Showing results: 121 - 132 of 132 items found.
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InfraScan™ 400TDM -
Checkpoint Technologies, LLC.
The InfraScanTM 400TDM is the newest evolution of Checkpoint's pioneering top-down laser scanning and emission tools. This tool is specifically designed to accommodate any commercially available probe station, up to 300 mm wafers. The combination of Checkpoint Technologies, world leading laser scanning microscope and its best in class emission system into a single tool, gives users the most sensitive and easy to use system on the market. The TDM can be configured with up to 3 lasers and a choice of InGaAs, MCT or Si CCD emission cameras.
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TopLine Corp.
Daisy Chain provides engineers with a simple tool to learn valuable information about causes of failures. Such failure analysis paves the way for scientists and engineers to improve assembly processes. Critical applications involving environmental life cycle testing require daisy chain packages with dummy silicon die. The Daisy Chain permits electrical continuity testing, while the dummy silicon die replicates the thermal mass of a "live" device. Si Die, QFN, Lead Frame Packages and BGA devices and more.
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Radalert® 100X -
International Medcom
The Radalert® 100X is a general purpose geiger counter that measures alpha, beta, gamma, and X-radiation. Features of the Radalert® 100X, include a three-second update and a Utility Menu that allows you to change the default settings for several operating parameters. Its digital liquid crystal display (LCD) shows the current radiation level in your choice of SI units (microsieverts per hour) from .000 to 1,100 and counts per minute (CPM) from 0 to 350,000 or counts per second (CPS) from 0 to 3,500. For users of conventional units mR/hr (milliroentgens per hour) from .000 to 110 and CPM are optional in the Utility Menu. This instrument also offers an accumulated total and timer function, up to 9,999,000 counts and 40 hours.
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RP4000-MCX-LEAD-SI -
Teledyne LeCroy
Qty. 3 MCX 4 GHz solder-in lead accessories (additional to those supplied with RP4030), 18cm long
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MPI Probe Card Technology
The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor production tests from early engineering pilot-runs to high volume manufacturing (HVM). FCB is ready for device requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the world’s best overall cost-of-ownership (COO) for various DUT applications.
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Macom Technology Solutions Holdings Inc.
MACOM GaN RF power amplifier solutions are designed with the latest GaN-on-SiC and GaN-on-Si technologies. Our MACOM PURE CARBIDE series of GaN-on-SiC power amplifiers offers high performance and reliability for the most demanding applications. Our expanding GaN portfolio is designed to address the challenging requirements of Aerospace & Defense, Industrial, Scientific and Medical applications and 5G wireless infrastructure. MACOM GaN products deliver output power levels ranging from 2 W to over 7 kW and exhibit best in class RF performance with respect to gain and efficiency. For sensitive Aerospace & Defense applications MACOM can offer a US only supply chain with AS9100D Certification.
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Rad 100™ -
International Medcom
The RAD 100™ is a general purpose radiation survey meter/geiger counter that detects and measures alpha, beta, gamma, and X-radiation. It is intended for personal safety and educational purposes. Like the popular Radalert® 100X, the RAD 100™ features a 3-second update on its digital liquid crystal display (LCD). The LCD shows the current radiation level in your choice of microSieverts per hour (SI units) or mR/hr for gamma radiation measurements. For mixed sources (alpha, beta, gamma) the CPM mode is recommended. This instrument also offers an accumulated total and timer function, up to 9,999,000 counts and 40 hours. A red LED blinks and a beeper chirps with each count (the chirp can be muted). This is a professional instrument that is also easy to learn to use and to operate, and carries the industry leading Medcom warranty (2 years overall limited to 1 year on the GM sensor). Many instruments designed by the Medcom team are still working perfectly after 30 years of use, so this instrument should provide a lifetime of useful information.
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Sciencetech, Inc.
The Solar Reference Cell consist of a 20 x 20 mm monocrystalline silicon Photovoltaic Cell encased in a 92 x 70 x 16 mm metal enclosure with a protective quartz window and a temperature sensor. The temperature sensor is a 100 ohm platinum Resistance Temperature Detector (RTD).The Solar Reference Cells come with a Certificate of Calibration and compatible set of connecting cables. The following parameters of the reference cell are certified: Isc, Imax, Voc, Vmax, Pmax, Area, Fill Factor and Efficiency. The certification is accredited by NIST to the ISO-17025 standard and is traceable both to the National Renewable Energy Laboratory (NREL), and to the International System of Units (SI). A compatible cable set is also supplied with each Solar Reference Cell.
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AATA Japan Co., LTD.
Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor are being produced under the thorough quality control, and are being used widely in high precision and high reliability electronics circuit such as Measuring Instrument, Medical Instruments, Communication and other Industrial Instruments.
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NEX LS -
Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX LS represents the next evolution of scanning multi-element process coatings analyzers for web or coil applications. To deliver superior analytical performance and reliability, the EDXRF measuring head assembly was derived from the established Rigaku NEX Series high-resolution benchtop instrumentation. With this proven technology, the Rigaku NEX LS delivers rapid, non-destructive, multi-element analyses — for coat weight, coating thickness and/or composition — for elements from aluminum (Al) through uranium (U). The measuring head is mounted on a rigid beam and is equipped with a linear traversing mechanism positioned over a roller so that the head-to-surface distance is constant. Common applications include silicone release coaters, converters, denesting Si for vacuum-formed plastics, RoHS compliance, conversion coatings, metalized plastic, top coatings on metal coil and fire retardants on fabric.
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MTI Instruments
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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ASTM D882 -
National Technical Systems
This test method covers the determination of tensile properties of plastics in the form of thin sheeting and films (less than 1.0 mm (0.04 in.) in thickness). Film is defined in Terminology D883 as an optional term for sheeting having a nominal thickness no greater than 0.25 mm (0.010 in.). Tensile properties of plastics 1.0 mm (0.04 in.) or greater in thickness shall be determined according to Test Method D638. This test method can be used to test all plastics within the thickness range described and the capacity of the machine employed. Specimen extension can be measured by grip separation, extension indicators, or displacement of gage marks. The procedure for determining the tensile modulus of elasticity is included at one strain rate. The modulus determination is generally based on the use of grip separation as a measure of extension; however, the desirability of using extensometers, is recognized and provision for the use of such instrumentation is incorporated in the procedure. Test data obtained by this test method is relevant and appropriate for use in engineering design. The values stated in SI units are to be regarded as the standard. The values in parentheses are provided for information only. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
