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Image Processing
algorithmically enhances image characterization.
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Temperature Input Module For Remote I/O
The Temperature Input Module for Remote I/O features a features a thermocouple input range of ±100 mV and a voltage input range of ±5 V. It also has an adjustable filter time for improved measurement quality and optional external CJC or PT100 RTD measurements.A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the Temperature Input Module for Remote I/O from a real‐time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low‐cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high‐speed or specialty measurements.
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Framegrabber
FastX-APU
The FastX-APU framegrabber series is for users who anticipate a demand for extreme I/O requirements and/or higher bandwidth, complex image processing and real-time high-speed storage in a cost effective platform. The base FastX-APU, is a two thirds length raw form factor PCIe (X4) Gen2 board with either six basic 85 MHz Camera Link Channels up to two extended full Camera Link camera interfaces. An auxilliary I/O connector provides a header for adaptation of other high speed interfaces such as GigEx4, high speed analog formats such as UXGA or DVI, or CoaXPress. The front-end data is formatted and preprocessed by a Kintex FPGA before being sent to the PCIe (X4) Gen 2 switch to the host or the AMD APU.
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IDS NXT
IDS Imaging Development Systems GmbH
The functions of classic vision sensors - such as barcode readers - are usually strictly defined and hardly expandable. IDS NXT shows that there is a different way: the freely programmable platform is not tied to any predefined tasks. Instead, users can develop and install vision apps themselves and then change and set up various image processing tasks in a short time. App development does not require any additional specialist knowledge, because it hardly differs from the development of a "classic" industrial camera application. The possibility of installing different types of vision apps creates universal application possibilities in numerous application areas, for example in optical quality assurance, as an analytical device in medical technology, for surveillance tasks using face recognition or vehicle and person counting.
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Sensor
Lepton
The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.
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LED Illumination
With many years of application experience and product development, our LED products offer the highest quality and best range of any manufacturer of machine vision lighting. The Constant Current Controlled "MG-Wave®" and Constant Voltage Controlled "CompaVis®" provides solutions for the diverse applications and image processing environments found in the industry. Unlike other companies that may focus only on lighting, our total system solutions approach provides customers with the best performance & efficiency through consideration of not just one but all three of the essential imaging fields: illumination, lens, and peripherals. Our total system solutions meet the needs of even the most challenging applications, especially with our ability to integrate hardware for advanced optical systems.
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Framegrabber
FastX1703
The FastX1703 framegrabber series is for users who anticipate a demand for extreme I/O requirements and/or higher bandwidth, complex image processing and real-time high-speed storage in a cost effective platform. The base FastX1703, is a two thirds length raw form factor PCI board six basic 85 MHz Camera Link Channels or an extended Camera Link camera interface. An auxilliary I/O connector provides a header for adaptation of other high speed interfaces such as LVDS or high speed analog formats such as UXGA or DVI. The front-end data is formatted and preprocessed by a FPGA before being sent to the memory subsection, up to four PNX1702 500 MHz processors with 256MB memory each. Finally, the FastX1703 interfaces to the host computer through a 4xPCIe interface for state-of-the-art data acquisition.
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MultiBeam System
FIB
An easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.
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Flatness, Bow, Warp, Curvature, Glass Thickness
1D-glass Thickness Profile Measuring Instrument GPM2
Optik Elektronik Gerätetechnik GmbH
Highly accurate automatic measurement of glass thickness distributions. The glass thickness profiler GPM has the function to execute a fast and precise determination of the thickness profile of flat glass samples or another transparent material with a thickness range from 30µm to 700µm (option with sensor type 1) and width to 1200mm. The measuring point distance of the profile measurement can be varied over a micro-step-controlled positioning steering between 0.1mm and 1mm. The measured value accommodation for a scanning point takes place with the help of a special hardware module for image processing algorithms within 40 ms. The entire measuring time for a sample results thus as product from the sample width which has to be measured, the measuring point distance and the measuring time per measuring point.
