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Showing results: 7681 - 7695 of 10234 items found.

  • 6U VME Single Board Computers

    North Atlantic Industries

    NAI's modular 6U VME single board computers can be configured with up to six NAI intelligent I/O and communication function modules. Choose from more than 40 intelligent I/O, communication, and Ethernet switch functions for the highest packaging density and greatest flexibility of any SBC board in the industry. NAI will integrate your choice of SBC and I/O functions to quickly meet your rugged system requirements. These SBCs are specifically designed for rugged defense, industrial, and commercial applications.

  • 3U cPCI Single Board Computers

    North Atlantic Industries

    NAI's modular COTS 3U cPCI SBCs can be configured with up to three NAI intelligent I/O and communications function modules. Now you can choose from more than 40 intelligent I/O, communications, and Ethernet switch functions for the highest packaging density and greatest flexibility of any SBC board in the industry. NAI will integrate your choice of SBC and I/O functions to quickly meet your rugged system requirements. These SBCs are specifically designed for rugged defense, industrial, and commercial applications.

  • 3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)

    68INT6 - North Atlantic Industries

    The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.

  • Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor

    CT-3620 - ADLINK Technology Inc.

    The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).

  • 8 Channel Fast Amplifier

    V975 - CAEN S.p.A.

    The Mod. V975 is an 8 channel fast rise time amplifier housed in a 1-unit VME module; each channel features a fixed voltage gain of 10. Channels are bipolar, non-inverting and can be cascaded in order to obtain larger gain values. Input bandwitdth is 250 MHz for signals up to 50 mVpp and decreases for larger ones (up to 110 MHz @ 400 mVpp). Each channel is provided with three LEMO 00 connectors, one for the input and two bridged for the output.

  • 16 Channel Multievent QDC

    V792N - CAEN S.p.A.

    The Model V792N is a 1-unit wide VME 6U module housing 16 Charge-to-Digital Conversion channels with current integrating negative inputs (50 Ohm impedance). For each channel, the input charge is converted to a voltage level by a QAC (Charge to Amplitude Conversion) section. Input range is 0 ÷ 400 pC. The Model V792N features LEMO 00 connectors for both input and control signals. The outputs of the QAC sections are multiplexed and subsequently converted by two fast 12-bit ADCs.

  • Lighting Reliability

    PIMACS CO., LTD.

    LED/OLED package lifetime is highly dependent on thermal management, and LED lamp performance can be dependent on the luminaire in which it is installed. Lighting reliability test system for LED/OLED Products are widely used for normal /accelerated aging, lumen maintenance measuring, lifetime evaluation and temperature characteristic testing for LED/OLED products including LED package, array, module, OLED module and luminaires.

  • RF/Wireless Test Fixtures

    Test Head Engineering, LLC

    Test‐Head Engineering develops and manufactures RF Test Fixtures which allow the testing of RF and Wireless modules and components.

  • ARINC825 Cards

    AIM GmbH

    AIM’s ARINC825 cards can work either with full functionality as an active CAN node for testing and simulating or in listening only mode for monitoring and recording purposes of Avionic CAN bus (ARINC825) applications on up to 4 electrically isolated CAN bus nodes concurrently. All nodes are in conformance with the ISO11898-1/-2 standard. They are accessible by software separately and can be used as 4 independent CAN bus nodes. An onboard IRIG-B time decoder allows users to accurately synchronize single or multiple modules to a common time source. All supported signals are available through front I/O and rear I/O interface. ARINC825 cards consist of FPGA based CAN interface controllers as well as a FPGA based 32-bit microcontroller core and a separate processor for IRIG-B synchronization with high resolution time stamping. All nodes are operating concurrently at CAN bus high speed bit rate of up to 1Mbit/s with the intelligence to process scheduling of CAN frames in real time onboard to significantly off-load the host processor.For embedded applications the AMC825-4 PMC module is available in a conduction cooled version. Using AIM’s family of PCI, CPCI (3U and 6U) and VMEbus carrier cards for PMC our clients have off the shelf solutions in a broad range of card formats. ARINC825 (CAN bus) modules are delivered with an Application Programming Interface (API) and Driver Software compatible with Windows, Linux and VxWorks.An ARINC825 Resource Component is available for AIM’s PBA.pro™ databus test and analysis tool including Tx and Rx simulation capabilities, a Chronological Bus Monitor and support for decoding of payload data within CAN messages. This allows to implement a powerful ARINC825 (CAN bus) analyzer or a complete test system in conjunction with other AIM avionics databus interfaces and PBA.pro™ supported 3rd party hardware.

