Showing results: 1261 - 1275 of 1688 items found.
-
Meltronics Systemtech
Avionics Bus Card is high end ARM core based MILBUS Communication Board. It is suitable for high speed Data Acquisition, Simulation, ATE applications. This board have MIL1553B, ARINC429, CCDL, digital I/O interface, USB, RS232, Ethernet interface and external bus interface. Board is well suitable for special type data acquisition & processing application. Board is based CPCI architecture and can be used with CPCI or PXI backplane. Rear IO Board is used to interface all IO’s of the board from Rear Side.
-
785594-01 -
NI
The PCIe-5775 is a PCI FlexRIO Digitizer Device that provides 6 GHz of AC-coupled analog bandwidth and 12 bits of resolution. You can operate the PCIe-5775 in a dual-channel mode at 3.2 GS/s or in a single-channel interleaved mode at 6.4 GS/s. With a passband from 1 MHz to more than 6 GHz, the PCIe-5775 is ideal for high-bandwidth frequency domain applications, including radar prototyping, LIDAR, and communications. The FlexRIO driver includes support for finite acquisition, and you can implement custom algorithms and real-time signal processing on the LabVIEW-programmable Xilinx Kintex UltraScale FPGA.
-
NI
The PXI FlexRIO Signal Generator combines analog I/O and a user-programmable FPGA into a single, customizable instrument. The instrument enables RF signal generation up to 2.9 GHz with 12 bits of resolution. The PXI FlexRIO Signal Generator uses FPGAs from Xilinx alongside LabVIEW and Vivado programming options for custom algorithm implementation and real-time signal processing. Using this instrument with NI-TClk, you can synchronize modules in one or more PXI chassis at up to picosecond‐level accuracy for high‐channel‐count applications.
-
NI
Industrial Controllers are high-performance, fanless controllers that provide connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. Controllers also have onboard isolated, transistor‐transistor logic (TTL), and differential digital I/O. You can use LabVIEW system design software to create, debug, and deploy logic to both the onboard FPGA and the processor. LabVIEW contains over 950 signal processing, analysis, control, and mathematics functions to accelerate development.
-
785592-01 -
NI
The PXIe-5775 is a PXI FlexRIO Digitizer that provides 6 GHz of AC-coupled analog bandwidth and 12 bits of resolution. You can operate the PXIe-5775 in a dual-channel mode at 3.2 GS/s or in a single-channel interleaved mode at 6.4 GS/s. With a passband from 1 MHz to more than 6 GHz, the PXIe-5775 is ideal for high-bandwidth frequency domain applications, including radar prototyping, LIDAR, and communications. The FlexRIO driver includes support for finite acquisition, and you can implement custom algorithms and real-time signal processing on the LabVIEW-programmable Xilinx Kintex UltraScale FPGA.
-
785591-01 -
NI
The PXIe-5775 is a PXI FlexRIO Digitizer that provides 6 GHz of AC-coupled analog bandwidth and 12 bits of resolution. You can operate the PXIe-5775 in a dual-channel mode at 3.2 GS/s or in a single-channel interleaved mode at 6.4 GS/s. With a passband from 1 MHz to more than 6 GHz, the PXIe-5775 is ideal for high-bandwidth frequency domain applications, including radar prototyping, LIDAR, and communications. The FlexRIO driver includes support for finite acquisition, and you can implement custom algorithms and real-time signal processing on the LabVIEW-programmable Xilinx Kintex UltraScale FPGA.
-
785590-01 -
NI
The PXIe-5775 is a PXI FlexRIO Digitizer that provides 6 GHz of AC-coupled analog bandwidth and 12 bits of resolution. You can operate the PXIe-5775 in a dual-channel mode at 3.2 GS/s or in a single-channel interleaved mode at 6.4 GS/s. With a passband from 1 MHz to more than 6 GHz, the PXIe-5775 is ideal for high-bandwidth frequency domain applications, including radar prototyping, LIDAR, and communications. The FlexRIO driver includes support for finite acquisition, and you can implement custom algorithms and real-time signal processing on the LabVIEW-programmable Xilinx Kintex UltraScale FPGA.
-
785587-02 -
NI
The PCIe-5785 enables direct RF acquisition up to 6 GHz and generation up to 3 GHz with 12 bits of resolution. You can use it in a dual-channel mode at 3.2 GS/s or in a single-channel interleaved mode at 6.4 GS/s. The PCIe-5785 is ideal for applications that require wideband acquisition and generation with multichannel synchronization, including radar, electronic warfare, and communications. The FlexRIO driver includes support for acquiring and generating waveforms out of the box, and you can use the LabVIEW-programmable Xilinx Kintex UltraScale FPGA to implement custom algorithms for real-time signal processing.
