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SIP
Session Initiation Protocol, Standard Interchange Protocol
- Pickering Interfaces Inc.
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Single-in-Line (SIL / SIP) Reed Relays From Pickering Electronics
The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 110 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding application
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Test SIP
VoIP, Video, and IPTV products must withstand and continue to function when facing all the conditions that occur on the Internet. These include attacks from hackers exploiting vulnerabilities in security and protocols as well as the common phenomenon of congestion, delay, jitter, drops, and so on. VoIP, Video, and IPTV products must demonstrate robustness and resiliency in the face of unusual and/or illegal conditions.
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SDIO SiP module
SX-SDPAC
The SX-SDPAC is a dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth 5.0+HS “Smart Ready” SDIO SiP module specifically designed for low cost high volume embedded applications.
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Built-in MOSFET Integrated SiP
Renesas Electronics offers SiP products with integrated MOSFETs to enable easy configuration of high-performance multi-phase power supplies. They combine in a single package either controller, driver, and MOSFETs or driver and MOSFETs. These products make it easy to build a high-performance DC/DC converter while reducing stray capacitance and inductance, and achieving higher mounting density.
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Single-Inline Package (SIP) Relays
Series LS
Series LS single-inline package (SIP) relays are designed for mounting on printed circuit boards. LS relays facilitate heat sinking by providing an metallic interface surface. The relays use a direct-bonded copper substrate for thermal efficiency, thermal stress performance and long-life expectancy. Optional heat sinks are available.Available options include:LS24D16C 50A, 90-280Vac, 600Vpeak Load; 4-20mA ControlSHP24N50R 50A, 100-280Vac, 600Vpeak Load; 8-30Vdc Control
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802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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Solid-State Inline (SIP) Four-Pin Relays
Series AS4
Series AS4 solid-state single inline (SIP) four-pin relays are designed for mounting on a printed circuit board. The relays offer built-in voltage protection and can withstand very high current overloads. The relays have a low zero-cross window. The compact size and triac output make the AS relay the perfect retrofit for electromechanical relays. All Series AS relays are Zero-Cross switching.Available options include:AS24D4E/R 4Arms, 12-275Vrms, 600Vpeak Load; 4-30Vdc ControlAS24D4E-X1 4Arms, 12-275Vrms, 600Vpeak Load; 6-30Vdc Control; DIN-rail clip+LEDAS24D4E-X2 4Arms, 12-275Vrms, 600Vpeak Load; 6-30Vdc Control; DIN-rail clipAS46D4E/R 5Arms, 12-460Vrms, 800Vpeak Load; 4-30Vdc Control
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Single-in-Line (SIL / SIP) Reed Relays
The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 110 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding applications.
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Single Inline Package (SIP) Four-Pin Relays
Series DS
Series DS single inline package (SIP) four-pin relays are designed for mounting on printed circuit boards. The relays are designed for medium-power DC loads. The Series DS relay is an alternative to electromechanical and reed relays. The DS series relays offers a long life versus mechanical relays.Available options include:DS6R3E 3A, 2-60 Vdc Load; 3-30 Vdc Control
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High Voltage Mini-SIL / SIP Reed Relays
Series 131
The Pickering Series 131 is a new range of very small Single-In-Line reed relays intended for voltages very much higher than standard small SIL relays. The vacuumed, sputtered ruthenium reed switches have a superb low level performance also, which makes them an ideal choice where a wide range of signals are involved.
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4-Amp Solid-State Single Inline (SIP) Four-Pin Relays
Series BS
Series BS 4-amp solid-state single inline (SIP) four-pin relays are designed for mounting on a printed circuit board. BS relays can withstand very high current overloads. The compact size and triac output make the BS relay an excellent choice for switching medium power resistive loads. All Series BS relays are Zero-Cross switching.Available options include:BS24D4A 4Arms, 15-280Vrms, 600Vpeak Load; 3-10Vdc Control
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VoIP Monitoring and Testing Tool
SIP Tester™
StarTrinity SIP tester™ is a VoIP load testing tool which enables you to test and monitor VoIP network, SIP software or hardware. It is able to simulate and passively monitor thousands of simultaneous incoming and outgoing SIP calls with RTP media, analyze call quality and build real time reports.
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Single-in-Line Reed Relays from Pickering Electronics
SIL / SIP
The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 119 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding applications. Features include:
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Call Generation
Emutel SIP Harmony
SIP Harmony has strong Call Generation capabilities. Using the SIP | Harmony ''Composer'' application, scripts can be quickly created to generate high volumes of calls. Once calls are established they can be cleared down straight away or held active for any period of time to simulate different call lengths. The SIP | Harmony is also capable of terminating calls, so complete wraparound testing of any piece of equipment can be carried out.
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UDP Test Tool, Flood Generator, VoIP Readiness Test Tool
The Multiprotocol Network Tester is a freeware, open source tool which enables you to measure quality of your IP network. It can also be used to generate UDP flood or to simulate UDP DoS attack. SIP call is usually established using a SIP session with a bidirectional RTP stream. SIP and RTP protocols are based on UDP transport protocol. UDP uses a simple transmission model without implicit reliability, ordering and data integrity. Each single UDP packet is transferred independently. The quality of a SIP call depends on delays and loss of IP packets in a network. Long delays lead to large RTP jitter and bad sound quality of a SIP call.
