Showing results: 226 - 240 of 364 items found.
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Chroma ATE Inc.
Adjustable criteria for different process application or modelFlexible algorithms programming editor for mono-crystalline and multi-crystalline silicon solar cellsMultiple interface to communicate with manufacturing equipment or information systemVarious defects inspection capability from multilayer LED lighting designFlexible design that can be easily integrated to your in-line printing system and sorting system
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AML -
OAI
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Zero Defects International LLC
ZDI utilizes a Seica flying probe tester in order to provide test program development and testing services to customers in Silicon Valley and throughout North America. This is a very cost-effective solution for printed circuit assembly manufacturers who do not have in-house equipment of their own but have customers who require test services.
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Ingenieurbüro Mencke & Tegtmeyer Gm
The silicon solar radiation sensor (Si) sensor provides an inexpensive but yet robust and reliable solution for measuring the solar irradiance specifically for the monitoring of photovoltaic (PV) systems. Due to the structure of the sensor element, which corresponds to a PV module, these sensors are ideally suited as a reference for the monitoring of PV systems to determine the solar radiation.
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TrekSoC-Si -
Breker Verification Systems
TrekSoC-Si automatically generates self-verifying C test cases to run on the embedded processors in SoCs in in-circuit emulation (ICE), FPGA prototyping, and production silicon. This verifies your chips more quickly and more thoroughly than hand-written diagnostics or running only production code on the processors. TrekSoC-Si's generated test cases target all aspects of full-SoC verification and work in a variety of different environments. TrekSoC-Si is a companion to TrekSoC, which generates test cases for simulation and acceleration. TrekSoC-Si extends the benefits of TrekSoC into hardware platforms.
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Tau® SWIR -
Teledyne FLIR
FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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SparkFun Electronics
The SparkFun Qwiic MicroPressure Sensor is a miniature breakout equipped with Honeywell's 25psi piezoresistive silicon pressure sensor. This MicroPressure Sensor offers a calibrated and compensated pressure sensing range of 60mbar to 2.5bar, easy to read 24 bit digital I2C output, and can be calibrated and compensated over a specific temperature range for sensor offset, sensitivity, temperature effects, and non-linearity using an on-board Application Specific Integrated Circuit (ASIC). With its ultra-low power consumption and Qwiic ports, you've got yourself a power packed little sensor!
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aTCA-3710 -
ADLINK Technology Inc.
The aTCA-3710 is a high performance, high bandwidth, 40G Fabric switch blade for AdvancedTCA® platforms. This product is ideal for bandwidth intensive telecom applications such as wireless access controller, DPI/security network, IPTV, IP multimedia subsystem, RNC/BSC, broadband access/bearer network, data center, and LTE/4G network applications. The aTCA-3710 provides 40GbE hub-to-node connectivity and integrated switch silicon that supports load balancing, priority queues, packet classification, and flow control to enable strict bandwidth management for implemented applications.
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Gentec Electro Optics, Inc.
Measure every pulse at up to 200 kHz with MACH 6. Measure with 12-bit digital accuracy and capture up to 4 million pulses in real time. Our MACH 6 Joulemeter is the only instrument in the world that performs at this speed, and with this precision. It is designed to support our full complement of fast energy probes that include Silicon, InGaAs and Pyroelectric Detectors. Measure from pJ to mJ and from 0.35 to 2.5 m. Using the M6-Si detector and the M5-UC-QED accessory, you can make relative measurements at 266 nm.
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Tektronix, Inc.
The IsoVu Measurement Systems can make nearly impossible measurements – like high-side Vgs- a reality, providing today’s power engineer with measurement insights not available in other power systems and instruments. When performing near-impossible measurements, especially in those involving Gallium Nitride (GaN) and Silicon Carbide (SiC), it can be extremely time consuming and cumbersome. IsoVu eliminates those concerns: IsoVu probes offer better common mode rejection and higher bandwidth for high EMI environments and on power FETs like SiC and GaN.
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Insight Product Company
Insight Product Company offers IMPATT diodes with pulse power up to 20 Watt and operational frequency range up to 140 GHz. Silicon p+-p-n-n+ IMPATT diodes are designed to be used in the millimeter wave oscillators and amplifiers. They are fabricated in the metal-ruby packages with hard-lead carrier (diameter 3.0 mm, 1.5 mm).
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Insight Product Company
Insight Product Company offers IMPATT diodes with CW power up to 400 mW and operational frequency range up to 140 GHz. Silicon p+-p-n-n+ IMPATT diodes are designed to be used in the millimeter wave oscillators and amplifiers. They are fabricated in the metal-ruby packages with hard-lead carrier (diameter 3.0 mm, 1.5 mm).
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Four Dimensions, Inc.
Four Dimensions' Mercury Probe Systems use the liquid metal Mercury to form temporary non-damaging electrical contacts on numerous materials. The instantaneous contact formed on semiconducting materials can be of MOS, MIS, or Schottky barrier type. This permits various electrical characterizations of for example silicon and compound semiconductors without the need of metal deposition processes.
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VLSI Standards, Inc.
The Solar Reference Cells consist of a 20 mm x 20 mm monocrystalline silicon Photovoltaic Cell encased in a 92 mm x 70 mm x 16 mm metal enclosure with a protective quartz window and a temperature sensor. Designed for calibrating the irradiance of solar simulators used for testing solar cells and modules.
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PN-12α -
NAPSON Corp.
*Thermo electrode and cold electrode is mounted detecting part of measuring probes*Possible to check most figure of sample such as single crystalline silicon wafer, bulk, ingot and so on*Please select from 2 types;1) 2 probe ver.(Hot probe, Cold probe),2) 1 probe ver.(Hot & Cold probe)