Showing results: 31 - 45 of 145 items found.
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T300 ButtonTile™ -
Celadon
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Translarity
Advanced engineering solutions are required to meet increasing challenges for wafer test, driven by today’s rapid technology acceleration. Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.
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MPI Probe Card Technology
The Osprey probe card is MPI’s solution to demand for ever finer pitch. It is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and full array pattern. With precise alignment and better planarity control, Osprey can reach higher productivity by multi-DUT design. The forming wire (FW) type needle produced with MPI’s own micro fabrication process not only delivers high-quality performance but also allows easy needle replacement and shortens maintaining cycle time.
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ViProbe® -
FEINMETALL GmbH
FEINMETALL ViProbe® is based on the original "buckling beam" technology providing a truly vertical contact.The beams are precisely held in position by guiding plates. The low deviation of force versus overdrive ensures a high insensitivity to planarity differences.
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Onto Innovation
Automated probe card test and repair is used to monitor probe card health to ensure cards are ready and capable of testing semiconductor devices. In cases where the card is not meeting performance specification, repairs may be performed such as tip adjustment or card cleaning, thus returning the card quickly to a production state.
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Celadon
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe cards as well as DUT probing solutions. These Cryogenic probe cards have all the benefits of Celadon’s Crash Resistant™ probe technology but with the ability to probe as cold as humanly possible. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovate custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cable-out designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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VC20TM Fab -
Celadon
*Maximum channel count: 48*Tester platforms: Keysight 4062, 4072, 4080, Keithley S600, S530, Rack and Stack configurations.*Minimum Pad Size: 30ux30u (tunable scrub)*Contact Resistance: less than 1 ohm*Temperature range: -65C to 200C*Leakage: Less than 5 femto Amps per volt. If you require faster settling time*Repairable*Lifetime Performance: Production customers are experiencing 10M+ million touchdowns on Aluminum and Copper pads. Few to no rebuilds due to pobe wear
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Integrated Technology Corp.
ITC has a complete range of probe card metrology products that address all probe technologies, probe card sizes and probe counts.
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Test Spectrum, Inc.
Test Spectrum can provide generic Probe Cards, Probe Interface Boards (PIB), and loadboards. Choose from existing configurations already designed, or a generic test board for your specific tester configuration can be designed quickly.Teradyne J750 Probe Card and PIB; Teradyne Integra Flex PIB; Teradyne Ultra Flex PIB; Teradyne Catalyst PIB; Credence Quartet PIB (Probe Interface Board); Advantest 93K 1024 PIB
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VC Series -
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
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CE Series -
Japan Electronic Materials Corp.
*Standard Cantilever Probe Card*Low Contact force*Stable Contact*High accuracy of alignment*Suitable for variety of Devices
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Quadro-E PEG P4000 -
ADLINK Technology Inc.
The Quadro-E PEG P4000 perfectly balances performance, features, and compact form factor to deliver exceptional creative experience and productivity across a variety of 3D applications. The Pascal GPU with 1792 CUDA cores, 8GB GDDR5 onboard memory and support for up to four 8K (7680×4320 @ 60 Hz) native displays accelerate product development and creation workflow demanding fluid interactivity for large, complex 3D workpieces.
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Quadro-E PEG P2200 -
ADLINK Technology Inc.
The Quadro-E PEG P2200 perfectly balances performance, features, and compact form factor to deliver exceptional creative experience and productivity across a variety of 3D applications. The Pascal GPU with 1280 CUDA cores, 5GB GDDR5 onboard memory and support for up to four 5K (5120x2880 @ 60Hz) native displays accelerate product development and creation workflow demanding fluid interactivity for large, complex 3D workpieces.
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GX3216 Series -
Marvin Test Solutions, Inc.
The GX3216 is a multi-channel analog input and output cPCI module, supporting 16 differential input channels and two analog output channels. Dedicated 1 MS/s D to As and A to Ds allow simultaneous acquisition and generation of analog signals. Input ranges are software-selectable as ±10 V, ±5 V or ±2.5 V. The inputs are divided into two channel groups, with an independent software-controlled range assignable to each group. Two analog output channels provide software-selected output ranges of ±2.5 V, ±5 V or ±10 V and independent of the input range assignments. Output data is provided via two dedicated control registers, or through a 256 K-Sample FIFO buffer for waveform generation. Six bidirectional digital I/O lines are also available and can be programmed as inputs or outputs.
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QCP-1553 Series -
Marvin Test Solutions, Inc.
The QCP-1553 module is a rugged, reliable, full featured, Compact PCI module designed to provide a stand-alone, MIL-STD-1553A/B interface for avionics applications. Up to four independent dual redundant MIL-STD-1553 databus streams are supported by the 3U QCP-1553 module. Additionally, the module offers full functional test, simulation, monitoring and databus analyzer functions for MILSTD-1553A/B applications. An onboard IRIG-B time code decoder and generator allows users to accurately synchronize single or multiple QCP-1553 modules to a common time source. The QCP-1553 module is available in dual or full function (RT simulation, monitoring, and bus controller) configurations.