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SerDes
Serializer/Deserializer
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Personal SerDes Testers
C Series
Everything you need to develop and verify your high-speed digital algorithms is contained in these ultra-portable test instruments. They will forever change the way you think about developing and verifying Gbps digital and mixed-signal algorithms, and they will allow you to measure signals in ways that were not possible in the past. Each personalized SerDes tester is equivalent to multiple hardware platforms, containing everything that you need to make high-performance measurements like bit error rate testing, signal generation, and signal measurement.
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Communications ICs
Renesas' broad portfolio of communication ICs includes subscriber line interface circuits (SLICs), DSL line drivers, general purpose ringing SLICs, isolated PWM controllers, line card access switches, PABX short-loop SLICs, PLC line drivers, and serializer/deserializer (SerDes) ICs.
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Validation Testers
M Series
The M Series line introduces a new class of massively parallel SerDes validation testers that are ideal for high-volume data collection and characterization. Constructed using a collection of Introspect Technology’s D Series modules that are operated seamlessly using the Introspect ESP software, these massively parallel testers are able to interface to high-speed devices in their entirety.
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VME Master - DAQ and Detector Interface
VX1394
The VX1394 board features a radiation hard 4.8 Gbps SERDES ASIC, which, in connection to a rad-hard optical transceiver implements a newer generation optical links for many detector readout systems. The ASIC performs data transmission, trigger distribution and clock forwarding towards the front-end electronics in the crate.
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Break The Rules Of Power, Size And Cost In Your Connectivity And Acceleration Applications
ECP5 / ECP5-5G
*Up to 3.2 Gbps SERDES rate with ECP5, and up to 5 Gbps with ECP5-5G*Up to 4 channels per device in dual channel blocks for higher granularity*Enhanced DSP blocks provide 2x resource improvement for symmetrical filters*Single event upset (SEU) mitigation support*Programmable IO support for LVCMOS 33/25/18/15/12, XGMII, LVTTL, LVDS, Bus-LVDS, 7:1 LVDS, LVPECL and MIPI D-PHY input/output interfaces
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Tri-Mode I/O Controller
SAS3416
Broadcom Tri-Mode SerDes technology enables seamless operation of PCIe, SAS or SATA storage devices in a single drive bay. The introduction of PCIe devices executing NVMe to the existing SAS/SATA infrastructure makes industry standard hot-pluggable drive bays even more versatile. Whether you’re building external or cloud-based storage systems for high connectivity, or outfitting servers, the SAS3416 16-port, 12Gb/s Tri-Mode SAS/SATA/PCIe IOC provides choices for storage optimization by enhancing direct-attached storage (DAS) solutions.
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PCI Express
PCI Express (PCIe) is a highly successful SerDes interface that is used in computing devices spanning a wide range of applications. Currently in its fourth generation with on-going roadmap development for a fifth generation, the PCIe interface is undergoing major technical advancements that require state-of-the-art development and validation tools. For example, Gen4 PCIe devices operate at 16 Gbps per lane and are expected to deliver very low bit error rate (BER) levels even over constrained and lossy transmission channels (e.g. printed circuit boards).
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Tri-Mode I/O Controller
SAS3816
Broadcom Tri-Mode SerDes technology enables seamless operation of PCIe, SAS or SATA storage devices in a single drive bay. The introduction of PCIe devices executing NVMe to the existing SAS/SATA infrastructure makes industry standard, hot-pluggable drive bays even more versatile. Whether you’re building external or cloud-based storage systems for high connectivity, or outfitting servers, the SAS3816, 16-port, 12Gb/s Tri-Mode SAS/SATA/PCIe Gen4 IOC provides choices for storage optimization by enhancing direct-attached storage (DAS) solutions.
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Tri-Mode I/O Controller
SAS3808
Broadcom Tri-Mode SerDes technology enables seamless operation of PCIe, SAS or SATA storage devices in a single drive bay. The introduction of PCIe devices executing NVMe to the existing SAS/SATA infrastructure makes industry standard, hot-pluggable drive bays even more versatile. Whether you’re building external or cloud-based storage systems for high connectivity, or outfitting servers, the SAS3808, 8-port, 12Gb/s Tri-Mode SAS/SATA/PCIe Gen 4.0 IOC provides choices for storage optimization by enhancing direct-attached storage (DAS) solutions.
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FPGA PXIe Digital I/O Card
GX3700e
The GX3700e is a user configurable, FPGA–based, 3U PXI Express card offering 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features over 45,000 logic elements and 1.836 Kb of memory.
