Showing results: 1 - 15 of 274 items found.
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CAES
HiRel signaling between devices within the system is essential in complex architectures. Backed by decades of high reliability system design expertise, CAES offers many exceptional interconnect solutions guaranteed to address this need like no other.
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POP 'N PLUG -
ALTINEX, Inc.
Pop-up style interconnect box with front and back connection points The Pop 'N Plug line of interconnects can "pop-up" into a raised position to provide access to connectors, or it can be lowered into a table when not in use. Pop 'N Plug interconnect boxes use a tower-type construction with a gas spring for smooth and comfortable operation. Many Pop 'N Plugs have two surfaces on either side of the unit, servicing both sides of a table.
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MAC Panel
Mass interconnect is a way of connecting test instrumentation to a device under test (DUT). To put it simply, mass interconnect is a very large plug and socket which connects your device under test to your test instrumentation without the mess and hassle of having to connect each signal separately.
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Pickering Interfaces Ltd.
Mass Interconnect is a mechanical interface that simplifies connection between the power supplies, instruments and switching to the Device Under Test (DUT) in a test environment. In the illustration here, a test receiver is connected to the front of the modular instrumentation, in this case, a PXI chassis.
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IPT Networks Ltd.
iTest allows you to design and group your own specific interconnect test schedule, choosing only the call test you wish to use such as Originating or Terminating party call disconnects, long duration calls, CLI verification, DTMF and correct disconnect code responses.
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Virginia Panel Corporation
Interconnect Adapters funnel wiring from modules to a VXI card. The adapter has removable side, top and bottom plates. Connector cover plates and cable clamps are ordered separately.VPC VXI adapters have been re-engineered to eliminate the need for punching holes in certain manufacturers cards. This design uses a clip that clamps down on the card's existing ejector tabs which firmly fastens the adapter to the card.
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Oxley Group
Typical industrial applications for Oxley Interconnect products include high voltage power supplies, critical computer hard drives, fire safety control equipment, medical and pharmaceutical equipment, oil and gas control systems, power generation and distribution equipment, rail and telecommunications infrastructure. Within aerospace and military markets Oxley products are typically found in aircraft, military vehicles, ground base stations, surface ships and submarines and air and ground communications equipment.
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9050TR -
Virginia Panel Corporation
50 Module solution with platform ITA support. Platform supports up to 180 lbs alone, and up to 350 lbs with optional leg kit.
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Sensata Technologies
Materials that are usable in all backend BI/reliability applicationsHigh IO count capabilityFine pitch down to 0.25 The industry’s smallest DDR4 and DDR5 socket outlineAdvanced plating technologies and custom outlines
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Virginia Panel Corporation
Designed for high I/O needs, the 9025 is a 25-module versatile solution ideal for rack mounting applicationsCan be used on a Vertical Hinged Mounting Frame to access wiring and instrumentationDesigned with room for expansion and for rapid changeover
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SCOUT -
MAC Panel
SCOUT is an innovative pull-through Mass Interconnect solution specifically designed to deliver the full performance potential of the PXI platform at the ATE interface. SCOUT, featuring DAK (Direct Access Kit) connectivity, enables system designers to limit or eliminate traditional instrument cables by replacing them with DAK connection modules that utilise PCB, flex-circuit or short wire connections.
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R&D Interconnect Solutions
Highly Configurable – Custom Pad/ Array Configurations Available•Mixed Digital, Power, RF on Same Array•Double the Compliance of a Single Pin•Air Dielectric Option for Hi-Speed/ RF•Unparalleled Performance!•< 1 dB loss @ 65GHz•Up to 4 Amps continuous•Ultra-Low Loop Inductance•Environmental -40°C to +150°C
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Advanpack Solutions Pte Ltd.
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.