Showing results: 631 - 645 of 1280 items found.
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10753B -
Keysight Technologies
The Keysight 10753B Tripod provides a mounting for the Keysight 5519A/B laser head. The tripod allows Keysight 5530Laser Calibrationsystem optics to be located remotely from the laser head, yielding greater accuracy and simplifying fixturing. The remote setup also eliminates heat-caused distortions. The Keysight 10753B adjusts for height, rotation, tilt, and lateral offset. The tripod is collapsible, covers a height range of 900 mm (35.5 in) to 1630 mm (64.0 in), and has a net weight of 14 kg (31 lb). The Keysight 10753B tripod complements a family of measurement optics and lasers that comprise Keysight laser interferometer calibration systems.
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N1055A -
Keysight Technologies
Bandwidth options: 35 or 50 GHz (upgradable)Edge speed (10-90%, typical): 18 ps (35 GHz) or 7 ps (50 GHz)Channel options: 2 or 4 per module (upgradable) with independent skew control and up to 16 channels per 86100D mainframe Ultra-thin remote head: 1.6 m phase-stable cable, 2.92 mm (35 GHz) or 1.85 mm (50 GHz) connectors, and integrated 67 GHz diode limiters for ESD/EOS protection TDR fixture de-embedding removes effects of fixtures, cables or probes connected between remote heads and DUT
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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AX93299 -
Axiomtek Co., Ltd.
*Specification: 1 x RS-232/422/485, 1 x RS-232, 1 x Audio (Mic-in/Line-in/Line-out), 4 x USB 3.0*Dimension: 118 x 40 mm*Compliant Product: PICO880, PICO500, PICO300
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Q7M120 -
Axiomtek Co., Ltd.
*Qseven v2.0 (70 x 70 mm)*Ultra low power consumption Cortex™-A9*2 CAN*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux 3.0.35/Android 4.3*Audio
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SCM120 -
Axiomtek Co., Ltd.
*SMARC 1.0 (82 x 50 mm)*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android 4.3*Audio
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Monarch Instrument
Overall Vibration Meter and Electronic Stethoscope, display unit with electronics includes: (2) "AA" batteries, (1) Sensor Pak, (1) Carrying Case, (1) Stereo Headphones with 3.5 mm "MINI" PLUG, (1) Owners Manual.
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DPX Series -
TDK-Lambda Corp.
*Single, Dual and Triple Outputs*9.5-36 Vdc, 18-75 Vdc Inputs*Meets EN55022 Class B*1600 Vdc Isolation*-40 up to 95 °C Operating Temperature*EN61000-4 Immunity*Narrow 24.5 mm width
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Amprobe ACDC-54NAV -
Amprobe Test Tools
The ACDC-54NAV clamp-on power meter offers AC/DC current measurements to 1000 A, AC/DC voltage to 1000 V, temperature capabilities, and wide jaws to handle large conductors up to 1.6″ (40 mm) for high voltage industrial environments.
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RK-410FS -
ADLINK Technology Inc.
*EIA RS-310C 19" rackmount standard*17.8 inch (451 mm) short depth*Three 5.25" and one 3.5" shock-resistant drive bays*Two front accessible USB connectors*Adjustable hold down bar for cards
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Extech 382097 -
Extech Instruments Corporation
Extech's 382097 is a set of 100A Current Clamp Probes for Models 382095 and 382096 Power Analyzers. This clamp probe set features three probes with a 30 mm (1.2 in) clamp jaw. The 382097 comes with a two year warranty.
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CERTO series -
Heidenhain Corp.
*Interferential scanning principle*Very high system accuracy of down to ±0.03 µm*Well-matched ball-bearing guide for very high quality*Defined thermal behavior*Large measuring ranges of up to 60 mm*Interface: 11 µAPP
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510160105 -
Virginia Panel Corporation
Comes fully loaded with twin female contacts ( p/n 610138200).QuadraPaddle modules are molded on .100” (2.54 mm) centers to meet the need for high-density I/O.Primary mating module 510161101. (May mate with other ITA modules, as well.)
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XM Bond HR -
Viscom AG
Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden.
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ReaXus CP Class -
Teledyne LABS
The high performance CP Class consists of dual-headed, positive displacement piston pumps with constant pressure control, covering a wide range of flows, with pressures up to 25,000 psi. Standard fluid path material is Stainless Steel. Other available features include Hastelloy fluid path with jacketed pump heads for temperature controlled processes.The CP Class pumps are widely used for Liquid Chromatography Column packing for 4.6 mm columns, as well as many process applications. The constant-pressure feedback loop automatically adjusts solvent flow to maintain constant system pressure and allows the user to select a wide range of process parameters, including desired pressure set point, ramp rate, and upper flow rate limit.The CP Class is available as standalone units, and also with the Teledyne SSI Column Packing System (called Pack-in-a-Box). Features include:20 mL packing reservoir assembly4.6 mm pre-column assemblyTwo (2) 4.6 mm x 150 mm columns10 gram bottle of C18 stationary phaseBracket assembly to mount packing reservoir to pumpQuick-set disk to allow full control of the packing process through a computerTubing, cables and other necessary fittings for connectionsWith 5 mL/min, 24 mL/min, and 100 mL/min versions, the CP Class will meet most Liquid Chromatography Column packing and process needs.