Showing results: 661 - 675 of 1315 items found.
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Extech 382097 -
Extech Instruments Corporation
Extech's 382097 is a set of 100A Current Clamp Probes for Models 382095 and 382096 Power Analyzers. This clamp probe set features three probes with a 30 mm (1.2 in) clamp jaw. The 382097 comes with a two year warranty.
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CERTO series -
Heidenhain Corp.
*Interferential scanning principle*Very high system accuracy of down to ±0.03 µm*Well-matched ball-bearing guide for very high quality*Defined thermal behavior*Large measuring ranges of up to 60 mm*Interface: 11 µAPP
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510160105 -
Virginia Panel Corporation
Comes fully loaded with twin female contacts ( p/n 610138200).QuadraPaddle modules are molded on .100” (2.54 mm) centers to meet the need for high-density I/O.Primary mating module 510161101. (May mate with other ITA modules, as well.)
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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XM Bond HR -
Viscom AG
Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden.
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ReaXus CP Class -
Teledyne LABS
The high performance CP Class consists of dual-headed, positive displacement piston pumps with constant pressure control, covering a wide range of flows, with pressures up to 25,000 psi. Standard fluid path material is Stainless Steel. Other available features include Hastelloy fluid path with jacketed pump heads for temperature controlled processes.The CP Class pumps are widely used for Liquid Chromatography Column packing for 4.6 mm columns, as well as many process applications. The constant-pressure feedback loop automatically adjusts solvent flow to maintain constant system pressure and allows the user to select a wide range of process parameters, including desired pressure set point, ramp rate, and upper flow rate limit.The CP Class is available as standalone units, and also with the Teledyne SSI Column Packing System (called Pack-in-a-Box). Features include:20 mL packing reservoir assembly4.6 mm pre-column assemblyTwo (2) 4.6 mm x 150 mm columns10 gram bottle of C18 stationary phaseBracket assembly to mount packing reservoir to pumpQuick-set disk to allow full control of the packing process through a computerTubing, cables and other necessary fittings for connectionsWith 5 mL/min, 24 mL/min, and 100 mL/min versions, the CP Class will meet most Liquid Chromatography Column packing and process needs.
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AX92907 -
Axiomtek Co., Ltd.
*Two independent SATA channels*Fully compatible with SATA revision 2.0 and 3.0 hard drives (HDD) and Solid State Drives (SSD)*Supports RAID 0,1*Two SATA power connectors with +5V*51 x 30 mm
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ALS Co., Ltd
This quite unique material transmits only visible light whereas it does not transmit UV radiation. Our ITO electrodes consist of 100 nm thick of ITO layer deposited on quartz or borosilicate glass substrate (0.5 mm thick).
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3D Fiber Probe -
Werth Inc.
Ultra high precision 3D measurements2D image processing combined with a laser distance sensorSelf illumination modeLowest contact force of 1 µNProbe sphere diameters from 0.040 mm to 0.250 mmControl and evaluation software for fully automatic measurements
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EPS-2032 -
ADLINK Technology Inc.
*32-CH sourcing type digital output*Quick removable European type connector*Slave module healthy monitoring*Wide operation temperature range*: -20°C - 60°CCompact size: 100 (L) x 100 (H) mm
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DCX-16 (VG, SG) -
KELLER AG für Druckmesstechnik
The DCX-16 is an autonomous, battery-powered data collector in a stainless steel housing with a very small diameter of only 16 mm. In applications where a small probe diameter is an advantage, the logger can record the water level (pressure) and the temperature over long periods.
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PAX1 -
Rotork plc
The PAX1 is a flexible low voltage DC powered linear actuator featuring a 25 mm maximum thrust rod stroke moving at speeds up to 60 mm/min and a maximum thrust of 2,890 N (650 lbf) all in a flameproof enclosure.
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N1046A -
Keysight Technologies
75 GHz, 85 GHz or > 100 GHz maximum available bandwidth (selectable option, upgradable)1, 2 or 4 channels per module User-selectable bandwidth settings starting at 60 GHz Electrical inputs: 1 mm female
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MSMI 1014 -
Meltronics Systemtech
- Capable of handling up to 2688 IO signals- Capable of handling up to 1344 Power signals- Portable and Rack mountable- Suitable for more depth PCBs (up to 410mm)- Fourteen PCBs can be accommodated with Fascia plate of 30 mm width
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ICE40 LP/HX -
Lattice Semiconductor
*Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)*Integrated hard I2C and SPI cores that enable flexible device configuration through SPI*Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI*Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS*Up to 128 kbits sysMEM™ Embedded Block RAM*Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications