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product
Mezzanine System
5041
ECM P/N 5041 provides eight channels of RS485 / RS422 I/O with fixed 120 ohm termination for each channel. Speeds are up to 30M bits per second. All channels power up as inputs. Also transceiver inputs are always enabled for loop back diagnostic use when the outputs are enabled. Software can enable outputs on a channel by channel basis.
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Mezzanine System Carrier
MMS6245
The MMS6245 gives you the ultimate flexibility in rugged embedded I/O by allowing you to customize the 64 user-configurable front panel signals with our patented Electrical Conversion Module (ECM) technology. This configurable XMC carrier can host up to four ECMs giving you the ability to customize I/O to your specific needs.
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Mezzanine System
5158
The 5158 Electrical Conversion Module (ECM) provides eight (8) RS-232 outputs and eight (8) RS-232 inputs. Built around Maxim 1488 & 1489 chips for true RS232 levels and voltage tolerance, all outputs come up in the 1, mark or idle state. Electrically this is a negative output voltage, the start bit is always a 0 or a positive voltage level.
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Mezzanine System Carrier
MMS8010 / MMS8011
The Abaco ECM 3U VPX carrier supports up to six Abaco Systems Electrical Conversion Modules (ECMs) in a VITA 46 VPX form factor. Each ECM site connects 32 single-ended 3.3 V signals to the FPGA. The specific ECM board installed on a site converts the FPGA signals to 16 I/O signals, for a total of 96 I/O signals across the six ECM sites.
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Mezzanine System
5658
ECM P/N 5658 provides eight channels of 16 bit current measurement in the 0 to 25 milli-amp range. Each channel allows independent common mode voltages from -100 volts to +100 volts. Current detection is accomplished with a precision 100 ohm current sense resistor, creating a voltage drop of 2V in the current loop at 20 milli-amps.
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Mezzanine System
3564
The 3564 is a four channel comparator board with a common mode range of -150V to 150V on the two differential inputs and a DAC per channel to set trigger levels. The high common mode range and DC coupling provides a robust solution to level detection and triggering.
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Mezzanine System
5047
The 5047 provides breakout of all ECM signals for debug, design validation and development. Plated through holes on the PCB allow soldering of probe wires to IO, Data, Power and Serial Identification signals. LEDs indicate presence of 3V, 5V, +12V, -12V and Ground. Elevates the ECM module by 2 mm and saves wear on the ECM carrier board connectors. Since this is a debug too there is no serial identification circuit.
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Mezzanine System
5147
ECM P/N 5147 provides two channels of 12 bit A/D conversion using the Analog Devices AD9235, and is suitable for medium resolution high speed applications. The two differential inputs are terminated in 120 ohms and buffered with a gain of 1 differential amplifier. Differential Input range is +/-3.0V. Sample rates are 20MHz per channel with a 5MHz 4 pole elliptical analog input filter.
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Mezzanine System
5093
ECM P/N 5093 provides 2 independent full bridge circuits. The two full bridge circuits can be used together to drive one small two phase stepper motor. Each full bridge circuit can drive one small dc motor or other bipolar load. Note all inductive loads should employ transient protection.
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Mezzanine System
5085
ECM P/N 5085 provides two channels of 24 bit A/D conversion suitable for high resolution low speed applications, which include bridge circuits, thermocouples, RTD and voltage measurements. For bridge applications each channel provides a fused +5 Volt or a current source drive.
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Mezzanine System
5081
The 5081 provides four channels of 12 bit digital to analog voltage output, with multiple single ended output ranges. Each channel is software selectable for 0 to +5V, 0 to +10V, +/-2.5V, +/-5V, +/-10V or -2.5 to 7.5V ranges. The outputs reset to 0.0 volts on power up.
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Mezzanine System
5089
The 5089 provides eight channels of 12 bit A/D conversion using the Analog Devices AD7328, and is suitable for medium resolution medium speed applications.
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TO-CAN Package Inspection System
7925
Chroma 7925 is an automatic inspection system for TO-CAN package. The appearance defects over 30 um like lens scratch, partial are clearly conspicuous by using advanced illumination technology. Because the height variation of tray and package exists, Chroma 7925 can calculate the focus distance and compensate to overcome the variation with auto focus function.
