Showing results 121 - 135 of 259 products found.
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Atomtex
This Radiation monitor package is designed to measure flux density and surface activity of 239Pu alpha particles, as well as to simultaneously monitor gamma radiation ambient dose equivalent rate and ambient dose equivalent at system operator''s location.
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DANFYSIK A/S
We offer a wide selection of electrostatic devices for various applications in particle accelerators. They range from electrostatic quadrupole lenses, beam bcanning systems for small accelerators and Wien filters to large electrostatic dipole analysers for spectrometers.
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ZIII - McBain Systems
The McBain ZIII Micro Inspection System is the industry standard for CD measurements and inspection, pre/post dicing inspection, pre/post probing inspection, mask inspection, image stitching and critical particle counting.
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FFF - Wyatt Technology
Is a separation technique where a field is applied to a fluid suspension or solution pumped through a long and narrow channel, perpendicular to the direction of flow, to cause separation of the particles present in the fluid, depending on their differing "mobilities" under the force exerted by the field.
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Bruker Nano Analytics
Our range of techniques includes MRI (Magnetic Resonance Imaging) , PET (Positron Emission Tomography), SPECT (Single Photon Emission Computed Tomography) micro-CT (Micro Computed Tomography), optical imaging and magnetic particle (MPI) imaging.
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GrayWolf Sensing Solutions
GrayWolf DirectSense® monitors interface with GrayWolf 6 channel handheld particle counters and with Thermo MIE™ pDR particulate concentration meters. Display and log particulates right on the DirectSense® mobile PC.
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EV Group
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Electrogrip Company
Lightweighted and low-expansion chucks with 10nm active-area flatness are required in EUV lithographic tools. These chucks also have low outgassing and low particle generation.
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Spectris plc
Materials Analysis provides products that enable customers to determine structure, composition, quantity and quality of particles and materials, during their research and product development processes, when assessing materials before production, or during the manufacturing process. Our products help customers to improve accuracy and speed of materials analysis in the laboratory. We see a growing demand for the application of our solutions in quality and process control. Our key customers in this segment are leaders in the metals, minerals and mining, pharmaceutical and academic research industries. The operating companies in this segment are Malvern Instruments, PANalytical and Particle Measuring Systems. Malvern Instruments and PANalytical merged on 1 January 2017.
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DEM Solutions Ltd.
Whether you want to deploy Discrete Element Method in your research or want to expand your curriculum with a DEM-related subject, EDEM software can add another dimension to your research and help expand horizons for your students. * Combine DEM simulation with experimental investigation to understand processes involving particles, * Develop new equipment and methods for bulk solids handling and processing, * Investigate fundamental characteristics of particle systems
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Underwriters Laboratories Inc.
Indoor air quality is a particular concern when it comes to electronics that, when heated during operation, can release volatile organic chemicals (VOCs) and particles into the air. UL conducts product emissions testing on electronic equipment, including printers, consumer electronics, information and communications equipment, and appliances. Testing follows the guidelines of ISO/IEC 28360.
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Underwriters Laboratories Inc.
Indoor air quality is a particular concern when it comes to electronics that, when heated during operation, can release volatile organic chemicals (VOCs) and particles into the air. UL conducts product emissions testing on electronic equipment, including printers, consumer electronics, information and communications equipment, and appliances. Testing follows the guidelines of ISO/IEC 28360.
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TSI Inc.
Electronic products are part of the world we live in. The constant need for increased processing power in a smaller package has driven the size of line widths inside components into the nano-particle size range. This means smaller, nano-size particles can disrupt manufacturing processes and impact yields which impacts the bottom line.
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Fraunhofer-Gesellschaft
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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NANO-flex® - Particle Metrix GmbH
Nanoparticle Measurement Device for Particle Size Distribution with 180 DLS Dynamic Light Scattering. System for characterization of colloids by dynamic light scattering within a size range of 0.8 nm to 6.5 m. Suitable for material systems with concentrations from ppm up to 40% vol., depending on substance type. Minimum is 1 droplet.
