user changeable nickel metal hydride batteries and a built-in charger.
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BGA Rework Station
PDR IR-E3 Evolution
The PDR IR-E3 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
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WAN Tester II
The Telinc WAN Tester II is a sophisticated bit error rate tester in a compact, hand held package. It can test a wide variety of communications facilities and equipment including DDS, T-1, fractional T-1, E-1, fractional E-1, T-3 and E-3 NTUs, multiplexers, CSU/DSUs, T-1 CSUs, DTUsand TIUs. It includes a speaker to listen to voice in a DS0. It is supplied with changeable nickel metal hydride batteries and a built-in charger.
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Mini-ITX SBC With LGA1150 Socket Intel® Xeon® E3-v3 And 4th Gen Intel® Core™ Processor, Intel® C226, HDMI/DisplayPort/VGA/LVDS, Dual LANs And USB 3.0
MANO882
The MANO882 supports Intel® Xeon E3 series, 4th generation Intel® Core™ i7/i5/i3 processors and Celeron® processors with the Intel® C226 chipset. Two SO-DIMM sockets onboard support up to 16 GB of DDR3-1333/1600 system memory. The outstanding motherboard sustains HDMI, DisplayPort, VGA and LVDS with triple-display capability, making this system board an ideal solution for digital signage, optical inspection for machinery, and industrial automation and control fields. In addition, the embedded board supports Intel® AMT 9.0 security technology to provide complete protection against viruses and attacks. Additionally, the MANO882 is equipped with an Infineon TPM 1.2 security chipset to enhance user data protection.
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1U Rackmount Network Appliance Platform With LGA1150 Socket Intel® Xeon® E3/Core™ Family Processor, Intel® C226 And Up To 24 LANs
NA570
NA570 1U rackmount Network Security Platform, supports the 4th generation Intel® Xeon® E3 / Core™ processor family, formerly codenamed "Haswell". NA570 offers greatly improved performance and reduced power consumption base on the new Intel architecture marked improvements in power efficiency and performance. The system supports up to 32GB DDR3 1600 non-ECC / ECC (only NA570) memory. NA570 support 4 pairs of LAN Bypass function. Bypass ports allow users to experience uninterrupted network traffic even if a single in-line appliance hangs or sudden shutdown. Expandable LAN Modules via the PCIe 3.0, support up to 24 GbE ports, or up to 4 ports at 10GbE, and a future upgrade to 40GbE, port density and optional networking ports to suit your demands.
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ATX Industrial Motherboard With LGA1150 Socket Intel® Xeon® E3-v3 Processor, Intel® C226, ECC DDR3, USB 3.0, SATA 3.0, Dual LANs, DisplayPort/DVI-I/HDMI And CFast™
IMB210
The IMB210 is an advanced ATX industrial motherboard based on the 4th Generation Intel® Xeon® E3/ Core™ i7/i5/ i3/ Pentium®/ Celeron® processors (codename: Haswell) in LGA1150 socket with Intel® C226 PCH. The optimized IMB210 is specially designed for workstations through better computing and visual performance ideally used in every major industry for tasks ranging from financial modeling to designing complex buildings and vehicles. With its built-in Intel® HD Graphics P4000, this industrial grade motherboard delivers great 3D visual performance with triple display capability through DisplayPort, HDMI and DVI-I ports demanded by professional-grade CAD and media/entertainment fields. In addition, the IMB210 supports Intel® Turbo Boost 2.0 technology, Intel® Hyper-Threading technology, Intel® HD Graphics with DX11 support, 3-D Tri-Gate transistors, 32 GB ECC DDR3 1600/1333 memory, and PCI Express 3.0 x16 slot. It also features Intel® Active Management Technology 9.0 (iAMT), Trusted Platform Module 1.2 (TPM), SATA RAID, as well as PCIe x4 expansion making it ideal for applications with added security features.
