Showing results: 211 - 225 of 384 items found.
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784961-01 -
NI
1.91 GHz Intel Atom Quad-Core Processor, 2-USB3 Port Industrial Controller - The IC‑3121 is a compact and rugged industrial controller that withstands the harsh environments common in automation, supervisory control, distributed control, and industrial embedded OEM applications. The IC‑3121 offers two USB3 ports with dedicated bandwidth, FPGA-based I/O capabilities, and network connectivity for distributed control applications. The advanced features include the ability to synchronize image inspection results with industrial I/O and configure hardware-timed network triggers to trigger camera acquisition, motion control, or data acquisition. You can use the advanced FPGA personality that is shipped with the system or customize the FPGA functionality using the LabVIEW FPGA Module.
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Renesas Electronics Corp.
Renesas' light-to-voltage silicon optical sensors combine a photodiode array, a non-linear current amplifier and a micropower op amp on a single monolithic IC. Applications for these devices include display backlight control, keypad dimming, anti-glare mirror systems, and industrial and medical light sensing applications.
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3916A -
Pomona Electronics
Dip Clip, 16 pin with Nickel Silver contacts. Pomona DIP Clip® test clips are designed for testing dual-in-line IC packages on PC boards. These devices incorporate many built-in features that assure a positive electrical connection as well as hands free testing.
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MICRONICS JAPAN CO.LTD.
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.
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Sentris -
OptoTherm, Inc.
Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Z-Axis Europe
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Xeltek
Until now,Support 243 IC manufacturer, 33941 pcs devices and keeps growing.Support devices with Vcc from 1.2V to 5V.Extremely fast speed hign than SUPERPRO/500P.Built with 48 universal pin-drivers.PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip.Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.Advanced and powerful functions.Production mode start chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Serial numbers generators are available as standard or customer-specific functions.Log file is useful for quality tracking.Over-current and over-voltage protection for safety of the chip and programmer hardware.WINDOWS XP/Vista compatibility/Win7/Win10
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Ironwood Electronics
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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ChenYang Technologies GmbH & Co. KG
is a sophisticated Hall Effect Gear Tooth IC featuring an on-chip 12-bit A/DConverter and logic that acts as a digital sample and hold circuit. A separate 6-bit D/A converterprovides a fixed hysteresis. The sensor does not have a chopper delay. It uses a single Hall platewhich is immune to rotary alignment problems.
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7117 -
Peaceful Thriving Enterprise Co Ltd
This is a low power consumption, high accuracy and stable hand held 6000 counts multi-meter; with special designed IC to support true RMS measurement. It performs measurements of DC voltage/current, true RMS AC voltage/current, resistance, capacitance, frequency, diode, continuity, temperature and non-contact voltage sensing.
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M9195B -
Keysight Technologies
The Keysight M9195B PXIe digital stimulus/response (PXI DSR) module is ideal for IC design validation and production test environments. The PXI DSR provides 16 bi-directional digital channels with programmable logic levels and can be configured for synchronized cyclized digital data, for parametric measurements, or for static digital IO.
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DC3 -
Hilevel Technology, Inc.
The wafer has been fully tested, cut and packaged. Today's IC manufacturers are finding tremendous cost savings in performing just fast DC tests on these packaged parts rather than running the full wafer tests all over again. Until now this required either an expensive full-power IC tester, or a "rack-n-stack" collection of instruments. Enter the HILEVEL DC3 Co-Optive Parametric Tester. No more instruments, no switching matrix, no tricky software. The DC3 combines a high-precision DC-PMU and internal DUT supplies to test up to 2,048 pins, all in a single chassis with Multi-Site capability up to 64 sites. And every DC3 includes our Classic Curve Trace feature, allowing easy curve tracing on every pin.
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Model 4863 OEM -
ICS Electronics
* 114514 Board has same digital capability as the 4863 described above with GPIB IO.* GPIB interface header includes GPIB address switch input signals.* Use with any IC GPIB Connector/Address Switch Assembly.* Uses 9-32 Vdc power.* 114515 Board has same digital capability as the 4863 described above with GPIB and Serial IO.* GPIB interface header includes GPIB address switch input signals.* Serial interface header includes RS-232 and RS-485 signals. Use the 114597 Serial Cable Kit to connect the serial signals to your rear panel* Use with any IC GPIB Connector/Address Switch Assembly or with a 114597 Serial Connector Kit.* Uses 9-32 Vdc power.
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SEN-36001 -
Playing With Fusion Inc
Highly integrated breakout board for the ST Micro VL6180X Time of Flight (ToF) range finder sensor. This sensor has many uses in the robotics, cell phone and gesture recognition space. It has two programmable GPIO pins, and most importantly, measures absolute distance up to 100mm. The SEN-36001 includes a VL6180X IC centered between two 4-40 sized mounting holes with onboard 2.8V LDO and voltage translation to handle interface voltages from 3V to 5V. The board is interfaced via an I2C interface and all IC pins have been broken out to a 0.1" pin header. Example code for the Arduino platform is available below and includes code for both the proximity measurement and ambient light sensing capabilities.
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SAMPULSE50GHz and SAMPULSE70GHzANT -
Furaxa, Inc.
The SAMPULSE50GHz and SAMPULSE70GHzANT are demonstration boards for Furaxa InP single channel sampler/pulser ICs. The SAMPULSE50GHz model contains a 2.4mm combined TDR input/output connector to the common sampler/pulser node in the IC. The SAMPULSE70GHzANT is similar, except that instead of a single-ended 2.4mm connector, the sampler IC's differential inputs are fed from a bowtie antenna. In both models, the IC's differential sampler output is converted, using an AD8009 op amp, into a single-ended ground-referenced output that is sent to an SMA jack labeled SAMPLER OUTPUT.
