Showing results: 256 - 270 of 280 items found.
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TYPE HFX-1 -
National RF, Inc
The Type HFX-1 Modulation Monitor is an ancillary piece of equipment, which is used with narrow bandwidth, or older oscilloscopes to allow viewing of RF signals and particularly modulated signals as high as 55MHz. The equipment contains an RF signal source and a broadband mixing circuit which converts the high frequency signal to an intermediate frequency within the oscilloscope’s range. The frequency control dial is simply adjusted until the RF signal is viewed on the scope. BNC connectors are mounted on the rear panel to allow interconnect to the scope and RF probe. This product was previously called "oscilloscope frequency extender" and may be used to view other high frequency signals on older or narrow band scopes.
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784122-01 -
NI
2- or 6-Port PXI Vehicle Multiprotocol Interface Module—The PXIe‑8510 is a hardware-selectable controller area network (CAN) and/or local interconnect network (LIN) interface for developing applications with the NI‑XNET driver. The PXIe-8510 excels in applications requiring real-time, high-speed manipulation of hundreds of CAN frames and signals, such as hardware‑in‑the‑loop simulation, rapid control prototyping, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move CAN frames and signals between the interface and the user program without CPU interrupts, minimizing message latency and freeing host processor time for processing complex models and applications.
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Teledyne LeCroy
Compute Express Link (CXL) is a new high-speed CPU-to-Device and CPU-to-Memory interconnect designed to accelerate next-generation data center performance. CXL technology maintains memory coherency between the CPU memory space and memory on attached devices, which allows resource sharing for higher performance, reduced software stack complexity, and lower overall system cost. This permits users to simply focus on target workloads as opposed to the redundant memory management hardware in their accelerators. CXL is based on a PCI Express 5.0 Physical layer with speeds up to 32GT/s. Teledyne LeCroy provides protocol analysis test equipment to support development and debug of CXL based devices.
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784121-01 -
NI
2- or 6-Port PXI Vehicle Multiprotocol Interface Module—The PXIe‑8510 is a hardware-selectable controller area network (CAN) and/or local interconnect network (LIN) interface for developing applications with the NI‑XNET driver. The PXIe-8510 excels in applications requiring real-time, high-speed manipulation of hundreds of CAN frames and signals, such as hardware‑in‑the‑loop simulation, rapid control prototyping, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move CAN frames and signals between the interface and the user program without CPU interrupts, minimizing message latency and freeing host processor time for processing complex models and applications.
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785324-01 -
NI
2- or 4-Port, PCIe Vehicle Multi-Protocol Interface Device—The PCIe‑8510 is a hardware-selectable controller area network (CAN) and/or local interconnect network (LIN) interface for developing applications with the NI‑XNET driver. The PCIe‑8510 excels in applications requiring real-time, high-speed manipulation of hundreds of CAN frames and signals, such as hardware‑in‑the‑loop simulation, rapid control prototyping, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move CAN frames and signals between the interface and the user program without CPU interrupts, minimizing message latency and freeing host processor time for processing complex models and applications.
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785325-01 -
NI
2- or 4-Port, PCIe Vehicle Multi-Protocol Interface Device—The PCIe‑8510 is a hardware-selectable controller area network (CAN) and/or local interconnect network (LIN) interface for developing applications with the NI‑XNET driver. The PCIe‑8510 excels in applications requiring real-time, high-speed manipulation of hundreds of CAN frames and signals, such as hardware‑in‑the‑loop simulation, rapid control prototyping, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move CAN frames and signals between the interface and the user program without CPU interrupts, minimizing message latency and freeing host processor time for processing complex models and applications.
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VC43™/VC43EAF™ -
Celadon
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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787419-01 -
NI
8-Pin 3.5 mm Pitch Connector to Nano-Pitch I/O, QSFP28 Terminal Block - The SCB-12 converts the Nano-Pitch connector to the industry-standard QSFP28 connector for interfacing I/O signals to plug-in data acquisition. This Terminal Block features the QSFP28 variant of the quad small form-factor pluggable (QSFP) transceiver for high-capacity data communication. The SCB-12 combines with shield cables to provide low-noise signal termination. Additionally, the SCB-12 supports the Nano-Pitch I/O Interconnect System that provides data transfer at 24 Gbps per lane and compatibility with PCI Express, Serial Attached SCSI (SAS), and SATA protocols. The SCB-12 breaks out the NanoPitch connector to a QSFP28 connector as well as an 8-pin connector for general-purpose DIO signals.
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5900 SERIES -
Probe Master Inc.
