Showing results: 1096 - 1110 of 1156 items found.
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PICO500 -
Axiomtek Co., Ltd.
The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Elbit Systems of America®
The Durham is a high-performance, highly-mobile and easy to emplace Medium Range Day/Night Wireless Surveillance System using a state of the art day camera and a cooled, highly sensitive 640x480 InSb Focal Plane Array thermal camera with 8X continuous optical zoom. The system is image stabilized and has automatic tracking of targets. Each system consists of a Base Station and one Remote Station which can be emplaced up to 5km away for wireless operation or within 500m for fiber optic operation. A single Base Station can monitor and control up to four (4) Remote Stations. The system is powered by a generator, batteries, solar (supplemental power), or vehicle power. Other options available are laser pointers, designators, and a vehicle integration kit.
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40-412A-024 -
Pickering Interfaces Ltd.
16-Channel Digital Output modules with high output voltage and current capability. The outputs can be used for high or low drive and each channel is capable of sourcing 0.5A from the high side or 0.5A sink on the low side. Accidental operation of both high and low side driver on the same channel is prevented by the supplied driver. Outputs are fully protected against over-voltage, over-current and thermal overload, ensuring robust and reliable operation in the toughest test environments. For high side driving, the voltage source is supplied externally, allowing the module to drive high capacity loads separate from the chassis power supply. For low side driving, the external source is not used and the module’s output operates an open collector or open drain driver.
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Talon RTX 2590 -
Pentek, Inc.
- Rugged 1/2 ATR MIL-spec chassis- Designed to MIL-STD-810 for harsh mechanical and thermal environments- Environmentally sealed- Internally conduction-cooled- Designed to MIL-STD-461 for radiated and conducted RF- EMI power line filter- Compact and lightweight design - 22 lb (10kg)- Ideal for UAVs, military vehicles, aircraft pods and outdoor environments- RF/IF recording with eight phase coherent 250 MHz 16-bit A/Ds- Sustained real-time record rates up to 4 GB/s- QuickPac drive packs add a valuable convenience to the 1/2 ATR recorder with up to 61 TB data storage- 12 to 28 VDC power supply- Optional GPS receiver for precise time and position stamping- SystemFlow API, GUI and Signal Viewer analysis tools- Optional telnet remote connection to recorder
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Talon RTX 2586 -
Pentek, Inc.
- Rugged 1/2 ATR MIL-spec chassis for harsh mechanical and thermal environments- Environmentally sealed- Internally conduction-cooled- Fully sealed for RF emissions with EMI power line filter- MIL-STD circular connectors- Compact and lightweight design - 18 lb (8 kg)- QuickPac® drive packs allow quick removal of all data storage up to 61 TB via the front panel- Ideal for UAVs, military vehicles, aircraft pods and outdoor environments- RF/IF recording with phase coherent 200 MHz 16-bit A/Ds and DDCs- Sustained real-time record rates up to 4 GB/s- 12 to 28 VDC power supply- Optional GPS receiver for precise time and position stamping- SystemFlow GUI, API and Signal Viewer analysis tools- Optional telnet remote connection to recorder
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Advanpack Solutions Pte Ltd.
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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U Light -
Teledyne Marine Bowtech
The Teledyne Bowtech U light is for use on subsea platforms that operate down to 6000m depths, requiring a 120Vac Ultra- bright 10,000 lumen, LED Floodlight. The 80° wide LED floodlight beam angle is ideal for colour video inspection tasks. Housed in hard anodised aluminium, this deepwater LED floodlight measures in at 82mm Ø by 148.4mm long and comes with thermal protection ensuring that the light does not overheat if accidentally run in air. The U Light has the capability of being controlled externally by normal ON / OFF power switching or by using phase control diming techniques enabling the operator to produce a varying level of light intensity. This extremely robust U Light LED floodlight is ideal for clear visibility in deep depths on larger work class ROVs, Trenchers and Tractors.
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StarBright 7Z01580 -
mks Ophir
*Compatible with all standard Ophir thermal, BeamTrack, pyroelectric (PE-C series) and photodiode sensors*Brilliant color large size TFT 320x240 display*Choose between Digital with Bargraph, Analog Needle, Line Plot (for laser tuning), Pulse Chart, Pass/Fail, *Position, Stability, Real Time Statistics displays*Sophisticated power and energy logging, including logging every point at up to 5000Hz with Pyro sensors*Math functions for advanced processing such as Density, Scale Factor, Normalize against base line, etc.*Can mix functions together and display the results graphically. Function results can also be logged.*USB Disk on Key (Thumb Drive) for nearly unlimited data storage.*USB and RS232 interfaces with StarLab PC applications and User Commands document
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51101 -
Chroma Systems Solutions, Inc.
