Showing results: 16 - 30 of 34 items found.
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OCT-2000 -
HenergySolar
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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KLA-Tencor Corp
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Adamant Namiki Precision Jewel Co Ltd.
Our product contribute to lengthening the life of machinery and products by using hard jewelry materials such as diamond · sapphire · ruby . As a result of sticking to the cutting of efforts, our strength is difficult to cut materials with various characteristics quickly and with high precision.
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Electrogrip Company
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Naprotek, LLC.
SemiGen offers build-to-print services for a wide range of materials and metallization schemes. We use our processing technology to fabricate circuits on As-Fired Alumina, Polished Alumina, Superstrate TPS, Aluminum Nitride, Beryllium Oxide, Fused Silica/Quartz, Sapphire, and Hi-K Dielectrics.
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L3C-720 -
Teledyne Marine Bowtech
The Teledyne Bowtech L3C-720 miniature high resolution underwater CCD camera, provides a low cost solution to general underwater viewing and observation.The camera housing is manufactured from high quality titanium fitted with a Sapphire glass window rated to either 1,000, 4,000 or 6,000 metres operating depth.
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LCC-720 -
Teledyne Marine Bowtech
The Teledyne Bowtech LCC-720 miniature high resolution underwater CCD camera, provides a low cost solution to general underwater viewing and observation.The camera housing is manufactured from high quality titanium fitted with a Sapphire glass window rated to either 1,000, 4,000 or 6,000 metres operating depth.
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MPA-XL -
CDP Systems Corp.
MPA-XL is a cost-effective terawatt Ti: sapphire amplifier system. It gives up to 200 mJ energy of the stretched pulse and further compression with 65% efficiency. A standard air compressor can be placed into a custom designed vacuum chamber.
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WT-425 -
Tosei Engineering Corp.
Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Surveyor-SD -
Teledyne Marine Bowtech
The Teledyne Bowtech SURVEYOR-SD underwater colour zoom camera utilises CCD technology, delivering exceptional picture quality, with a 28:1 optical zoom lens and a horizontal resolution of 670 TV lines, all within a 4,000 (or 6,000) metre rated high quality titanium housing, with a 99.7% optically clear sapphire window.
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L3C-HD -
Teledyne Marine Bowtech
The Teledyne Bowtech L3C-HD is a low cost fixed focus miniature high definition camera. Its housing is manufactured with high quality titanium, rated to either 1,000m, 4,000m or 6,000m operating depth.The camera is fitted with a fixed focus wide angle lens. This provides a 67° diagonal angle of view in water. The Sapphire window is highly scratch resistant and 99.8% opitcally pure. The camera features built-in reverse polarity and surge protection.
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ALTO-SD-150/200 -
Alto Inspection Corp.
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Tokyo Seimitsu Co., Ltd.
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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NCS-200SA -
HenergySolar
Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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ESI Technology Ltd
ESI Technology manufacture a wide range of pressure sensors using a variety of different technologies. Pressure transducers (voltage output), pressure transmitters (milliamp output), panel meters, accessories. Silicon-on-Sapphire technology and a titanium diaphragm combine to make the new Gold Standard in pressure sensing. Custom pressure measurement solutions have been integral to ESI’s success. All aspects of design and manufacture are done in-house at our UK facility. Impressive quality at an affordable price. So if you don’t see what you are looking for, just ask.