Showing results: 3811 - 3825 of 10234 items found.
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778771-01 -
NI
8 AI (14-Bit, 2.5 MS/s/ch), Buffer Size 16MS, 8 DIO, PXI Multifunction I/O Module—The PXI‑6133 is a simultaneous-sampling, multifunction data acquisition device. It offers analog input, digital I/O, two 24-bit counters, and digital triggering. The PXI‑6133 is ideal for a variety of applications, such as IF digitization; transient recording; ISDN, ADSL, and POTS manufacturing test in the telecom industry; ultrasound and sonar testing; and high-energy physics.
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cExpress-AR -
ADLINK Technology Inc.
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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COM-HPC-sIDH -
ADLINK Technology Inc.
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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CEM311 -
Axiomtek Co., Ltd.
The CEM311 is designed to support the Intel® Pentium® N4200 quad-core and Celeron® N3350 dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the CEM311 with the support of DX12.0, OCL 2.0, OGL 4.3 delivers outstanding graphics computing, 4K resolutions and media performance. The rugged system on module supports a wide operating temperature range from -20°C to +70°C to ensure stable operation in harsh environments. The embedded platform offers onboard 4GB or 8GB of DDR3L memory and an optional eMMC flash up to 64GB. Overall, the CEM311 can be served as an excellent solution for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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SKU-086-32 -
Amfeltec Corp.
PCI Express Carrier board was designed to expand modern motherboards that have PCI Express interface. It allows connection of up to 2 M.2 PCI Express SSD modules.PCI Express Carrier board is one-slot-wide, half-height and it compliant with PCI Express Specification 3.0 and M.2 Specification 1.1.
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AMSTX-CF Series -
ADLINK Technology Inc.
Embedded graphics enables system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management, along with other embedded segments.
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DLAP-3000-CF Series -
ADLINK Technology Inc.
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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SKU-086-01 -
Amfeltec Corp.
The Squid PCI Express Carrier board for M.2 SSD modules is the second product in the Squid PCI Express Carrier Board™ family. PCI Express Carrier board was designed to expand modern motherboards that have PCI Express interface. It allows connection of up to 4 M.2 PCI Express SSD modules. This product is recommended for use in Mac Pro Desktop computers.
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510143003 -
Virginia Panel Corporation
Signal, Module Insert, Receiver, i2 MX, 84 Position, QuadraPaddle, Fully Loaded w/ Twin Female Contacts (p/n 610138200)
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AMCX1553-xT -
AIM GmbH
MIL-STD-1553 Test and Simulation modules for PMC with 1 or 2 Dual Redundant streams plus 8 Discrete I/O’s (on Rear-I/O).
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610131108 -
Virginia Panel Corporation
Mini Pneumatic, Contact, Receiver, Hose Barb for 1/8" [3.2 mm] ID Tubing, Fits Mini Coaxial/ Mini Power modules.
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LEC-BW -
ADLINK Technology Inc.
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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LEC-Starterkit 2.0 -
ADLINK Technology Inc.
The LEC-Starterkit 2.0 consists of a SMARC 2.0 compliant LEC-BASE 2.0 carrier board, data media, an AC/DC adapter, power cords and is suitable for LEC-AL, LEC-BT, LEC-BTS or LEC-BW modules.
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CEM881 -
Axiomtek Co., Ltd.
The CEM881 COM Express Type 6 compact form factor module is powered by the latest 14nm 5th generation Intel® Core™ i7/i5/i3 or Celeron® processor with low 15 Watt TDP. The advanced computer-on-modules CEM881 provides advanced processing and high graphics performance combined with cool and efficient operation. With one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB, the extremely small SoC module boosts its fabulous computing performance, industrial grade wide temperature, and seismic design. The rugged and powerful CEM881 is an ideal solution for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, transportation, Internet of Things-related, automated optical inspection (AOI), digital signage, gaming machines, military, and networking.
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CEM501 -
Axiomtek Co., Ltd.
The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.