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Analog Output Module For Remote I/O
The Analog Output Module for Remote I/O features a 2-wire spring terminal connection, selectable output ranges (0 V to 10 V, ±10 V, 0 V to 5 V, ±5 V, 0 mA to 20 mA, 4 mA to 20 mA, and ±20 mA) output ranges, and short circuit proof outputs. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the Analog Output Module for Remote I/O from a real‐time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low‐cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high‐speed or specialty measurements.
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Situational Understanding Mission Intelligent Technology
SUMIT360™
The SUMIT360™ provides military armored vehicle operators with an innovative, 360 degree view of the environment around the vehicle utilizing advanced sensor technology to improve threat and obstacle detection that could pose a threat to ground forces, and their mission. Equipped with powerful multi-spectral sensors in each module, the system uses on-board processing to form seamless, stitched images to provide a full field of view in any terrain, and virtually any conditions, day or night. With additional target detection and identification capability, the system can also be paired with advanced analytics and Artificial Intelligence (AI) to provide vehicle crew, and transported troops a threat detection and classification to provide critical decision support before opening the hatch. The system also provides the ability to support remote or optionally manned configurations.
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REM-11120, 4-Channel Thermocouple, 1-Channel Voltage, Temperature Input Module for Remote I/O
784750-01
4-Channel Thermocouple, 1-Channel Voltage, Temperature Input Module for Remote I/O - The REM‑11120 is a temperature input module for remote I/O. Remote I/O systems are low-cost, modular systems for simple machine control and measurements. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the REM‑11120 from a real-time controller such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low-cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high-speed or specialty measurements. The REM‑11120 also has an adjustable filter time for improved measurement quality and optional external cold junction compensation (CJC) or PT100 resistance temperature detector (RTD) measurements.
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REM-11115, 4-Channel, 2-Wire Analog Output Module for Remote I/O
784749-01
4-Channel, 2-Wire Analog Output Module for Remote I/O - The REM‑11115 is an analog output module for remote I/O. Remote I/O systems are low-cost, modular systems for simple machine control and measurements. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the REM‑11115 from a real-time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low-cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high-speed or specialty measurements. You can use the REM‑11115 for voltage or current output, and it features a 2‑wire spring terminal connection method. The REM‑11115 has selectable output ranges and short-circuit-proof output channels.
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REM-11152, 16-Channel (Input), 24 V, 2-, 3-, 4-Wire Digital Module for Remote I/O
784743-01
The REM‑11152 is a digital input module for remote I/O. Remote I/O systems are low-cost, modular systems for simple machine control and measurements. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the REM‑11152 from a real-time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low-cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high-speed or specialty measurements. The REM‑11152 features 2‑, 3‑, and 4‑wire spring terminal connection methods, a built-in power supply for sensors, and an adjustable filter time to improve measurement quality. You can use inputs as counters or standard digital inputs.
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REM-11100, 2-, 3-, 4-Wire, 4-Channel Voltage Input Module for Remote I/O
784748-01
2-, 3-, 4-Wire, 4-Channel Voltage Input Module for Remote I/O - The REM‑11100 is a voltage input module for remote I/O. Remote I/O systems are low-cost, modular systems for simple machine control and measurements. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the REM‑11100 from a real-time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low-cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high-speed or specialty measurements. This module features 2‑, 3‑, and 4‑wire spring terminal connection methods, a built-in power supply for sensors, four selectable input ranges, and simultaneous sampling.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Camera Module
XM Bond HR
Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden.
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Longwave Infrared Thermal Camera Module
Tau® 2
Made in USA, the Tau® 2 OEM thermal imaging cameras offer an unmatched combination of features and reliability, making them well-suited for demanding applications including unmanned vehicles, thermal sights, and handheld imagers. Improved electronics provide powerful image processing modes that dramatically improve detail and contrast through continuous histogram equalization. Radiometry is available in every pixel for both 640 × 512 and 336 × 256 resolutions and all three camera grade levels. All Tau 2 configurations share electrical, mechanical, and optical interfaces allowing integrations to be designed that work seamlessly with all formats. Available in Commercial, Performance, and Industrial variants, each with unique sensitivity and pixel operability thresholds to meet operational requirements. Radiometry is an optional feature for Performance-grade cameras, and standard feature with Industrial-grade. All Tau 2 configurations and resolutions share electrical, mechanical, and optical interfaces allowing integrations to be designed that work seamlessly with all formats.