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Fixture Design
TestEdge offers quick, cost effective test fixture design services for low-speed, full-speed, and high-speed devices. Based on our experience in developing high performance test fixtures for a wide variety of devices, test sockets, and tester platforms, we provide a premium quality test and engineering validation environment for everything from high power (40W) to high pin count to high speed ECL to high speed SerDes (3.25Gb) devices.
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Multi-Instrument BERT Software
N4980A
The Keysight N4980A multi-instrument BERT software provides the ability to control multiple instruments through a rich Windows-based graphical user interface (GUI). Bit error rate measurements are simple to set up with the intuitive control screens. The software is ideal for setting up and performing parallel BER measurements and jitter tolerance testing (N4980A-JTS) in multi-lane and SERDES devices. You can also create your own patterns using the powerful editing tools built into the pattern editor to meet your unique requirements.
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OTN: Framer/Mapper/FEC
Macom Technology Solutions Holdings Inc.
MACOM’s OTN Framer/Mapper/FEC family products offer complete portfolio of solutions for 10G, 40G and 100G optical transport networks. They are ideal for high-capacity Carrier Ethernet router/switches, Packet Optical Transport systems and DWDM Transport systems. The OTN framer devices integrate high performance Serdes I/O to allow seamless connection to optical and copper modules. The provisional Tri-FEC integration supports G.709 standard RS-FEC as well as high coding gain G.975.1 I.4 EFEC and I.7 UFEC to improve optical link performance, achieve longer reach and offer interoperability flexibility.
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Advanced General Purpose FPGA
CertusPro-NX
*Up to 100K logic cells, 7.3 Mb of embedded memory blocks (EBR, LRAM), 156 18 x 18 multipliers, 299 programmable I/O, 8 SERDES supporting up to 10.3 Gbps per lane and supporting popular protocols (10 Gig Ethernet, PCIe Gen 3, DisplayPort, SLVS-EC and CoaXPress).*Packages as small as 9x9 mm, and in ball-pitch options of 0.5, 0.8 and 1.0 mm.*Power modes – User selectable Low Power vs. High Performance modes, enabled by FD-SOI programmable back-bias.*Design security – ECDSA bitstream authentication, coupled with robust AES-256 encryption.*Fast configuration – I/O configures in 4 ms, and full-device in under 30 ms in 100K LC device.
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RF Coaxial Probes & Probe Positioner
Fairview Microwave’s line of coaxial RF probes and RF PCB probe positioner are ideal for use with chip evaluations, signal integrity measurements, coplanar waveguide, substrate characterization, gigabit SERDES and test fixture applications. The RF coaxial probes provide return loss better than 10 dB and a maximum operating frequency of 20 GHz. The probes have a 3.5mm female interface, a pitch of 800 or 1500 micron and they can be cable-mounted. They feature gold-plated contacts and can be used by hand, with or without a probe positioner. Compliant coaxial GSG (or GS) pogo pins allow for a broad range of probing angles. The RF PCB probe positioner can hold coaxial probes, has articulated joints and delivers multi-axis positioner control. This positioner also boasts a magnetic mounting plate with on-off positioner switch.
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FPGA PXI High-Performance Digital I/O Card
GX3700
The GX3700 is a user configurable, FPGA-based, 3U PXI card which offers 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features 47,500 logic elements and 2.1 kb of memory. The GX3700 is supplied with an integral expansion board providing access to the FPGA’s 160 I/Os. Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera’s free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded into the FPGA directly or via an on-board EEPROM.
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FPGA PXIe High-Performance Digital I/O Card
GX3700e
The GX3700e is a user configurable, FPGA–based, 3U PXI Express card offering 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features over 45,000 logic elements and 1.836 Kb of memory. The GX3700e is supplied with an integral expansion board providing access to the FPGA’s 160 I/Os. Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera’s free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded directly into the FPGA or via an on-board EEPROM.
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FPGA PXI High-Performance Digital I/O Card
GX3702
The GX3702 is a user configurable, FPGA-based, 3U PXI card which offers 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features over 45,000 logic elements and 1.836 Kb of memory. The GX3702 is supplied with an integral expansion board providing access to the FPGA's 160 I/Os and is pin for pin compatible with the NI PXI 7813R and 7811R FPGA cards . Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera's free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded into the FPGA directly or via an on-board EEPROM.
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3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family
MIC-6330
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor
MIC-6314
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.