  • SMARC V2.0 SoM With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB RAM, 64GB EMMC, CAN, MIPI CSI/DSI And HDMI 2.0

    SCM180 - Axiomtek Co., Ltd.

    The SCM180 is a SMARC v2.0 system on module with a choice of quad- or dual-core Arm® Cortex®-A53 processors. The ultra low power, high performance, RISC-based module measures only 82 x 50 mm and utilizes the powerful i.MX 8M processor. Its scalability, optimized pinout schematic and low profile design offers high level of versatility to help system integrators drive their important projects forward. The SCM180 is unique among other SMARC modules of its kind because it features Trusted Platform Module (TPM) for optimum security. With a discrete, dedicated microcontroller designed to support hardware encryption and decryption, the SCM180 delivers enhanced security for an added layer of protection. It also offers a choice of operating temperature ranges and can operate reliably in harsh environments. The SCM180 is suitable for a wide range of smart, portable/mobile-integrated IoT applications including robotics, automotive, factory automation, smart agriculture, casino gaming, medical, retail, surveillance and more. With its NXP artificial intelligence core technologies-enabled capabilities, the SMARC module can be programmed to support smart automation and machine-learning application requirements.

  • Gated IF RCS Systems

    Innovative Technical Systems

    Innovative Technical Systems has designed many instrumentation systems for radar cross section (RCS) measurements. Some of the designs are based around standard network analyzers for signal processing, while utilizing high PRF short-pulse RF transceivers with gated IF architecture. The modular design approach uses separate transmitter and receiver modules for monostatic or bistatic measurements. Compact module design provides flexibility to mount the transmitters and receivers close to the antennas. Dual-channel designs permit full polarization matrix measurements with either electromechanical or solid-state switches. Modules are available in various bandwidths that extend from 100 MHz to over 100 GHz.

  • Boundary-Scan DIMM Socket Tester

    ScanDIMM - Corelis, Inc.

    Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.

  • Laser Diode Light Current Voltage (LIV) Test Instruments

    Yelo Ltd.

    The Yelo LIV test instrument allows LIV measurements to be taken from laser devices loaded into a Yelo module. This module can also be used with the Yelo Y1000L Low Power Burn-in system. The LIV test instrument has been designed for easy operation. Once powered on, and with laser supply enabled, the touch screen can be used to initiate, monitor and review measurements of laser devices.

  • PXI Dual 32x4 Matrix 1-Pole Switching

    40-534A-021 - Pickering Interfaces Ltd.

    Typical applications include signal routing in Functional ATE and data acquisition systems. These PXI matrix modules are constructed using high reliability sputtered Ruthenium reed relays, offering >109 operations to give maximum switching confidence with long life and stable contact resistance. Larger matrices may be constructed by daisy chaining the common signals from multiple PXI modules.

  • PXI Dual 32x4 Matrix 1-Pole Screened

    40-534A-021-S - Pickering Interfaces Ltd.

    Typical applications include signal routing in Functional ATE and data acquisition systems. These PXI matrix modules are constructed using high reliability sputtered Ruthenium reed relays, offering >109operations to give maximum switching confidence with long life and stable contact resistance. Larger matrices may be constructed by daisy chaining the common signals from multiple PXI modules.

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