Probe Master's new 5900 series passive oscilloscope probes are available in 400 MHz & 500 MHz bandwidths. Probes are also available with readout actuators for oscilloscopes with the readout feature. The "GOLD PROBE" has been designed specifically for use with Tektronix, Hewlett Packard and other high performance oscilloscopes. This new slim design along with a host of versatile accessories, allows you to reach the most difficult test point in today's highly complex circuitry. The gold plated Probe Tips, Sprung Hook, Ground Lead, Alligator Tip and other critical interconnect points within the Gold Probe, provide excellent contacts for probing low level analog signals and high speed digital data. Unlike most "off shore" commodity probes, Probe Master guarantees quality and continuing domestic support for our "Made in America" Gold Probe.The probe body is made of high impact ABS. Soft molded strain reliefs at all stress points assure long cable life. In short it has been designed to offer you high performance coupled with high quality.
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CA9806 -
UC Instruments, Corp.
The UC INSTRUEMNTS CA9806 is a high performance, flexible four channel Pulse Pattern Generator and Error Detector that can operate from 1.0 to 17.0 Gb/s (consult factory for higher or lower operation speeds). It is also a standalone Bit Error Rate test solution that incorporates an internal full rate clock synthesizer. Its small size allows it to be placed close to the device under test, it can also be placed further away using the TX driver pre and post emphasis controls features to compensate for cable and interconnect losses. It also has a non destructive, integrated eye outline capture feature along with a quick eye height and width measurement capability. Build‐in 8.5 ~ 15 Gb/s eye diagram testing function.
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A8a -
atg Luther & Maelzer
The A8a test system provides the flexibility of flying probe testers while delivering high throughput testing for bare board printed circuit boards (PCBs). The target market for the A8a is the electrical test of tablet and PC motherboards and high density interconnect (HDI) products for smart phones. The A8a is designed for high productivity, reliability and test accuracy. To achieve high throughput the key feature of the A8a is a new dual shuttle system, which reduces the product exchange time to zero seconds in automation mode. In combination with the fast test speed of up to 140 measurements/second the A8a will give customers a competitive test solution for batches up to 5000 boards. A typical cycle time of a 4-up smart phone board is about 2 minutes.
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CRMS -
Ultra-Tech Enterprises, Inc.,
The CRMS is a system designed to allow any user to measure the resistance of each set of relay contacts associated with the relay under test. The test system consists of a CONTACT RESISTANCE MEASUREMENT UNIT (CRMU), a MULTIPLE RELAY TEST RACK, as well as an interconnect CABLE ASSEMBLY. Either DC or AC energy to pick and drop relay coils under test for all contact measurements is supplied from the CRMU and easily interfaces with the Multiple Relay Test Rack. For additional and more thorough testing of relays an external relay tester can be interfaced to the Multiple Relay Test Rack to supply energy to the relay coil. It is recommended that the UTE Relay Tester With Timer/Counter (UTE Product # 15967-00) be utilized so the operator can take full advantage of the unique features it offers
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Macom Technology Solutions Holdings Inc.
IEEE 802.1AE Media Access Control Security (MACsec) is an industry standard security technology that provides secure communication for Ethernet traffic. MACOM’s wire-speed Ethernet MACsec PHY products offer highly scalable and cost-effective encryption solutions to address the data security issues in wireless, carrier, data center and cloud networks. Combining MACOM’s strength in high speed, high performance mixed-signal I/O and industry leading CMOS silicon technology, MACOM’s MACsec PHY products provide line-rate encryption and authentication at a very low power-footprint that enables encryption at wire-speed on every port. They are ideal for adoption on switch/router line cards, data center interconnect (DCI) transponder and wireless xHaul aggregation systems to provide security function in addition to the connectivity to optical and copper modules.
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Model 2180 -
Magnetic Instrumentation Inc.
The unit is compact and lightweight. The basic system is 7″ wide by 2.5″ high and 12″ long. When measurements are needed below approximately 100 micro-ohm-centimeters, the basic system is piggybacked onto a second enclosure that houses a power amplifier with a current gain of ten. The combined unit measures 7″ wide by 5″ high and 12″ long. The combined unit weighs 11.5 pounds. Two short cables interconnect the two enclosures for powering the power amplifier and routing the signals to the fixture or four point probe. The front panel of the basic system includes a 32-character backlit LCD display and a set of function keys. An easy-to-use menu will allow access to user defined parameters such as sample thickness, sample volume, and calibration constants; upper and lower alarm limits, relative measurements, and several others.
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EV Group
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