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Enterprise Session Border Controller
eSBC
Session Initiation Protocol (SIP) is the communication technology employed to set up and tear down VoIP phone calls
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Custom & ASSP
Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
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Wireless
Virtual Panels
Designed with flexible work solutions in mind, the Virtual Panel enables remote users to access the full audio capabilities of the intercom system from anywhere, at any time, and be up and running in minutes without the need for dedicated operator hardware. Individual users will access the intercom via a familiar, modern software panel screen on the chosen device and a SIP connection over standard network (either wired, wireless of a combination of both). Having the audio managed by a SIP connection means the panel users are truly flexible as there is no physical connection to any dedicated hardware - it?s all in the cloud.
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Unmatched Visibility For Troubleshooting Real-Time Media And Signaling
Advanced Diagnostics
The industry’s most advanced voice & video troubleshooting tool for SBCs, SIP trunks and other strategic network segments, Nectar Advanced Diagnostics provides voice and video engineers with unmatched capabilities for minimizing downtime and reducing meantime to resolution.
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DC toDC Converters
Low Cost Single Dual and Triple outputs Isolated Outputs Low Ripple, Regulated Outputs Standard packages and pin outs Custom Designs availableNew Miniature V3 Series features HighVoltage Isolation, SIP and DIP packages
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Absorption Probe
ASD25-N
ASD25-N probe for direct installation into bioreactors, pipelines and vessels measuring absorption, cell growth and optical density of various liquid samples under sanitary process environments. The probe is suited for Sterilization In Place (SIP) / and Clean In Place (CIP) procedures.
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Digital Matrix Intercom System
Gemini
A system that interfaces with existing communication assets such as SIP telephones.A way to reduce costs for linking remote sites by using standard IP infrastructure.An intercom system that operates over LAN or WAN or Internet.Works on any terrestrial or satellite-based network.Virtual and hardware operator panels to configure and manage each unit.Private one-to-one, group and conference calls with the ability to manage simple to complex conference and private conversations simply and quickly.Interfaces for telephony, 4 wire, and other audio devices such as Radio base station or Presenter systems.Sophisticated SIP integration for modern telephony interconnection options.Camera Mix interfaces for 6 cameras to/from Engineering and Production.
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IQ4 Pipeline Metal Detection
The IQ4 Pipeline is a robust system designed for both Sterile in Place (SIP) and easy strip down cleaning depending on the application, complying to EN1672-2 hygiene standards. This system is designed to be used with pumped and flowing products such as meat slurries, soups, sauces, jams or dairy.
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DC Alignment
SEP/SIP
There are analog phase control type DC power supply type and digital control type inverter energy saving type. We provide the most suitable equipment according to the current capacity and cycle time.If the "start command" is executed from the existing molding equipment, each mode of "alignment-pause-demagnetization" is continuously operated by the program inside the instrument. It is also possible to share an emergency stop signal and output an output current abnormality signal.
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3U CPCI Dual IP Carrier
CPCI-SIP
The CPCI-SIP module provides a 3U high performance flexible I/O scheme that supports industry standard Industry. PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-SIP is the perfect solution. The CPCI-SIP is also available with the Industry Pack lines routed to the CompactPCI P2 connector for application that require rear panel I/O.
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Wireless Protocol Emulation
MAPS
Message Automation & Protocol Simulation (MAPS™) is a protocol simulation and conformance test tool that supports a variety of protocols such as SIP, MEGACO, MGCP, SS7, ISDN, GSM, MAP, CAS, LTE, UMTS, SS7 SIGTRAN, ISDN SIGTRAN, SIP I, GSM AoIP, Diameter and others. This message automation tool covers solutions for both protocol simulation and protocol analysis. Along with automation capability, the application gives users the unlimited ability to edit messages and control scenarios.
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High Voltage Thick Film Planar Resistors
HVP
*High resistance resistors for high voltage circuits.*Thin SIP shape*The flame retardant coats corresponding to UL94V-O are used*Thick film resistors ensure high stabilities in life and change in aging
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SS7 Gateway
An SS7 media gateway is a networking device positioned within a carrier core network to provide protocol translations between traditional telephony signaling and modern voice-over-IP signaling (H.323 or SIP (session initiation protocol).
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IMS-SIP Network Emulator Software
E6966B
Wireless telephony networks are increasing capacity for high throughput Internet Protocol (IP) packed-data by utilizing radio access technologies such as LTE and HSPA. Session Initiation Protocol (SIP) and IP Multimedia Subsystem (IMS) are progressively being adopted as part of the network infrastructure to carry traditional wireless telephony services over an all-IP network. SIP provides control of communication sessions whilst IMS is the framework that allows delivery of multimedia services over IP. With this new capability comes the need for developers and operators to move their focus to testing user equipment (UE) in this new network environment.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
