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Plasma
An ionized gas used for flat panel displays.
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Plasma Process Monitors
Plasma process monitors to monitor plasma emissions during semiconductor manufacturing processes such as etching, sputtering and CVD.
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Plasma Processing Systems
PlasmaSTAR
The PlasmaSTAR® Series of Plasma Processing Systems from Axic, Inc. defines a new concept in barrel plasma processing. The systems are based on a modular design concept. Starting with a universal base unit, multiple electrode modules are available for easy insertion into the base unit. You will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma.
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Microwave Plasma Subsystems
AX2600 And AX2700
The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
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Plasma Emission Controller
RU-1000
The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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RF Plasma Generators
Choose from a broad range of RF plasma generators and access unique features for configuration, control, and application requirements. From various mounts and sizes to full digital control and plasma dynamic response, our RF generators can ignite your process innovation.
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UV Plasma Sources
UVS300|UVS 10/35
The UVS300 and UVS 10/35 are UV Plasma sources with high intensity, working with different gases.
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Remote Plasma Sources
Semiconductor and Electronic Thin Film applications use plasma sources to generate low-energy ions and radicals to react with material surfaces and chamber walls to remove contaminants and act as a precursor to aid in material deposition. MKS provides multiple options for radical generation including Toroidal and Microwave based Remote Plasma Sources supporting Fluorine, NF3, oxygen, nitrogen and hydrogen process chemistries.
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Plasma Etcher / Asher
PA-3000-A ETCHER
Process chamber with plasma view window and full access hinged door. RF hot process shelves with opposing ground electrodes. Throttle valve. Capacitance manometer. Internal pumping system with option for Fomblin filled chemical series mechanical pump. Flow control electronics and cabinet. Up to four mass flow control assemblies can be incorporated into our system. RF matching network and 600 watt maximum power supply. Fully enclosed cabinet. Custom internal fixturing to accommodate specific substrate shapes and sizes. Plasma gas selection for optimal performance.
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Remote Plasma Source
MAXstream
Advanced Energy’s MAXstreamTM line is the next generation of remote plasma sources for chamber cleaning. The MAXstream is available in 3, 6, 8, 10, and 12 SLPM NF3 flow rates to optimize price and performance.
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Plasma Power Generators
Advanced Energy’s field-proven, Precision PowerTM solutions offer extreme control, peerless arc handling, and cutting-edge match technology. Unlock new fabrication processes and benefit from our plasma power generators’ comprehensive capabilities.
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Remote Plasma Sources
Equip your manufacturing and abatement processes with high functionality and exceptional reliability. Customize your chemistry. Expand your operating range. Deliver higher process rates. Advanced Energy’s remote plasma sources offer sophisticated options in streamlined designs.
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Inductively Coupled Plasma
Inductively Coupled Plasma Techniques can be very powerful tools for detecting and analyzing trace and ultra-trace elements. Over the past years, ICP-MS has become the technique of choice in many analytical laboratories for providing the accurate and precise measurements needed for today’s demanding applications and for providing required lower limits of detection.
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Remote Plasma Source
Xstream
The highly efficient Xstream® RPS dissociates large volumes of NF3 and quickly cleans chambers, improving your overall tool performance. Its plasma chamber showcases high-purity aluminum alloy and patented cooling capabilities. Built to last for years without repair or expensive chamber coatings, the Xstream RPS is the smart choice for dependability and efficient performance.
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Plasma Profiling TOFMS
PP-TOFMS
Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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Chemical Downstream Plasma Source
The AX7610 is a microwave plasma source for remote plasma applications. With replaceable quartz or sapphire plasma tubes, the AX7610 downstream source offers configuration flexibility to meet the most demanding application process parameters. The quartz tube version is ideally suited for production of atomic oxygen, nitrogen or argon. The sapphire tube version is compatible with much more severe CF4 CHF3 and NF3 chemistries.
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Plasma CVD & Etching Systems
MODEL DRIE-1000
A High Quality Plasma Deposition & Etch System, Ideal for R&D and Small Scale Production. Modified designs with capabilities of 12" wafers. Substrate heating to 500 C. Top loading / Optional loadlock. Multifunctional plasma network. Diversified pumping configurations. Variable electrode spacing. Customized features and components for specific applications.
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RF Plasma Generators & Amplifiers
100 W to 2400 W 13.56 MHz Analog/Digital, RS-232, USB interfaces Low Harmonic Distortion Automatic and Manual Gain Control High Speed Pulsing (Bursting) controls Compatible with T&C''''s Matching Networks GUI Software (complete PC control) Includes all essential RF power/communication cables and mounting brackets Air cooled (Air & Water 1200 W +) Half rack mount or stand alone versions Ideal for: Industrial, Scientific, and Medical Applications
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Inductively Coupled Plasma Spectrometry
Is an analytical technique that can be used to measure elements at trace levels in biological fluids.
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2 MHz RF Plasma Generators
NOVA® Series
The NOVA ; RF Plasma Generators are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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Inductively Coupled Plasma Emission Spectroscopy
Inductively Coupled Plasma Emission Spectroscopy
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High Power Microwave Plasma System
The High Power Microwave Plasma System features the High Power Microwave Plasma Source, generator (with isolator) and auto-tuning system comprised of the Precision Power Detector and SmartMatch® unit. This comprehensive system delivers a high concentration of radicals with low electron temperatures for the highest dissociation and lowest recombination rates.
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High Sensitive Radiometers for Plasma Diagnostics
ELVA-1 radiometers for plasma diagnostic are worldwide known product. The custom designed ECE radiometers have been installed at lots of Tokamaks
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Remote Plasma Sources For Process Applications
MKS remote plasma sources deliver high density reactive radicals improving on-wafer cleaning and deposition throughput. Solutions consist of a fully integrated, self-contained unit designed for quick on-chamber installation providing fast, reliable plasma ignition of O2, Hydrogen and Nitrogen gases in a customer configurable package. All solutions are equipped with intelligent power control and EtherCAT® diagnostics supporting Industry 4.0.
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High Power Microwave Plasma Source
The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
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Inductively Coupled Plasma Mass Spectrometer
ICPMS-2030
With its newly developed collision cell and optimized internal structure, the ICPMS-2030 provides superior sensitivity. At the same time, thanks to the adoption of its proprietary mini-torch unit and provision of an Eco mode, the quantity of argon gas needed for analyses has been greatly reduced to the industry's lowest levels. As a result, low running costs are assured. The Development Assistant function of the software automatically sets the optimal analysis conditions for quantitative analysis. Then, after measurements are complete, the Diagnosis Assistant function automatically checks the validity of the necessary data. While reducing the burden on the user, the efficiency of analyses is enhanced and the reliability of the data can be increased. It complies with FDA 21 CFR Part 11.
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Thin Films, Plasma and Surface Engineering
A residual gas analyser for vacuum process analysis. Measures the vacuum process gas composition, contamination and leak detection.
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Inductively Coupled Plasma Mass Spectrometer
An analytical technique that can be used to measure elements at trace levels in biological fluids.
