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16-Bit, 12 GSPS, RF DAC and Direct Digital Synthesizer
AD9164
The AD9164 is a high performance, 16-bit digital-to-analog converter (DAC) and direct digital synthesizer (DDS) that supports update rates to 6 GSPS. The DAC core is based on a quad-switch architecture coupled with a 2× interpolator filter that enables an effective DAC update rate of up to 12 GSPS in some modes. The high dynamic range and bandwidth makes these DACs ideally suited for the most demanding high speed radio frequency (RF) DAC applications. The DDS consists of a bank of 32, 32-bit num...show more -
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1Gsps, 18 Channel, Logic Analyzer with Protocol Analyzer plugins and Hardware Compression
DigiView™ DV518
- Physical Channels: 18- Sample rate: 4ch@1 Gsps or 9ch@500Msps or 18ch@1Gsps (4 ch. are sampled every 1ns or 9 ch. are sampled every 2ns or 18 ch. are sammpled every 4ns)- Typical capture: 100M transitions (> 1B samples)- Hardware based triggers with 8 universal match circuits, and partitionable 16 stage sequencer- Adjustable Threshold (± 4V)- Real-time, Hardware-based, Adaptive Compression- Channels protected to ± 20V- Ground leads protected to ± 12V- High-quality test leads: 66 strand soft...show more -
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1Gsps, 9 Channel, Logic Analyzer with Protocol Analyzer plugins and Hardware Compression
DigiView™ DV509
- Physical Channels: 9- Sample rate: 4ch@1 Gsps or 9ch@500Msps (4 ch. are sampled every 1ns or 9 ch. are sampled every 2ns)- Typical capture: 100M transitions (> 1B samples)- Hardware based triggers with 8 universal match circuits, and partitionable 16 stage sequencer- Adjustable Threshold (± 4V)- Real-time, Hardware-based, Adaptive Compression- Channels protected to ± 20V- Ground leads protected to ± 12V- High-quality test leads: 66 strand soft copper wires, flexible insulation, and gold pla...show more -
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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4 Channel ADC FMC Module
ADCFN04 – HPC
Sundance Multiprocessor Technology Ltd.
The RFM-ADCFN04 is a four channel Analog to Digital converter FMC which complies with VITA 57.1-2010. Each channel provides DC coupled single-end analog input and digital output with DC-250KHz sampling speed based on Linear Technology’s LTC2376-16. The output is 16-bit data and it can be obtained through SPI interface on LTC2376-16 from the FPGA on the FMC carrier board. One trigger input is provided for capture control.
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4 Channel DAC FMC Module
DACNF04 – HPC
Sundance Multiprocessor Technology Ltd.
The RFM-DACNF04 is a four channel Digital to Analog converter FMC which complies with VITA 57.1-2010. Each channel provides 16-bit input and one DC coupled single-end analog output with DC – 250KHz sampling speed based on Linear Technology’s LTC2704-16. The 16-bit input data for each channel is provided through SPI from the FPGA on the FMC carrier board. A single-ended TTL level trigger output is provided from the FPGA.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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72 channel FPGA Logic Module
XLM72
XLM72 is a FPGA based logic module with 72 I/O ports. Featuring two 64 Mbit SPI (Serial Peripheral Interface) memories, from one of which its FPGA boots upon power-up, complex logic operations can be programmed and saved on-board.
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8-Sites ISP & I2C/SPI Interface
YAV90ISP
Industrial Programmers Interface up to 8 targetsRelay BarrierDemultiplexer module up to 32 devicesCommunication Interfaces I2C and SPI
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Accelerometor, Gyro, Magnetometer Breakout Board
SEN-38001
The LSM9DS1 is a highly configurable, flexible and precise motion sensing solution from ST Microelectronics - the latest in a wide-ranging inertial product line. It integrates a 3-axis accelerometer, 3-axis gyroscope and 3-axis magnetometer into a single IC , giving you a full nine degrees of freedom (9-DOF) in a tiny 3mm x 3.5mm package. Even with support components, square mounting pattern and connection breakouts for both SPI and I2C, this board is barely the size of a quarter.
