Showing results: 271 - 285 of 631 items found.
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Omron Industrial Automation
Is available as a four or six-pole type in various contact combinations and offers reinforced insulation. Terminals are arranged for easy PCB layout.
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Mounting On Circuit Board Or DIN Rail -
INELTA Sensorsysteme GmbH & Co. KG
*PCB mounting*Suitable as: setpoint device or rotary actuator*Compact in design* Robust aluminium housing* Gear safety clutch
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Series 45000X & 65000X -
Aries
SOIC & SOJ to DIP Adapters. A cost effective means of upgrading to SOJ or SOIC...without changing your PCB layout.
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SparkFun Electronics
Here is a very simple breadboard power supply kit that takes power from a DC wall wart and outputs a selectable 5V or 3.3V regulated voltage. The .1" headers are mounted on the bottom of the PCB for simple insertion into a breadboard. Pins labeled VCC and GND plug directly into the power lines. The lone pair of pins have no electrical connection but help support the PCB.
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Series 35000X -
Aries
SOIC & SOJ to DIP Adapters. A cost effective means of upgrading to SOJ or SOIC...without changing your PCB layout.
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Equip-Test Kft.
*3 to 6 Ghz *PCB MCX SMB SMC *SMA U. FL MS / MM Fakra *Exchangeable inner plunger
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nRF52832 Series -
Raytac Corp
Raytac nRF52832 module spectrum covers MDBT42Q, MDBT42 and MDBT42V series with both Chip Antenna and PCB Antenna option for selection.
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Advantech Co. Ltd.
Advantech's OSM, the SGeT standard for PCB soldering design with NXP platforms, boasts an ultra-low power, miniaturized design for AIoT endpoints.
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Ironwood Electronics
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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National Technical Systems
Microsectional Analysis remains the most widely accepted means for analyzing the PCB/PWB plated through-hole integrity. A PCB is a combination of different types of materials such as glass, aramid fibers, kapton, copper, acrylic adhesive, epoxy, polyimide, Teflon, and solder. Each of these materials has a different relative hardness and, coupled with that of the mounting media such as epoxy or acrylic, makes the PCB microsection one of the most difficult to perform.
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MS-11e -
MIRTEC Co., Ltd.
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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MS-15 -
MIRTEC Co., Ltd.
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Ironwood Electronics
*Package-size PCB footprint: Since the PCB footprint of G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
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WSD-2A -
Langeo Co., Ltd.
WSD-3 system is developed on the basis of years’ research and integrated with the latest technologies, such as 14bit A/D, surface mount technology and multi-layer PCB, etc.