-
785588-01 -
NI
The PCIe-5785 enables direct RF acquisition up to 6 GHz and generation up to 3 GHz with 12 bits of resolution. You can use it in a dual-channel mode at 3.2 GS/s or in a single-channel interleaved mode at 6.4 GS/s. The PCIe-5785 is ideal for applications that require wideband acquisition and generation with multichannel synchronization, including radar, electronic warfare, and communications. The FlexRIO driver includes support for acquiring and generating waveforms out of the box, and you can use the LabVIEW-programmable Xilinx Kintex UltraScale FPGA to implement custom algorithms for real-time signal processing.
-
785588-02 -
NI
The PCIe-5785 enables direct RF acquisition up to 6 GHz and generation up to 3 GHz with 12 bits of resolution. You can use it in a dual-channel mode at 3.2 GS/s or in a single-channel interleaved mode at 6.4 GS/s. The PCIe-5785 is ideal for applications that require wideband acquisition and generation with multichannel synchronization, including radar, electronic warfare, and communications. The FlexRIO driver includes support for acquiring and generating waveforms out of the box, and you can use the LabVIEW-programmable Xilinx Kintex UltraScale FPGA to implement custom algorithms for real-time signal processing.
-
785589-01 -
NI
The PCIe-5785 enables direct RF acquisition up to 6 GHz and generation up to 3 GHz with 12 bits of resolution. You can use it in a dual-channel mode at 3.2 GS/s or in a single-channel interleaved mode at 6.4 GS/s. The PCIe-5785 is ideal for applications that require wideband acquisition and generation with multichannel synchronization, including radar, electronic warfare, and communications. The FlexRIO driver includes support for acquiring and generating waveforms out of the box, and you can use the LabVIEW-programmable Xilinx Kintex UltraScale FPGA to implement custom algorithms for real-time signal processing.
-
785589-02 -
NI
The PCIe-5785 enables direct RF acquisition up to 6 GHz and generation up to 3 GHz with 12 bits of resolution. You can use it in a dual-channel mode at 3.2 GS/s or in a single-channel interleaved mode at 6.4 GS/s. The PCIe-5785 is ideal for applications that require wideband acquisition and generation with multichannel synchronization, including radar, electronic warfare, and communications. The FlexRIO driver includes support for acquiring and generating waveforms out of the box, and you can use the LabVIEW-programmable Xilinx Kintex UltraScale FPGA to implement custom algorithms for real-time signal processing.
-
AmITX-CF-I -
ADLINK Technology Inc.
The AmITX-CF-I is a Mini-ITX motherboard supporting the 8th/9th Gen Intel® Core™ i9/i7/i5/i3, Pentium® and Celeron® processor in the LGA1151 package, and the Intel Q370/H310 chipset. The AmITX-CF-I is specifically designed for customers who need high-level processing and graphics performance with a long product life solution. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz non-ECC memory up to 32 GB in two SODIMM slots. The AmITX-CF-I features DVI, DP and HDMI ports, LVDS header, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and audio with Line-out, Line-in and Mic-in connectors. Expansion is provided by one PCIe x16, one M.2, and one mini-PCIe slot. The onboard pin header provides GPIO, USB and RS-232 support. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.
-
xiD -
XIMEA GmbH
*Quality components - Sony "EXview HAD CCD II" sensors delivering 2.8, 6.1, 9.1 and 12 Mpix*Fastest - Highest speed using full 4 TAP readout potential*Industry standard interface - Compliant with USB 3.0 SuperSpeed specification*Versatile mini camera - Subtle 60 x 60 x 39 mm, 320 grams (1)*Power - Lowest power consumption starting at 3 Watt, bus powered with USB3 cable*Cool - Minimal heat dissipation with passive COOLing*Compatibility - USB 3.0 support for Windows 7 and 10, macOS, Linux, ARM and 30 Libraries*Connectivity and Synchronization - Programmable opto-isolated input and output, 3 status LEDs*Bandwidth potential - 5Gb/s interface 400Mpix/s data throughput*Software interfaces - GenICam / GenTL and highly optimized xiAPI SDK for Image Processing*High grade - Quality class of sensors is combined with specially selected IR filters *Easy deployment - Range of accessories and widest hardware and software interoperability*Highly Customizable - Available in Board level and with Peltier TE Cooling
-
EV Group
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