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Signal Processor Board
MS 1532
- Frequency coverage from 5 kHz to 30 MHz in 1-Hz steps- High dynamic range: +30 dBm 3rd-order intercept typical- Digital filtering provides 58 IFBWs from 56 Hz to 8.0 kHz with exceptional shape factors- AM, Synchronous AM, FM, CW, USB, LSB & ISB detection modes standard- Tunable notch filter- Fast, flexible scanning with 100 memory channels- Large readable LED displays & user-friendly controls- Noise blanking & pass band tuning- Internal switchable preamplifier & attenuator- Operator-selectable RS-232, RS-485, or- RS-422 remote control- Viretx 5 FPGA based design (Two virtex for image processing)- LPC2468 ARM 7 Processor based design- MIL1553B and RS485 Interface- Two High speed 14 bit ADC (125MSPS) for I & Q Sampling- Direct sampling 2-30MHz- Audio CODEC- Conduction Cooled Board
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Digital Module For Remote I/O
Digital Modules for Remote I/O provide 24 V digital inputs or outputs and offer 1‐, 2‐, 3‐, and 4‐wire spring terminal connection options. You can use inputs as counters or standard digital inputs, and you can adjust filter time to improve measurement quality. Inputs can include a built‐in power supply for sensors. Output modules feature circuit and overload protection and can drive up to 500 mA per channel, up to 8 A per module.A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the Digital Module for Remote I/O from a NI real‐time controller. You can use remote I/O hardware to add low‐cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high‐speed or specialty measurements.
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Long-range Surveillance Thermal Imaging Camera
IRT303
Wuhan JOHO Technology Co., Ltd
Long-range Surveillance Thermal Imaging Camera IRT303IRT303 is extremely compact, durable uncooled day/night system, operating in 8-14 um waveband, with DDE image processing technology and high sensitivity, it is ideal for quick and accurate situational awareness in a variety of defense and security applications. It specially equipped with Dual-FOV, the wide FOV for find object in wide scope and then fast switch to narrow FOV looking at the target for details. IRT303 is the optimal device for super long observation purpose and target acquisition.ApplicationsLong distance surveillance or patrolLand border and coast surveillanceMarine navigation or rescueTechnical DataDetector Detector material Uncooled FPA Spectral range 8~14 m Pixels 320x240 Pitch 38 mx38 m NETD 50mK@25 C (f/0.7) Optics Lens 135mm/45mm FOV 5.2 3.9 /15.4 11.6 Focusing Motorized Optional lens 100mm/25mm, 120mm/40mm, 150mm/50mm, 180mm/60mm Image Presentation Video output 25Hz PAL/30Hz NTSC Electronic Zoom x2 Polarity BH/WH inverse Brightness & Contrast Auto/ Manual Gain Composition Auto/ Manual Power system Power supply 110~240VAC 9~14VDC (typical: 12VDC) Interfaces Command interface RS232 /RS485/ RS422 alternative Digital video interface(Optional ) Ethernet/LVDS/CameraLink Environmental Ambient temperature -40 C~+60 C Storage temperature -45 C~+60 C Range Performance Detection Range (2.3mx2.3m vehicle) 5500m Recognition Range (2.3mx2.3m vehiclet) 1800m Detection Range (1.8mx0.5m human) 2200m Recognition Range (1.8x0.5m human) 580m
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Embedded Vision
In the industrial environment, especially in digitalized, automated production scenarios, more and more so-called embedded systems are being used. Embedded devices are small, with compact dimensions, highly efficient, and generate little waste heat. Therefore, they are also suitable for limited space conditions. Due to often harsh environmental conditions, they must be particularly robust and resistant to external influences like massive dust accumulation, strong vibrations, and high humidity or even direct contact with water. Typically, embedded devices are handhelds, smartphones, tablets, vision sensors, smart cameras, smart sensors and single board computers. If the systems have integrated machine vision software, they can be used for a wide range of image processing applications. This is known as embedded vision.
