Showing results: 1216 - 1229 of 1229 items found.
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CEM510 -
Axiomtek Co., Ltd.
The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
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Objective Interface Systems
Objective Interface Systems (OIS) was founded in 1989 with the goal of providing products that enable customers to build vastly superior information systems and technologies.OIS's products allow the system and software engineers to assemble flexible systems with incredibly agile communications infrastructures.The products enable real-time, embedded, and high-performance systems based on standards-based communications infrastructures on a wide variety of deployment environments. These tools result in systems that are more flexible, reliable, predictable, and correct than what was previously possible. OIS products are the Heart of Communications.OIS provides the most reliable products available. Every OIS software engineer is trained in DO-178B safety-critical engineering processes, Software Considerations in Airborne Systems and Equipment Certification. This well-established process standard arguably provides the best method for achieving high-correctness in engineering processes. Every line of OIS product source code goes through an arduous multi-person peer review and requirements traceability analysis. Critical sections get even more scrutiny. Every product build goes through automated regression testing and verification by a group independent of the developers.
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VP62108 -
LinkedHope Intelligent Technologies Co.,Ltd.
VP62108 is a 6U VPX computing payload based on Intel® 4th generation Core™ Processor. It supports Intel® 4th generation Haswell architecture i3/i5/i7 dual-core or quad-core embedded processor, up to quad-core i7 processor 4860EQ with a life cycle of more than 7 years.VP62108 provides four serial RapidIO (SRIO) x4 links for VPX data plane communications, two x8 PCIe links for VPX expansion plane communications and four Gigabit Ethernet links for VPX control plane communications. Its rich data exchange capability allows users to easily build the whole machine or system-level solutions.VP62108 supports up to DDR3L 16GB ECC memory and offers reliable data transmission. Its onboard solid state Flash managed by a SATA interface controller can be up to 64GB SLC or 128GB MLC. And the entire board uses the reinforced conduction-cooled design and has a wide operating temperature, allowing the user not to worry about its working stability in harsh environments. This feature makes VP62108 particularly suitable for critical mission areas.
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Unisim Compact Solar Simulator -
TS Space Systems
The Unisim Compact is a low-cost close-match solar simulator that provides the world-leading spectral match of our award winning Unisim solar simulators in a compact, bench top unit complete with IV measurement system. As with all our Unisim solar simulators, they exceed the ASTM, IEC and JIS international standards for spectral match and temporal instability. The easy-maintenance enclosure houses a TS-Space Systems 2-zone Unisim solar simulator which combines metal halide and incandescent sources via a proprietary filter system to give an AM0 close-match spectrum (AM1.5 drop-in filter sets are available). The standard system includes an embedded source meter with complete IV measurement system (Computer, GPIB interface, IV software, MS Excel), relative irradiance indicator for monitoring lamp intensity and an electrical shutter. Product support is very important to us. Training is provided at our premises where customers can take advantage of one-on-one tuition with the solar simulator designers and learn how to operate and maintain their tools. Extensive support via phone and email for the full lifetime of the instrument is included with every TS-Space Systems product.
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LEC-iMX6R2 -
ADLINK Technology Inc.
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
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PICO318 -
Axiomtek Co., Ltd.
The PICO318 is powered by the Intel® Pentium® processor N4200 or Celeron® processor N3350. The PICO318 is a low power-consumption 2.5-inch embedded board that is expandable, rugged design, feature-rich and versatile to help facilitate quick deployment. The PICO318 is equipped with one 204-pin DDR3L-1867 SO-DIMM for up to 8GB system memory. A dual-display capability is available through 18/24-bit single/dual channel LVDS and DisplayPort. For storage, there are one M.2 key B slot for SATA or PCIe x2 SSD card and one half-size PCI Express Mini Card slot with support for mSATA. Moreover, the pico-ITX form factor single board computer features 12V DC power supply input with AT Auto Power On function. The Intel® Apollo Lake-based pico-ITX board provides rich I/O connectivity including two USB 3.0 ports, two USB 2.0 ports, one RS-232/422/485 port, one RS-232 port, two Gigabit LAN ports with Intel® i211AT Ethernet controller, one HD Codec audio, and 4-channel digital I/O. The PICO318 is suitable for various industrial environments with an operating temperature range of -20°C to +60°C.
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IPC964-512-FL -
Axiomtek Co., Ltd.
The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
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cExpress-TL -
ADLINK Technology Inc.
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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SDS2000X-E Series -
SIGLENT Technologies
The SDS2000X-E series employs a new generation of SPO technology. With its excellent signal fidelity, background noise is lower than similar products in the industry. It has a minimum vertical input range of 500 uV/div, an innovative digital trigger system with high sensitivity and low jitter, and a waveform capture rate of 400,000 frames/sec (sequence mode). It also employs a 256-level intensity grading display function and a color temperature display mode not found in other models in this class. Siglent’s newest oscilloscope offering supports multiple powerful triggering modes including serial bus triggering and decoding. History waveform recording and sequential triggering allow for extended waveform records to be captured, stored, and analyzed. Also included is the deep memory FFT. This math function uses upto 1 M samples for the FFT calculation, providing the SDS2000X-E with very high frequency resolution. The hardware co-processor executes true fast measurement and math to all of 28M sample points so that there is minimal distortion on analysis. It also supports searching and navigating, on-screen Bode plot, 16 channel digital /MSO (optional), an external USB powered 25 MHz AWG function generator module (option), a USB WIFI adapter for wireless control and monitoring (option), and an embedded application that allows remote control via web browser. The features and high-performance of the SDS2000X-E oscilloscopes cannot be matched else anywhere at this price.
