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Inspection Systems
Video Inspection Systems with?or without measurement capabilities are an excellent way to evaluate and test small items or items in?difficult to access locations. Many options are available in addition to the measurement capability. Video Inspection is used for a variety of purposes including the ability to see? and measure items that are much smaller than the eye can see or that hand tools can measure. Video systems can also reduce the eye and/or back strain associated with production environments where an operator must look in a microscope all day.
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Inspection System
CIX100
The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.
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Inspection System
Pixie
3-D Metrology for automation. Pixie is a standard system for automated optical quality inspection. Pixie can be configured with 2 to 5 servo driven axis movement and the high-speed measurement capabilities make it suitable for inline and stand-alone solutions.
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Inspection Systems
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps. EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:
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Inspection System
X-eye 7000B
Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Test Systems Inspection Systems
Different requirements demand flexibility. ELABO boasts a modular product portfolio permitting the economical creation of bespoke solutions for every client. These solutions range from individual testing devices through tabletop workstations with integrated testing equipment all the way to automated systems with ERP connections for mass production.
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Chip Inspection System
GEN3000T
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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X-ray Inspection System
RTX-113HV
A high performance real-time X-ray inspection system designed for inspection of multi-layer, assembled printed circuit boards, with dense metal BGAs, and recommended for lead free inspection requirements. Our RTX-113HV system meets all your needs for inspecting BGA packages.
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Vision Inspection System
Vision Station
Design and manufacture vision inspection system for SOT, SOD, TO, DPAK, SOIC, TSOP, SSOP, QFN/MLP, ODFN and LED inspection.
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X-Ray Inspection System
TruView™ Cube
The Perfect Solution for a Powerful Small Form Factor X-ray Inspection System. The all new TruView™ Cube X-Ray Inspection System is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. Ideal for applications where space is premium, the the TruView™ Cube X-Ray sits comfortably on your laboratory bench.
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AOI/SPI Inspection Systems
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AOI/SPI Inspection Systems
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AXI Inspection Systems
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AXI Inspection Systems
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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X-Ray Inspection System
MXI Quadra 5
Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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X-ray Inspection System
Cougar ECO / Cheetah ECO
Cheetah and Cougar ECO X-ray inspection systems for use in the electronics industry. These microfocus systems, which have been developed by Yxlon in Germany, are characterized by an excellent price-performance ratio. Being entry-level systems in two sizes, each of them provides best inspection results in quality control in the SMT and semiconductor industries.
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Defect Inspection System
F30
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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HD Inspection System
vCam-6
The vCam-6 HD inspection system from Vivax-Metrotech gives you the flexibility to cover a range of inspections including municipal collection systems, residential plumbing, indoor commercial lines, and lateral lines from three inches up to eight inches in diameter. Our camera systems use the latest technology packaged in a rugged, lightweight, compact profile made specifically for the harsh conditions related to sewer lateral inspections. All Vivax-Metrotech camera systems are backed up by a full one-year warranty, on-site training, and local support through our dealer network.
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Ultrasonic Inspection System
PULD 40
The PULD-40 is a versatile and highly accurate ultrasonic inspection system designed to meet the needs of our customers.
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IR Inspection System
EVG®20
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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CT Inspection System
FF35 CT
The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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X-ray Inspection System
TruView Prime
The TruView Prime is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. The TruView Prime is professionaly built - something hard to find in entry level systems in the TruView Prime's price range.
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Flight Inspection System
CARNAC
Compliant with ICAO, CARNAC Flight Inspection System enables flight inspection of all types of navaids: ILS, MKR, VOR, VHF, DME, Radars, VASI, PAPI, NDB, TACAN, MLS, GNSS procedures, etc. CARNAC is a compact cost saving solution designed to privilege efficiency and high precision avoiding heavy aircraft modifications and decreasing flight inspection time. It features advanced functions such as real-time processing, high-quality flight reports, calibration and remote control of the receivers, modularity, multi-missions and multi-navaids capabilities, automatic flying measurements procedures.
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Tyre Inspection Systems
The VLT tyre inspection system can check several tyre and wheel related items, such as tread depth and sideslip. All measurements are done very fast when the vehicle is on the roller brake tester.
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Concrete Inspection System
StructureScan Pro
Geophysical Survey Systems, Inc.
StructureScan Pro is a versatile concrete inspection system offering a wide variety of antenna options for concrete and other applications. Based on the SIR 4000 controller, the StructureScan Pro provides the GPR professional with solutions to any scanning situation.
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Defect Inspection System
NovusEdge
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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X-Ray Inspection System
TruView™ Fusion
The quality of your products is paramount to the success of your business. The TruView™ Fusion X-ray Inspection System allows you to "see inside" your products without destroying them, enabling unprecedented understanding of your manufacturing process. The TruView™ Fusion X-ray is the right solution if you are looking for a radiography system to inspect medical devices, printed circuit boards, electronic components, and mechanical parts.
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Vison Inspection System
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
