Showing results: 31 - 45 of 273 items found.
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DWFritz Automation, Inc.
The Gear Metrology System is a non-contact gear inspection system that generates a 3D point cloud, providing manufacturers with real-time metrology and inspection data to optimize production processes, and improve ROI.
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ZeroTouch -
DWFritz Automation, Inc.
A high-speed, non-contact metrology and inspection platform, the ZeroTouch® Flexible Metrology System rapidly captures millions of data points to create a high-precision 3D point cloud, enabling rapid measurement of complex part geometries and precise inspection of most intricate parts with low GR&R.
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Bruker Daltonics
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition.
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Qualer Search -
Qualer
Qualer Search is the first metrology search engine that enables you to find potential partners based on services provided and their location.
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ASML
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Bruker Corporation
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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DWFritz Automation, Inc.
The ZeroTouch® Linear Metrology System is a high-speed, non-contact linear inspection system ideal for measuring linear-shaped parts such as hip stems and aerospace blades faster than traditional methods.
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MTI Instruments
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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EVG®50 -
EV Group
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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BENCHMARK 300 -
VIEW Micro-Metrology
The VIEW Benchmark™ 300 is engineered for high performance and reliability in a floor model package. Advanced optics, illumination, image processing, and available Continuous Image Capture make VIEW Benchmark a world-class metrology system.
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FilmTek 2000 SE -
Scientific Computing International
Benchtop metrology system delivering unmatched measurement performance, versatility, and speed for unpatterned thin to thick film applications. Ideally suited for academic and R&D settings. Combines spectroscopic rotating compensator ellipsometry, multi-angle polarized spectroscopic reflection, and intuitive material modeling software to make even the most demanding of measurement tasks simple and reliable.
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Geomagic Control X -
3D Systems, Inc.
Geomagic® Control X™ is a comprehensive metrology software platform that delivers the industry’s most powerful tools within straightforward workflows. With Geomagic Control X quality managers are enabled with revolutionary ease-of-use, intuitive, comprehensive controls and traceable, repeatable workflows for the quality measurement process. Its fast, precise, information-rich reporting and analysis enable significant productivity and quality gains in any manufacturing workflow.
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FilmTek 2000 PAR-SE -
Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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NGS 3500Z -
RMS Vision Systems Inc
This bench top lower cost, yet high performance system is designed for applications where defect detection and precisionmeasurements on wafers and other parts (up to 200 mm) are required. It is well suited for use as a dedicated productiontool or as a versatile process development system. It features a powerful set of automated as well as semi-automaticoptical/ video tools optimized for high accuracy, production throughput, and ease of use.This automated and versatile platform features a standard Nikon/ Olympus bright/ dark field microscope with optionalNomarski, and precise part staging. This system offers significant and unique advantages for dual production/ engineeringuse, and provides the perfect solution when both defect detection and dimensional metrology are required.
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PINNACLE PLUS -
VIEW Micro-Metrology
Pinnacle+ Plus elevates Pinnacle performance to the next level. Pinnacle+ Plus features a rigid granite optical support structure and a high performance Z-axis motion assembly to produce the lowest possible uncertainty on micro-electronic parts and assemblies/
