Showing results: 166 - 180 of 232 items found.
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Abaco Systems Inc
The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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HELIOS -
Diamond Systems Corp
Helios is a low power, mid-range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 800MHz or 1GHz, and 256MB of DRAM soldered on-board.
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SX-SDMAC -
Silex Technology
This Wi-Fi SDIO module is a low-power, single-stream solution with 802.11a/b/g/n/ac support based on the QCA9377 System-on-Chip from Qualcomm Atheros. This module supports Wave 2 MU-MIMO (Client), which increases the overall WLAN system performance by 3X compared to 11n. The module’s small form factor, rich features, and low power make it perfect for portable devices.
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SAJE -
SiliconAid Solutions, Inc.
SAJE is the SiliconAid Suite of JTAG related standards focused tools for chip development, verification, validation and patterns generation of ATE, Board, and System Test. Each tool can be used as a point tool by itself to compliment other tools in your flow. However, the SAJE Tool Suite used together in a flow can provide a total solution that also leveraging previous steps for debug and analysis.
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Bluey -
Electronut Labs
Bluey is a BLE (Bluetooth Low Energy) development board with Temperature, Humidity, Ambient Light and Accelerometer sensors. Bluey uses the Nordic nRF52832 BLE SoC (System on a Chip) which has an ARM Cortex-M4F CPU and a 2.4 GHz radio that supports BLE and other proprietary wireless protocols. It also supports NFC, and in fact the board comes with a built-in NFC PCB antenna. Open Source
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DPA Components International
DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
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MC400 -
Manncorp
The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Mornsun Guangzhou Science & Technology
MORNSUN launched the self-designed electronic integrated circuits according to the different product lines, types of the integrated circuit include AC/DC power supply control ICs, DC/DC power supply control ICs, interface ICs, start-up ICs, contactor power saving controller ICs and digital isolator ICs. MORNSUN IC chip can be widely used in industrial equipment, process control, data acquisition system, building automation, smart meter, etc. Adopting MORNSUN's AC/DC transformers and DC/DC transformers, with the use of its control ICs, can achieve wide voltage input flyback power supply design with multiple protection functions and superior EMI performance. We hope that those power transformers along with the integrated circuits & chips electronics can be an ideal fit for your application needs.
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1024L1 -
Princeton Infrared Technologies, Inc.
The 1024L1 is a 1024x1 state of the art InGaAs linear array imager on 12.5 µm pitch that was built for both spectroscopy and machine vision in the short wave infrared band. The 1024L1-12.5-T is an advanced digital array with the lowest read noise available <110e- for a 250 μm tall pixel. Our new advanced SWIR On-chip Noise Suppression Circuit will enable some spectroscopic applications to see read noise levels <80e-. A single ROIC chip is used thus minimizing variation from output to output found on linear arrays with multiple ROICs. The chips have built in 14bit A/Ds that are designed for the system thus maximizing dynamic range and minimizing the noise while enabling 34k lines/s at 1024 elements. Multiple full well capacities from 75ke- to 100Me- with 128 steps are available to optimize the array for the signal levels. On chip optical pixel binning (where every other detector is disconnected from the ROIC thus signal is captured by neighboring pixels) is available by command to trade spectral resolution for increased signal level. Pixel skipping or binning is also available allowing for 48k lines/s at 512 resolution on the same imager.
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Xeltek
Until now,Support 396 IC manufacturer, 94596 pcs devices and keeps growing.Support devices with Vcc from 1.2V to 5V. The programming speed up further increase 30% compared to SUPERPRO 5000.The programmer support files up to 256 GBytesBuilt with 144 universal pin-drivers.Universal adaptors are available for varies packages up to 144 pins. New device support will be easier. PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.Advanced and powerful functions.Production mode start chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Serial numbers generators are available as standard or customer-specific functions.Log file is useful for quality tracking. Over-current and over-voltage protection for safety of the chip and programmer hardware. WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility
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SystematIC
Designing and developing 'System on Chip' products involves partitioning of the system into sub-systems or smaller blocks. Many of the blocks will be critical in the performance of the system so it is important to relate product specifications and block specifications correctly. Blocks that are not so specific to a certain system but are generally used in many integration projects we gather and label as 'Auxiliary IP' blocks. The performance of such blocks can also be critical in the system so careful consideration and selection is needed. We are aware the optimal performance-point of a block may be different in each system, for some in low-voltage operation, for others in strong output drive, and so on. Our broad IP portfolio and customization support enables quick application in new IC product developments.
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Teledyne LeCroy
NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
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Q7-BT -
ADLINK Technology Inc.
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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McBain Z-NIR Near Infrared Inspection Microscope -
McBain Systems
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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KLA-Tencor Corp
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