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Advanced All-in-One Bluetooth® Analysis System
Vanguard
The most advanced, most comprehensive Bluetooth protocol analyzer ever made. Building on a legacy of innovation, the Bluetooth Vanguard All-In-One Protocol Analysis System delivers new advances designed to ease the increasingly complex tasks of Bluetooth developers. Vanguard provides synchronized capture and analysis of BR/EDR, Bluetooth Low Energy, Wi-Fi 802.11 a/b/g/n/ac (3x3), WPAN 802.15.4 (all 16 2.4 GHz channels), raw 2.4 GHz RF spectrum analysis, HCI (USB, UART, SPI), generic SPI/UART/I2C/SWD communications, WCI-2, logic signals, and Audio I2S.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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AOI & SPI Test Systems
To keep the quality of your production at its best you need a good inspection of your boards. For efficient and detailed in-depth board inspection ensure you have SMT inspection equipment that meets your needs. Our AOI & SPI units will provide the quality you need for reliable inspection of soldering inspection.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Arduino CAN Shield
IFB-10003-INP
CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt l...show more -
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Arduino CAN Shield
IFB-10003-IWP
CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt l...show more -
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Arduino CAN Shield
IFB-10003-AWP
CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt li...show more -
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Arduino CAN Shield
IFB-10003-ANP
CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt li...show more -
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ARINC 429 Card
SET-1623
The SET 1623 ARINC Card has 32 Tx/Rx Channels. These 32 Tx/Rx channels are structured in 4 banks (P0.x to P3.x) 8 channels each. Each bank is controlled by a dedicated SPI (SPI0 to SPI3) located on RTI.
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ARM 9 System on Module
MS 1515
- Processor: LPC3250 processor with ARM 9 core running at 266 MHz SDRAM- Memory: DDR2 256 MB (scalable to 512 MB)- Flash Memory: NAND flash 512 MB- Display & Graphics: Programmable color LCD controller supports up to a TFT interface- Touch screen: Integrated touch screen controller- Network Support: 10/100 Base-T Ethernet PHY- PC Interface: One USB 2.0 high-speed On-the-Go interface- Serial Interfaces: Up to four external UARTs- + CAN 2.0B controller- + Three I2C ports- + Three SPI ports- GPIO: Programmable I/O depending on peripheral requirements- Mechanical: 60 mm wide x 60 mm long x 5.4 mm high
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ARM LPC2294 Based Board
MS 2500
- JTAG interface- Boot Flash interface- External Flash interface for data storage- External Bus interface- SPI Interface- I2C interface- Serial port interface- CAN Interface- LPC2694 based processor board- MIL1553B Bus Interface (Dual Redundancy)
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Automated Programmer Superpro Sb05
※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and se...show more -
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Beagle I2C/SPI Protocol Analyzer
TP320121
The versatile Beagle™ I2C/SPI Protocol Analyzer is the ideal tool for the embedded engineer who is developing an I2C, SPI, or MDIO based product. The Beagle analyzer provides a high performance bus monitoring solution in a small, portable package. Perfect for engineers in the field and in the lab.
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Bi-Directional Level Translator
IFB-10001
Easily connect Arduino or other 5V microcontrollers to ~3.3V sensors. Based on the TI TXB0108 auto-sensing, bi-directional level translator, this module provides access to all 8 channels of the TXB0108 and has a built-in 300mA LDO with 200mV max dropout voltage at full load. Regulated 3.3V output allows this single board to both interface withandpower 3.3V sensors. An important feature of this module is the ability to operate SPI and other digital lines (not including I2C) at high-speed, wherea...show more -
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BitScope Micro Oscilloscope & Analyzer
BS05
20 MHz Bandwidth.40 MSps Logic Capture.2 Analog Scope Channels.2 Analog Comparator channels.6 Logic/Protocol Analyzer channels.8 & 12 bit native analog sample resolution.Decodes Serial, SPI, I2C, CAN and more.Windows, Linux, Mac OS X & Raspberry Pi.Built-in analog waveform & clock generators.User programmable, C/C++, Python, VM API.Tiny, light weight (14g) and water resistant.Standard oscilloscope probe adapters available.