Models with 1, 8, and 64 channels on-line data recording. Multi-sets linked to a PC for hundreds of channels are doableSupports B, E, J, K, N, R, S, and T type thermal couples with ITS-90 defined temperature rangeIndividual channel cold junction compensation withTemperature resolution up to 0.01℃, error down to (0.01% of reading+0.3℃)Voltage full range ±480VDC, ±10VDC; resolution 1mV, 10uV; error down to (0.1% of reading+1mV), (0.015% of reading+100uV)1000VDC channel to channel isolation, full protection for testing points with charge and guarantee for accurate measurementsThermal couple open circuit detectionPC-based operation with powerful software for recording and analyzing data1 and 8 channel models are USB powered. No battery or external power supply is required
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PCE Instruments
The inspection camera opens a new view into the insides of machines and systems; whether an endoscope, thermal imaging camera or infrared thermometer - an inspection camera is the ideal instrument for monitoring and maintenance.Due to the flexible control of the endoscope or the visual display of potential damage areas in machines or systems, weaknesses and points of failure can be detected and therefore be prevented. The inspection camera make this possible without the need for complex disassembly.The inspection camera is used by electricians, safety experts, expert witnesses, mechatronics, and mechanics. The inspection camera is also used for apprenticeships and in-service training. An inspection camera can be applied internally as well as at school or at universities for demonstration purposes. With their help, inspections in the industrial sector can be organized considerably faster, more targeted and more cost-efficient. An inspection camera is an important companion in the course of everyday work.
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42-412A-024 -
Pickering Interfaces Ltd.
The 40-412A-024 (PXI) and 42-412A-024 (PXIe) are 16-Channel Digital Output modules with high output voltage and current capability. The outputs can be used for high or low drive and each channel is capable of sourcing 0.5A from the high side or 0.5A sink on the low side. Accidental operation of both high and low side driver on the same channel is prevented by the supplied driver. Outputs are fully protected against over-voltage, over-current and thermal overload, ensuring robust and reliable operation in the toughest test environments. For high side driving, the voltage source is supplied externally, allowing the module to drive high capacity loads separate from the chassis power supply. For low side driving, the external source is not used and the module’s output operates an open collector or open drain driver.
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Talon RTX 2589 -
Pentek, Inc.
- Rugged 1/2 ATR MIL-spec chassis- Designed for harsh mechanical and thermal environments- Environmentally sealed- Internally conduction-cooled- Fully sealed for RF emissions with EMI power line filter- MIL-STD circular connectors- Compact and lightweight design - 22 lb (10kg)- Ideal for UAVs, military vehicles, aircraft pods and outdoor environments- Capable of recording RF/IF frequencies to 2.8 GHz- Ultra Wideband recording with 3.6 GHz 12-bit A/D- Selectable 1.8 GHz dual channel mode- Up to 61 TB of solid state storage in removable QuickPac- Sustained real-time record rates up to 4 GB/s- 12 to 28 VDC power supply- Optional GPS receiver for precise time and position stamping- SystemFlow API, GUI and Signal Viewer analysis tools- Optional telnet remote connection to recorder
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Anderson Materials Evaluation, Inc.
Our numerous analytical techniques, we tackle a wide range of materials challenges and commonly combines several analytical techniques to fully address complex and multi-dimensional materials issues. Our materials analysis laboratory provides XPS surface analysis, thermal analysis (TGA, DSC, TMA), FTIR infrared spectroscopy, UV-Vis spectrophotometry and reflectivity measurements, gas chromatography – mass spectroscopy (GC-MS), SEM/EDX, optical microscopy, mechanical testing, electrochemistry and corrosion analyses, residual gas mass spectroscopy, contact angle measurements, surface contamination measurements, adhesive bonding failure analysis, facility testing for silicone contamination, mechanical testing, metallography and fractography, density and porosity measurements, volatile organic component testing, friction, and other analytical capabilities. We continue to upgrade and expand our arsenal of analytical techniques and custom analytical methods to support our customers’ needs.
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Marposs S.p.A.
Marposs complements its geometric measurement solutions with solutions for non-destructive testing using eddy current technology.The testing options can be divided in three large groups:Material integrity test, to check for the presence of defects (cracks, porosity, blow holes, inclusions) on the surface and in the layer just below the surface.Material properties test, to check if the thermal cycles (hardening, hardening and tempering, annealing, stress relieving, etc.) have been performed correctly. Material identification checks are done to sort parts with the same geometry but made with different materials.Thread inspection to check if the treading has been carried out and its quality.In addition to the non-destructive checks performed with the eddy currents, we have developed a durometer for the conventional measurement of surface hardness, according to the Rockwell scale (HRC or HRA); which uses a diamond penetrator to measure the hardness of the sample being tested.
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TP121-TH -
Gigahertz-Optik GmbH
The photometric specifications of LEDs must meet very high tolerance requirements regardless of whether they are to be used in general, automotive or other specialist lighting applications. This is often a problem since the manufacturing tolerances of LEDs can be higher than those permitted in the end-use applications. Also, LED binning by LED manufacturers in order to classify LEDs based on their tolerances is performed with flash mode testing using pulsed current flow. However, end-use applications of the LEDs often operate in constant current mode and with significant thermal effects. The sophisticated LED processing industry therefore requires measurement devices that can be used for both manufacturer-compliant pulsed mode, as well as constant current operation mode. When the LEDs are run in constant current mode, the junction temperature has significant influence on the performance and lifetime of the LED. Therefore, test systems should be able to test the LEDs at specific junction temperatures.
