Showing results: 1 - 15 of 31 items found.
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Q-400 TCT -
Dantec Dynamics A/S
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Minitile™ with Advanced Cantilever™ technology and WedgeTile™ -
Celadon
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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ACMAS Technologies Pvt. Ltd.
observe the product characteristics and failure occurrences caused by different materials and their thermal expansion coefficients, thermal shock testing is subjected to the product. In thermal shock testing alternating high and low temperatures are fed in the chamber. WEIBER designs and manufactures customised THERMAL SHOCK CHAMBERS with separately controlled temperature zones (2 zone and 3 zone), liquid to liquid (2 zone) depending on configuration of the chamber chosen.
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Sanwood Environmental Chambers Co ., Ltd.
Three zone thermal shock chamber uses the test material structure or composite material to withstand the degree of extreme high temperature and low temperature in a continuous environment in an instant, so as to test the chemical changes or physical damage caused by thermal expansion and contraction in the shortest time.
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E1737A -
Keysight Technologies
The Keysight E1737A Material Sensor monitors the temperature of an object being measured or of the work piece itself. The sensor detects temperature changes and automatically compensates for thermal expansion errors.
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Anton Paar GmbH
The TORC (Thermo-optical Oscillating Refraction Characterization) technique applies decades of know-how in optical instrumentation to thermal analysis in a novel and unique way. The technique requires minimal sample preparation at maximal tolerance for sample properties. You can determine the coefficient of thermal expansion, glass and phase transitions as well as polymerization for various samples: liquids, gels, pastes, and certain solids. For example: cured and uncured resins, adhesives, glues, etc. can easily be characterized. Both thermal and time-dependent processes can be monitored with minimal effort.
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Bowers Group
Designed to measure both internal and external diameters and lengths, the high modulus carbon fibre beam is stiff, lightweight and has an extremely low co-efficient of thermal expansion (CTE). Suitable for measuring high accuracy diameters and lengths up to 4000mm+.
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Lightel Technologies, Inc.
Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Cincinnati Sub-Zero Products
We provide a large selection of thermal shock chambers to accommodate various types of product testing. Thermal Shock Chambers perform tailored environmental stress screening of component and board electronic assemblies. Our unique chamber design transfers product between two extreme temperature-controlled chambers, passing equal volumes of high velocity conditioned air over the product and resulting in rapid product temperature changes. The induced thermal stresses can reveal hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
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Guangdong Bell Experiment Equipment Co.,Ltd
DGBell’s Thermal Shock Chamber provide the sudden temperature changes between extreme cold and extreme hot from -65℃ to 150℃ (customized available), specially for environmental stress screen test of the industries that rely on thermal testing, such as component, board electronic assemblies, defense, material stress, consumer products etc. The thermal shock test can cause faulting or cracking by the expansion and contraction on the products, indicates the hidden manufacturing defects. Bell’s Thermal Shock Chamber ensure you to launch qualified product to the market.
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CTE-360 -
Analysis Tech Inc.
The CTE-360 measures thermal expansion coefficients on wide range of materials over a temperature range of -20°C to 100°C. Although intended primarily for the study of materials used in electronic packaging applications, it can be used on virtually any solid, gel, paste, or viscous liquid over this temperature range.
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Fraunhofer-Gesellschaft
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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TA Instruments
Thermal Analysis is important to a wide variety of industries, including polymers, composites, pharmaceuticals, foods, petroleum, inorganic and organic chemicals, and many others. These instruments typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature. Properties characterized include melting, crystallization, glass transitions, cross-linking, oxidation, decomposition, volatilization, coefficient of thermal expansion, and modulus. These experiments allow the user to examine end-use performance, composition, processing, stability, and molecular structure and mobility.
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Tru Pointe Ultra -
Bacharach, Inc.
The Tru Pointe® Ultra is a low-cost handheld ultrasonic leak detector capable of finding leaks of any gas type, including refrigerants, air (compressed or vacuum) and nitrogen. The Tru Pointe® Ultra can also be used for thermal expansion valves and steam traps, making it a very versatile leak detector.
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Wewon Environmental Chambers Co, Ltd.
Automated Test Equipment (ATE) adopts PID+PWM principle VRF (Refrigerant flow control) technology to realize low temperature and energy saving operation (servo control technology of refrigerant flow based on thermal condition of electronic expansion valve). Realize the automatic constant temperature of the studio.https://www.wewontech.com/automatic-test-equipment/