Showing results: 151 - 165 of 376 items found.
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SEN-36004 -
Playing With Fusion Inc
Fully integrated carrier board designed to get the most out of the TMD37003 cRGB (color with IR compensation) and Proximity Sensor from AMS. This means that the board includes a 1.8V-5V input range LDO and high-speed signal voltage translation on all IO pins. In addition, we've added a high output white LED that is tuned to the light temperature range of the TMD37003 IC. This makes sensing color of close-proximity objects possible, such as in robotic color sorting operations. As on many of our boards, we've included 4-40 sized mounting holes to make installation easy. The IC functions are interfaced via a 0.1" header, which includes power (Vdd and GND), I2C interface (again, fully translated) and a 3.3V input to power the proximity (IR) LED. The on-board LED is turned on with a logic 'HIGH' applied to the LED pin and is powered with Vdd.
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GDZip + MEZip -
SolutionSoft Systems Inc.
Recognizing the challenge to transfer, manipulate, and store the exponentially-increasing size of IC design files, Solution-Soft has developed gdzip and mezip, breakthrough compressors for the GDSII and MEBES formats used by the industry. The MEBES format is the most commonly used format for electron beam lithography and photomask production. The GDSII stream is the standard exchange format between the design world and the mask shops.
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Star Engineering, Inc
200 Customers100 Active SuppliersPurchasing for 60 material classifications including such materials as:a) IC, Resisters, Capacitors, Wire, Cable, Power Suppliesb) Connectors, Converters, Diodes, Fuses, Fabricated partsc) Inductors, Relays, Switches, Hardware
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LogicVision, Inc.
Mentor’s comprehensive solution for IC test, including best-in-class design-for-test tools and test data analytics that help ensure the highest test coverage, accelerate yield ramp and improve the quality and reliability of manufactured parts.
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7125 -
Peaceful Thriving Enterprise Co Ltd
This is a low power consumption, high accuracy and stable hand held multi-meter; with special designed IC to support true RMS measurement. It performs measurements of AC/DC voltage, DC current, resistance, diode and square wave output.
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Teledyne DALSA
Teledyne DALSA’s mixed-signal group, formerly known as Axiom IC, delivers high-performance, high-quality data-converter designs and IP blocks for the industrial, professional, scientific, imaging and audio markets. Based in the Kennispark business and science park in Enschede, The Netherlands, the group works in close cooperation with the University of Twente and supports PhD students and trainees to stay involved in the newest CMOS design methodologies and technologies.
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ScanTool.net, LLC
The OBD Development Kit is a modular development system designed to speed up the development of devices that interface with the OBD bus. It consists of the Interconnect Board, three removable modules (Power, OBD Drivers, and STN OBD IC), and an OBD cable.
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RoodMicrotec GmbH
Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Ironwood Electronics
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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PFL780/760 -
Polar Instruments Inc
The PFL780 and 760 use IC clips as a test interface. This makes them ideal for the service and maintenance of legacy systems. If you need to work on high density surface mount PCBs you should consider the GRS500 as a more suitable alternative.
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Crystal Vision -
FA Instruments
Crystal Vision Microscopy suites are transforming the world of IC Diagnostics and failure analysis. Intuitive software allows user friendliness and enables the breadth of analytical disciplines available. Realtime imaging from both Topside and Backside, allows for maximum productivity.
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Renesas Electronics Corp.
Renesas has invested in key technologies to address the latest trends within the automotive market. Offering both standard and AEC-Q100 qualified products for automotive applications, Renesas' automotive display IC product line is defined by feature rich, highly integrated semiconductor solutions that incorporate many key function blocks for front console, rear seat entertainment, and rear camera display applications.
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FMC DEL -
Sundance Multiprocessor Technology Ltd.
An FPGA Mezzanine Card (FMC) created to produce pulses delayed by a user-programmed value with respect to the input trigger pulse. It has 4 output channels and one input trigger. The delay from the trigger input to each of the outputs can be set independently in a range from 600 ns to 120 seconds. It is implemented using a dedicated time-to-digital converter IC from the European company Acam.
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784959-01 -
NI
The IC‑3120 is a compact and rugged industrial controller that withstands the harsh environments common in automation, supervisory control, distributed control, and industrial embedded OEM applications. The IC‑3120 offers two Gigabit Ethernet ports with Power over Ethernet (PoE) technology, FPGA-based I/O capabilities, and network connectivity for distributed control applications. The advanced features include the ability to synchronize image inspection results with industrial I/O and configure hardware-timed network triggers to trigger camera acquisition, motion control, or data acquisition. You can use the advanced FPGA personality that is shipped with the system or customize the FPGA functionality using the LabVIEW FPGA Module.
