Showing results: 76 - 90 of 106 items found.
-
SortMax300™ -
Genmark Automation
Genmark's SortMax300™ is a next generation SORTER producing the highest throughput rapid software set-up and lowest cost-of-ownership culminating from 25 years' experience in design, development, and manufacture of wafer handling equipment.High throughput is achieved using Genmark’s high precision robots, including the robot series featuring the patented GPR technology robots enabling automatic compliant interaction with misaligned process modules and capable of deflection compensation during transport of high payloads.
-
WaveCore™ Products -
Textron Systems
Textron Systems’ WaveCore family offers a variety of standard test systems with a primary application of satellite payload lab testing. Our systems can be deployed affordably for both production and engineering applications, providing industry-leading levels of data correlation with high system mean time between failures and low mean time to repair.
-
ELMA Electronic, Inc.
Embedded Computing Systems require more than just a chassis housing with backplane, power supply, cooling and payload boards. To compliment our wide range of systems, Elma offers a comprehensive range of system level accessories, including: I/O solutions, HMI displays, system/power management controllers and test & development boards.
-
Tau® SWIR -
Teledyne FLIR
FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
-
GB4P -
Genmark Automation
The GB4P Robot System with integral wafer pre-aligner is the most compact robot and pre-aligner package available on the market today for wafer handling applications up to 200mm, standard payload and throughput.Identical in size to Genmark’s original GB4 robot, the GB4P houses a built-in pre-aligner for wafers ranging from 2"- 8" in diameter. The adjustable feature on the pre-aligner allows for simple and fast configuration for different wafer sizes. Engineered for single or dual wafer transport, the GB4P robot is available with an extensive variety of reach and vertical stroke combinations.
-
Teledyne Marine Gavia ehf.
The Gavia Science Bay Module is a generic payload module that allows a Gavia user to add up to six scientific sensors to the Gavia AUV. The module includes several hull penetrations, including four (4) penetrations that can accommodate WetLabs ECO pucks, two external wet plugs that can provide power and serial communication for external devices, one slot for a SeaBird CTD, one penetration that can accommodate an Aanderaa Optode oxygen sensor, as well as a weak link on the bottom of the module. The weak link provides the option of towing an external sensor and reduces stress on the wet plug.
-
Elbit Systems of America®
Elbit Systems of America’s Degraded Visual Environment (DVE) solution uses intuitive 3D grid symbology along with a helmet tracker to provide critical helicopter/tilt-rotor cues during brownout operations. This system, which is an upgrade to the head-up display installed on many military helicopters, removes weight or drag penalties by eliminating nose-mounted sensors. The helmet tracker provides numerous ancillary benefits such as depicting the other pilot’s Line of Sight (LOS) for improved crew coordination, as well as providing the ability to slew weapons or optical payloads to the pilot’s LOS, hands-free and heads-up.
-
PCIe8LXMCX2 -
Dynamic Engineering
A powerful PCIe 24 lane switch is at the center of the PCIe8LXMCX2 design. The switch has many capabilities including operating from 1-8 lanes, operating at Gen 1-3, supports lane reversal and polarity inversion (in case your XMC is not quite right), Support for max payload size transfers up to 2048 bytes ea., fully compliant with the PCIe base specification 2.0. The switch has 8 PCIe lanes connected to the PCIe "gold fingers" and 8 to each of the XMCs. Option to interconnect rear IO between XMC devices. Industrial Temperature components.
-
NetFort
Wire data is data contained within the headers and payloads of network packets as traffic moves from one node to another. It is a rich source of user and application information.Wire data can be derived from SPAN ports, TAPs, packet brokers or locally on systems using promiscuous mode packet captures. PCAP captures from tools like Wireshark are also useful wire data sources.
-
ARCX-4000 -
Acromag, Inc.
Typical applications include military/aerospace deployable systems such as: vetronics, C4ISR, payload management, as well as command and control for drones and robotics. More specifically the ARCX is perfect as a portable data acquisition system in an aircraft by adding a 1553 interface board to a dual unit. Add a FPGA and high-speed graphics card for high-speed video transfer. For multi-sensor monitoring on mobile applications simply add a CAN bus interface.
-
Elbit Systems of America®
The Skylark I-LE leverages the heritage of the operationally-proven Skylark®1 Unmanned Aerial System (UAS) that is employed across the world by many coalition partners. The long endurance (LE) version of the Skylark extends the endurance of the system to approximately three hours. The system couples various gimballed payload options with proven flight control algorithms derived from the Hermes® 450 UAS to provide effective target detection, target tracking, and low operator workload for Intelligence, Surveillance, and Reconnaissance (ISR) missions. This portable Group 1 Small UAS (SUAS) offers capabilities that are normally found in larger unmanned systems.
-
Hermes 450 -
Elbit Systems of America®
The Hermes 450 Unmanned Aerial System (UAS) is a highly reliable, mobile and deployable unit with 15 years of service and more than 100,000 hours of flight time. The fully composite, fully operational Hermes 450 may be launched and recovered from both prepared and semi-prepared runways. This medium-size, multi-payload UAS can operate two payloads simultaneously and provide persistent surveillance with endurance in excess of 18 hours and up to 30 hours with the optional external fuel tanks. The Hermes 450 offers high operational versatility for both military and non-military use, with manual or fully autonomous flight capabilities and common, cutting-edge, redundant avionics.
-
fcXplorer Simulyzer -
Avionics Interface Technologies
FC-1, FC-2, and FC4 Analyzer modes and displays - Frame parser for custom display of FC frames and payload data - Captured data can be saved as binary or “csv” files - User-defined trigger and filter features - “Live Capture” real-time display - Error detection and reproduction - Complete control of the transmit link - Replay of recorded data with precision timing or corrected protocol timing - Special testing functions such as defining command/response for exchange management
-
Star SAFIRE® 380-HD -
Teledyne FLIR
The Star SAFIRE® 380-HD provides superior image stabilization, ultra-long range imaging performance, and true metadata embedded in the digital video. Featuring internal navigation for precise targeting, a MWIR thermal imager, optional HD color and low-light cameras, and multiple laser payload options, the system is fully hardened for military fixed-wing and helicopter operations. It can operate continuously in all conditions — even while sitting on the tarmac with no airflow.
-
Dayton T. Brown, Inc.
Dayton T. Brown, Inc. can help ensure that your payload is delivered accurately and reliably every time. Our team is responsible for first article, production lot, qualification, and associated testing and engineering support for mechanical and electrical armament and missile launching systems. DTB can help you develop a customized test plan that combines testing across many specifications – environmental, dynamics, EMI/EMC, structural, and non-destructive. Some of the standards that we follow include:
