Showing results: 16 - 30 of 33 items found.
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TROI 7700 SERIES -
Pemtron Co., Ltd
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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3Si Series -
Saki Corporation
Saki's 3D SPI identifies critical defects and assists with process improvement.
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SRS-1C -
Malcom Co.,Ltd.
Reproduce the temperature profile of Reflow oven. Can observe the melting state of solder paste.
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YSi-SP -
Yamaha Motor IM
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Stencil Washer -
Aqueous Technologies Corp.
Harnessing the Safe Power of Sound-Waves, StencilWasher Removes all Solder Paste and SMT Adhesive Types in Zero or Low Discharge Configurations
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Nordson Corporation
High-precision benchtop fluid dispensing control for advanced applications of glues, oils, greases, epoxy, silicones, sealants, cyanoacrylates, solder pastes, and other assembly fluids dispensed with syringe barrels.
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CmPrint -
CeTaQ GmbH
Measurement of the Force-Time Curve while Printing. The first step into the manufacturing of electronic printed circuit boards (PCBs) is printing. The solder paste is printed on the PCB using a stencil. The equal distribution of the paste pressure is crucial and affects the overall quality of the finished circuit board. An important influencing factor is the accuracy and reproducibility of the squeegee force.
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MC301 -
Manncorp
Meet precise solder paste specifications for preheat, soak, reflow, and cooling with this easily programmed batch reflow oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC301 is ideal for product development, prototyping, and manufacturability testing.
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SE Series -
ASC International, Inc.
The CyberOptics SE Series offers the most accurate and repeatable, high speed 3D solder paste inspection in the market today. Utilizing the most advanced sensing technology, CyberOptics SPI products will provide manufacturers the reliability needed to compliment your overall screen print process improvement strategy.
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Aprotec Instrumentation Ltd
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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AP430 -
Manncorp
With the features, performance, and build-quality of systems twice its price, Manncorp's AP430 Fully-Automatic Inline Stencil Printer brings affordability to leading-edge, solder paste printing technology. Capability for 01005 chips, µBGAs, and 12-mil ultra-fine-pitch components is now at a price point that will fit even the most modest budgets of surface mount manufacturers who require full automation and high throughput.
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Interface Analysis -
Akrometrix, llc
Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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Marantz Electronic Ltd.
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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SIGMA Link -
Vi Technology
SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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EverythingPCB
ATE, ICT, semiautomatic & manual electronic test fixtures, PCB test fixtures, cable test fixture, wiring harness test fixtures, dedicated test fixtures, functional test fixtures, electronic test fixture programming. PADS Schematic capture, circuit board layout, PCB design prototype, solder paste stencils, X-Y coordinate data, B.O.M. maintenance, and manufacturing documentation, Gerber data.