Showing results: 8551 - 8565 of 10255 items found.
-
40-560B-021-138X8-M -
Pickering Interfaces Ltd.
The 40-560B-021-138x8-M is an ultra high density matrix module with dual analog buses and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays.
-
40-560B-021-92X8-M -
Pickering Interfaces Ltd.
The 40-560B-021-92x8-M is an ultra high density matrix module with dual analog buses and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays.
-
40-560B-021-184X8-M -
Pickering Interfaces Ltd.
The 40-560B-021-184x8-M is an ultra high density matrix module with dual analog buses and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays.
-
40-560B-021-230X8-M -
Pickering Interfaces Ltd.
The 40-560B-021-230x8-M is an ultra high density matrix module with dual analog buses and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays.
-
40-560B-021-276X8-M -
Pickering Interfaces Ltd.
The 40-560B-021-276x8-M is an ultra high density matrix module with dual analog buses and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays.
-
Data Patterns Pvt. Ltd.
Redundant Strap down Inertial Navigation System (RESINS) checkout test station comprises of cPCI chassis with various functional I/O modules like ADC, DAC, DIO, VFC, Relay matrix, MIL 1553, GPIB, Serial communication interfaces and Custom Built System interface adaptor.
-
40-560B-121-230X8-M -
Pickering Interfaces Ltd.
The 40-560B-121-230x8-M is an ultra high density matrix module with dual analog buses and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays
-
40-560B-121-506X8-M -
Pickering Interfaces Ltd.
The 40-560B-121-506x8-M is an ultra high density matrix module with dual analog buses and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays
-
40-560B-121-138X8-M -
Pickering Interfaces Ltd.
The 40-560B-121-138x8-M is an ultra high density matrix module with dual analog buses and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays
-
40-560B-121-184X8-M -
Pickering Interfaces Ltd.
The 40-560B-121-184x8-M is an ultra high density matrix module with dual analog buses and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays
-
784782-01 -
NI
PXIe, 9-Slot (8 Hybrid Slots), Up to 8 GB/s PXI Chassis - The PXIe-1088 features an all-hybrid backplane to meet a wide range of high-performance test and measurement application needs. The hybrid connector type in every peripheral slot enables the most flexibility in terms of instrumentation module placement.
-
784058-01 -
NI
PXIe, 18-Slot (17 Hybrid Slots), Up to 4 GB/s PXI Chassis—The PXIe-1084 features an all-hybrid backplane to meet a wide range of high-performance test and measurement application needs. The hybrid connector type in every peripheral slot enables the most flexibility in terms of instrumentation module placement.
-
Model 71630 -
Pentek, Inc.
- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- One 1 GHz 12-bit A/D- One 1 GHz 16-bit D/A- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- Front panel clock/sync bus for multimodule synchronizationPCI Express (Gen. 1 & 2) interface up to x8 wide- Optional user configurable gigabit serial interface- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- Synchronize up to four modules with Model 7192 System Synchronization and Distribution Amplifier - PMC/XMC- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
-
DZ-100 -
HORIBA, Ltd.
The DZ-100 inherits the same CRITERION™ technology—a differential pressure detection system for laminar viscous flow ranges—used on HORIBA STEC’s MFC, the D500. This innovative technology controls the mass flow of various gases with high precision. As with the D500, the user-configurable DZ-100 supports multi-range and multi-gas applications. The compact design of the MFC reduces the internal volume of the internal gas flow path, and the optimized control algorithm improves response characteristics. It uses a compact CPU with high processing capacity, and the piezo drive circuit and control CPU are installed in the MFC module while the power supply components are housed in a separate small control box. Up to four MFC modules can be controlled by connecting them with the dedicated miniature connectors.
-
3U PMC Carrier -
PCI EmbeddedComputer Systems
This conduction cooled 3U CompactPCI single slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens carrier and PMC module enabling the board to resist high shock and vibration.