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TDEMI Mobile+ series -
Gauss Instruments
The new benchmark for your fastest product pre-certifications on the planet. The new TDEMI Mobile+ (TDEMI M+) receiver series of GAUSS INSTRUMENTS is a very compact and robust designed instrument for optimum mobility and outdoor use as well as on developers workbench in your lab. It provides a vast variety of functionalities. The TDEMI M+ receiver series is equipped with a +12V supply - so it can be easily used for on-board testing, e. g. in vehicles or aircrafts and so on. By its integrated touch-sensitive and high resolution screen and the embedded PC the TDEMI M+ is a fully stand-alone instrument independent from any control or host or display unit e. g. as a PC or laptop. Thus it provides even more flexibility for your emission measurements. Furthermore the instrument can be powered by a battery pack (Option BAT-UG) making it even more flexible and easy to carry it around without any need of an external power supply. Especially designed for your todays challenging pre-certification tasks the TDEMI M+ provides the absolutely unrivaled advantages in speed and performance of the well known and market approved GAUSS INSTRUMENTS time-domain and RF technology. Thus, your pre-certification measurements and investigations can be performed up to 16000 times faster than by conventional receivers. The instruments of the TDEMI M+ receiver series are available for the frequency ranges up to 1 GHz, 3 GHz, 6 GHz or 7 GHz starting from 9 kHz each. Additionally these blazing fast measurements can be carried out even starting from 10 Hz optionally (Option MIL/DO-UG).
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B&W Tek, Inc.
We offer a full suite of software for spectroscopic data collection and analysis designed for users at all levels, and varying applications. Our standard BWSpec® spectral data acquisition software allows for easy collection of data from our Raman systems and modular spectrometers. It includes tools for instrument control for data collection and spectral manipulation. The raw data and corrected data are stored and can be easily viewed. Data manipulation tools include smoothing, baseline correction and derivatives. Data can be saved in different formats for use in additional application software. For spectral identification against Raman spectral libraries with a simple interface for immediate identification for verification with a pass/fail result, our BWID® software provides qualitative analysis. Users of BWID software can create their own Raman spectral libraries, or select from our numerous ready to use libraries. For identification with portable Raman in regulated environments, the US FDA 21 CFR part 11- complaint version of BWID can be used. B&W Tek’s unique see-through identification using the STRam® can also be done using the BWID software operating on the embedded tablet computer of the STRam system. For quantitative analysis, data collected with BWSpec or other packages can be imported into the BWIQ® multivariate data analysis software, offering a full suite of data preprocessing, regression and classification analysis algorithms. PLS regression models from the BWIQ software an be used in rel-time in our BWAnalyst software, for use with the QTRam , as well as in Metrohm’s Vision® software. The i-Raman series portable Raman instruments can also be operated for single acquisition, or for real-time analysis in the Routine Analysis mode of the Vision software.
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AIM GmbH
AIM’s ARINC825 cards can work either with full functionality as an active CAN node for testing and simulating or in listening only mode for monitoring and recording purposes of Avionic CAN bus (ARINC825) applications on up to 4 electrically isolated CAN bus nodes concurrently. All nodes are in conformance with the ISO11898-1/-2 standard. They are accessible by software separately and can be used as 4 independent CAN bus nodes. An onboard IRIG-B time decoder allows users to accurately synchronize single or multiple modules to a common time source. All supported signals are available through front I/O and rear I/O interface. ARINC825 cards consist of FPGA based CAN interface controllers as well as a FPGA based 32-bit microcontroller core and a separate processor for IRIG-B synchronization with high resolution time stamping. All nodes are operating concurrently at CAN bus high speed bit rate of up to 1Mbit/s with the intelligence to process scheduling of CAN frames in real time onboard to significantly off-load the host processor.For embedded applications the AMC825-4 PMC module is available in a conduction cooled version. Using AIM’s family of PCI, CPCI (3U and 6U) and VMEbus carrier cards for PMC our clients have off the shelf solutions in a broad range of card formats. ARINC825 (CAN bus) modules are delivered with an Application Programming Interface (API) and Driver Software compatible with Windows, Linux and VxWorks.An ARINC825 Resource Component is available for AIM’s PBA.pro™ databus test and analysis tool including Tx and Rx simulation capabilities, a Chronological Bus Monitor and support for decoding of payload data within CAN messages. This allows to implement a powerful ARINC825 (CAN bus) analyzer or a complete test system in conjunction with other AIM avionics databus interfaces and PBA.pro™ supported 3rd party hardware.
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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MIC-6314 -
Advantech Co. Ltd.
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