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Wafer Chip Inspection System
7940
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Multi-Functional Optical Profiling system
7505-01
Chroma 7505-01 is the newest multi-function optical inspection system that equips with the capability of measuring 1D, 2D and 3D at the same time. Penetrating reflection measurement is used for 1D film thickness measurement to measure the non-destructive film thickness on transparent and translucent material.
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Multi-Functional Optical Measuring System
7505-05
Recent advancement in optical inspection technology continues to find its path into a variety of market applications. Innovative automated optical testing has become essential and indispensable in areas such as effective dimensional measurement to ensure product manufacturability and process control.
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Inline Printing Quality Automated Optical Inspection System
7505-K009
The Chroma 7505-K009 Inline Printing Quality Automated Optical Inspection System equipped with high-resolution camera can perform 2D defect detection that is suitable for Roll to Roll processing and on-line control. Both front and rear sides can be inspected at the same time.
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Laser Diode Characterization System
58620
The Chroma 58620 Laser Diode Characterization Station is a state-of-the-art full turnkey system specially designed for laser diode testing. Features range from macro inspection of the facet or aperture active area to a full suite of electro-optical parametic tests.
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Inline AOI System
7505-02
The 7505-02 Automated Optical Inspection System is integrated with high speed camera to shoot Roll to Roll manufacturing processes of ITO (Indium Tin Oxide) film, RFID and FPC that is Line-scan Image Inspection System with PC-based structure.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Battery Cell Formation System
17000 series
Chroma 17000 series is specifically designed for the formation of Lithium Ion and Lithium Polymer secondary batteries. The 17000 series is a complete turn-key system, including carrier trays, robust battery probe contacts, high quality charge/discharge modules and intuitive software all under computer control. Patented Battery Voltage Tracking (BVT) DC-DC conversion power modules minimize power consumption in battery charging, and Energy Recycle Modules (ERM) recycle the discharged energy directly back to the DC power system for increased power efficiency. These power saving designs provide a planet friendly solution along with cost savings by reducing energy consumption. The intuitive software provides a flexible selection in the charge/ discharge channel, current rating, and modules under test. These features allow the Series 17000 to be used for final cell development, pilot line production, high volume production and ongoing reliability monitoring/quality control.
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Automatic Optical Cell/Wafer Inspection System
7200
Among several factors for PV to achieve grid-parity, Reliability of the PV Modules plays an important role. Since its known that some of the cell defects such as edge chips/ flakes, bumps of cell surface were proved to be source of infant mortality of the c-Si PV modules, therefore, to detect those defects is very important for c-Si cell manufacturers.
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3D Wafer Metrology System
7980
Chroma 7980 Wafer Metrology System applies White Light Interference Measurement Technique to perform nondestructive and rapid surface profile measurement and analysis.
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SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Rugged Convection Cooled System with Intel® Xeon® Processor and MIL-DTL-38999 Connectors
HPERC-KBL-MH
Inside the tiny footprint of ADLINK’s HPERC lives the power of Intel® Xeon® processor and optional GPGPU parallel processing engine based on a NVIDIA Quadro MXM module. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.
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NVIDIA® Jetson Xavier™ NX Edge AI Vision Inference System
EOS-JNX Series
The EOS-JNX series has a built-in Smart PoE feature to control PoE power remotely to reduce maintenance efforts in challenging environments and provides PoE power loss detection to alert of any unexpected PoE disconnection. The EOS-JNX-I is designed as an AI PoE switch for connecting to IP cameras to enable AI inferencing, and also provides an uplink port to connect to a network video recorder (NVR) for recording video streams, making upgrading existing surveillance systems easy. The EOS-JNX-G is designed for industrial AI machine vision applications, providing a dedicated bandwidth of 1Gb per channel with a GigE camera connection, which is crucial for production line and manufacturing applications.
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VME Data Acquistion System
ADM-31
The VME-based ADM31 data acquistion system supports up to 48 differential or up to 96 single-ended analog inputs. The ADM31 control card is an intelligent A/D subsystem master or slave device that controls the analog A/D cards. Up to two A/D cards can be configured with the control card to complete the A/D system.
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Dual Sensor Enhanced Vision Systems
EVS
Enhance your safety and situational awareness while flying with Max-Viz dual sensor enhanced vision systems (EVS) from Astronics. These multi-spectral imagers include a long wave infrared sensor, a visible light + near infrared sensor, and patented blending and dynamic range management image processing to enable pilots to see clearly during day and night.