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Vision Systems
Embedded vision systems, also referred to as compact vision systems, offer an alternative to Smart cameras and computer-based systems. The ADLINK EOS series is a complete embedded system that offers image acquisition, processing, archiving, and display capabilities. It is equipped with a multi-core CPU, ideal for applications requiring high computing power and multi-camera imaging, such as 3D vision and robotics guidance. Featuring rich I/O connectivity with factory-floor networks, including RS-232/422/485, USB, and isolated digital I/O, as well as onboard storage, ADLINK’s embedded vision system is ready to deploy. A system monitoring feature, feeding back temperature and voltage data, combines with a watchdog timer to maximize robustness and reliability of the ADLINK EOS series in mission critical applications.
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USB 3.0 Cameras With CCD
xiD
*Quality components - Sony "EXview HAD CCD II" sensors delivering 2.8, 6.1, 9.1 and 12 Mpix*Fastest - Highest speed using full 4 TAP readout potential*Industry standard interface - Compliant with USB 3.0 SuperSpeed specification*Versatile mini camera - Subtle 60 x 60 x 39 mm, 320 grams (1)*Power - Lowest power consumption starting at 3 Watt, bus powered with USB3 cable*Cool - Minimal heat dissipation with passive COOLing*Compatibility - USB 3.0 support for Windows 7 and 10, macOS, Linux, ARM and 30 Libraries*Connectivity and Synchronization - Programmable opto-isolated input and output, 3 status LEDs*Bandwidth potential - 5Gb/s interface 400Mpix/s data throughput*Software interfaces - GenICam / GenTL and highly optimized xiAPI SDK for Image Processing*High grade - Quality class of sensors is combined with specially selected IR filters *Easy deployment - Range of accessories and widest hardware and software interoperability*Highly Customizable - Available in Board level and with Peltier TE Cooling
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Platform for Multi camera systems and Embedded vision
xiX
*Smallest camera featuring Sony Pregius™ - Compact with only 26.4 x 26.4 x 31 mm and 30 grams (1)*Fast CMOS - High speed, high frame rate: from 2.3 Mpix at 166 Fps to 50 Mpix at 33 Fps*Cool economy - Low power consumption with under 3 Watt and minimal heat dissipation*All-around support - support for Windows 7 and 10, macOS, Linux, ARM and embedded platforms*Industry standard - Data and control interface complies with PCI Express External Cabling Specifications*Adaptable potential - Available with two flat ribbon flex cable connectors: parallel and perpendicular *Software interfaces - GenICam / GenTL and highly optimized API / SDK for Image Processing*Connectivity and Synchronization - Programmable opto-isolated input and output, 4 status LEDs*Lens control - EF-mount Interface allows remote control of aperture, focus and image stabilization*Highly Customizable - Variety of sensor options including Sony IMX287, IMX273, IMX249, IMX265, IMX264, IMX267, IMX304 available in board level stack for OEM use and with switches and adapters*Interoperability increase - Continuous embrace of new software and hardware partners*Cost efficient - Excellent value through utilization of the newest technologies including Sony Pregius™
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USB3 Vision Cameras
xiQ
*Ultra compact mini camera- Only 26.4 x 26.4 x 21.2 mm and mere 27grams (1)*Cool - Low power consumption with 1.0 to 1.8 W and minimal heat dissipation*Fastest - High speed, high frame rate: 500fps at VGA and 90fps at 4Mpix resolutions*AIA standard - USB3 Vision standard compliant*Supported - USB3 under Windows 7 and 10, macOS, Linux, ARM and various Machine Vision Libraries*Industry standard interface - Compatible with USB 3.1 Gen1 SuperSpeed specification*Powerful potential - 5 Gbit/s interface 400 MB/s data throughput*Connectivity and Synchronization - Programmable opto-isolated input and output, 3 status LEDs*Cost efficient - Excellent value for the price, low TCO and fast ROI*Software interfaces - GenICam / GenTL and highly optimized API / SDK for Image Processing*Easy deployment - Range of accessories and widest hardware and software interoperability*Time proven - In production since the end of 2011*User friendly - Intuitive and simple to use API, easy switch from C to CS mount and more*Highly Customizable - Available in Board level (single PCB) and with different connector types