- Pickering Interfaces Inc.
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Connector, 104-Pin D-Type Female, Solder Bucket, 5A, 4-40 UNC Screwlocks
C104DFR-2SB-1A
This 104-pin female D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied with rear cable entry backshell. This connector is suitable for use with Pickering modules that use the 104-pin D-type connector.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is r...show more -
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, i...show more -
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Grypper G35 / G40
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during inserti...show more -
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Grypper "Y"
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
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Socket Accessories (SMT Options)
The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Used to solder Mini Coax Solder Sleeve contacts.
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Solder Impurity Checker
STA-2
Necessity for on-site lead-free solder management.Applicable for RoHS Directive. (WEEE: Directional on Waste from Electrical and Electronic Equipment, Pb mixed rate under 0.1%) Lead measurement accuracy is +/-150 PPM. Manage increases and decreases of Pb and Cu in your lead-free solder.
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Solder Paste Analyser
SPA 1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Solder Paste Printers
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Solder Test Pallet
WaveRIDER® NL 2
The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER NL 2 process pallet.
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Solder Wettability Tester
5200ZC
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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Solder Wettability Tester
5200TN
Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
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Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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3D Solder Paste Inspection
aSPIre 3
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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Solder Cup Connector Kit
Y1141A
Used to build custom cables for 34951, 34952 – 50-pin Dsub male – 125 V.
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Solder Cup Connector Kit
Y1140A
Used to build custom cables for 34922, 34924 – 78-pin Dsub female – 60 V
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Solder Cup Connector Kit
Y1139A
Used to build custom cables for 34921/23/25/31/32/33/37/38 –50-pin Dsub female – 125 V
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Solder Cup Connector Kit
Y1142A
Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.
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Solder Joint Inspection System
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
