Showing results: 1 - 15 of 17 items found.
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WSD-2A -
Langeo Co., Ltd.
WSD-3 system is developed on the basis of years’ research and integrated with the latest technologies, such as 14bit A/D, surface mount technology and multi-layer PCB, etc.
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CAES
CAES provides high performance, compact, rugged, DREX modules utilizing surface mount and hybrid chip and wire technology as required by the end application. End applications span radar, electronic warfare, missile, and space applications.
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Mercury Systems, Inc.
Mercury’s family of surface-mount noise sources provides exceptional performance in a compact and easy to integrate package. These products are ideal for applications such built-in test and dithering circuits where the system requirements drive a need for compact, surface mount technology.
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Comtel Electronics
ANSI/VITAV 1-1994 VME32 Backplane, 6U 5 Slot Including J1 & J2.Benefits:• Standard VME backplanes are available also in other slot count configurations• Surface Mount Technology – Excellent high frequency performance, high reliability and reduced cost due to SMT
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AP430 -
Manncorp
With the features, performance, and build-quality of systems twice its price, Manncorp's AP430 Fully-Automatic Inline Stencil Printer brings affordability to leading-edge, solder paste printing technology. Capability for 01005 chips, µBGAs, and 12-mil ultra-fine-pitch components is now at a price point that will fit even the most modest budgets of surface mount manufacturers who require full automation and high throughput.
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VIP2 -
MISCO Refractometer
The MISCO VIP2 (“Very Important Process”) inline process refractometer showcases the latest advancements in smart-sensor technology. Housing the intelligence for processing and communication in the sensor itself, the VIP2 refractometer eliminates the need for an external control box. The stainless steel sensor head and sapphire measuring surface are designed to survive the toughest environments. The sensor mounts to your processes using an industry standard 2” Tri-Clamp fitting.
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Teledyne RF & Microwave
Teledyne’s Bulk Acoustic Wave (BAW) Product Line has been producing BAW delay devices since the early 1960’s. Over the years, Teledyne Microwave Solutions (TMS) has constantly improved BAW technology and is currently the world’s only supplier of microwave bulk acoustic wave delay devices. Markets for BAW devices include instrumentation and radar altimeters and are available in connectorized, pin and surface mount configurations.
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Amitron Corp.
Double Sided PCBs (also known as Double-Sided Plated Thru or DSPT) circuits were the gateway to higher technology applications. The advent of the plated thru hole was quickly adapted and allowed electronic designs to expand in capability and shrink in physical size. Today the double sided printed circuit board technology remains the workhorse of the assembly industry. There are near limitless applications for old and new designs. Fine line surface mount, ultra high copper build, high and low temperature, Solder coated, Silver, and Gold finishes are just a few examples of DSPT applications.
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QQA Series -
Semiconductor Circuits, Inc.
The QQA series features the latest in MOSFET design, state of the art surface mount technology, and offers a 4:1 ultra-wide input range, and efficiencies greater than 80% (typ). Features include continuous short circuit protection, 500 Vdc I/O isolation, and an operating temperature range of -25°C to +71°C with no derating. All models are packaged in a six-sided shielded miniature case measuring only 1.0” x 2.0” x 0.4” high.
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Grid-EYE -
Pure Engineering, llc
The Panasonic Grid-EYE® is a type of thermal imaging sensor that can detect the presence of people or objects based on their heat signature. It consists of an 8x8 grid of 64 thermal sensors, which allows it to provide a detailed temperature map of the area being monitored. The built-in lens has a 60 degree viewing angle. The Grid-EYE features compact surface mount design using MEMS thermopile technology and offers digital output (I2C) for thermal presence, direction, and temperature values.
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Teledyne Defense Electronics
Teledyne RF & Microwave has been producing Bulk Acoustic Wave (BAW) delay devices since the early 1960’s. Over the years,Teledyne has constantly improved BAW technology and is currently the world’s only supplier of microwave bulk acoustic wave delay devices. Markets for BAW devices include instrumentation and radar altimeters and are available in connectorized, pin and surface mount configurations.BAW devices operate as low as 300 MHz and as high as 17 GHz, usually in sub-bands of around 10%. Depending on the delay and frequency of operation the insertion loss is in the range 30 dB to 90 dB.
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HA/HP Series -
Semiconductor Circuits, Inc.
The HA/HP series features the latest in MOSFET design, state of the art surface mount technology, and offers a 4:1 ultra-wide input range, and efficiencies greater than 75% (typ). Features include Pi input filter to reduce input reflected ripple, continuous short circuit protection, and excellent line and load regulation of ±0.25% for line and ±1.0% load. Additional standard features include, 500 Vdc I/O isolation, and an operating temperature range of -25°C to +71°C with no derating. All models are packaged in a six-sided shielded miniature case measuring only 2.0” x 2.0” x 0.375” high.
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Series CD -
Teledyne Defense Electronics Relays & Coax Switch
The CD series Solid-state Relay utilizes the latest technology to provide a low ON resistance. The control circuit is buffered to enable the relay to be driven directly from standard CMOS or open collector TTL logic circuits. Available options include short circuit protection and current overload protection or a status output line.MSL 1CD relays are controlled by 3.8-6VdcC = Through-hole mount SC = Surface mountAvailable options include:CD00CF 2A, 60Vdc LoadSCD00CF 2A, 60Vdc LoadCD01CF 2A, 60Vdc Load; control statusSCD01CF 2A, 60Vdc Load; control statusCD20CD 1A, 60Vdc Load; short-circuit protectionSCD20CD 1A, 60Vdc Load; short circuit protectionCD21CD 1A, 60Vdc Load; short-circuit protection & control statusSCD21CD 1A, 60Vdc Load; short circuit protection & control status
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Series HSF -
Kepco, Inc.
- Hot-swappable plug-in power supplies.- Designed to be combined in an N+1 fault-tolerant power system.- Front panel voltage adjustment trimmer for adjustment of output voltage.- Built-in forced current sharing and or-ing diodes.- May also be used independently as a multi-output power supply.- Designed to be sustainable - new models are backward compatible with existing racks.- Available in 1U and 3U sizes. Mounts in 19-, 23-, and 24-inch equipment racks.- All models include power factor correction (PFC).- Full service customized DC power distribution systems can match power supply output(s) with your load(s).- I/O connections via 24 pin connector that plugs into rack adapter. External connections are made via rack adapter.- Surface mount technology permits minimum mounting space.- Entire RA 19 racks populated with HSF power supplies can be connected in parallel, parallel-redundant or series.- HSF are CE Marked per per the LVD, EMC and RoHS 2 Directives. See applicable Declaration of Conformity.- Compliant with UL 8750, Standard for LED Equipment,- Watch video of NEBS GR-63-CORE earthquake and office vibration testing.
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AWA-0142 -
Anokiwave Inc.
The AWA-0142 is an active array for 5G wireless applications developed using planar antenna technology resulting in a very low profile, lightweight unit. The surface mount assembled antenna board is based on Anokiwave’s AWMF-0135 Silicon Quad Core IC and demonstrates the performance achievable using low power silicon integration and efficient antenna layout and design. Using the AWMF-0135, the antenna provides +60dBmi (1000 W) of EIRP. The electronic 2D beam steering is achieved using analog RF beam forming, with independent phase and gain control in both Tx and Rx operating modes. The AWA-0142 antenna leads the way in showing how 5G coverage can be rolled out by network operators using the mmW bands, with low power footprint and high energy efficiency, while meeting key operating specifications for data rate, latency, coverage, and reliability.
