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Thermal Simulation
Model heat generation and conduction.
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EM & Thermal Simulation Software
SEMCAD X
Schmid & Partner Engineering AG
SEMCAD X is the latest generation of 3-D FDTD full-wave simulation software offering unprecedented levels of user-friendliness, speed & memory efficiency. Its application range has been further greatly extended by incorporating the world's first EM ADI-FDTD solver.
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Field Simulation Software
QuickField™
QuickField™ is a very efficient Finite Element Analysis package for electromagnetic, thermal, and stress design simulation with coupled multi-field analysis.
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Thermal Simulation
Many materials and products have temperature-dependent characteristics; this makes analyzing the impact of heat and ensuring thermal management of structures and fluids crucial in product development. The SimScale cloud-based platform allows you to predict the airflow, temperature distribution and heat transfer. Use thermal simulation to analyze and optimize your product early in the design phase.
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Verification and Validation with SimScale
SimScale strives to deliver a complete CAE platform to its users, which they can fully trust. In order to meet their expectations, SimScale continues to verify and validate all major features as they are added over time. By verification, SimScale ensures that the problem in hand was conducted properly and by validation, it takes it to the next step to ensure that the results reflect the reality. On a regular basis, multiple validations are performed whose results are compared either to analytical or to experimental data. This page highlights some of the projects performed to validate the features of fluid, structural, thermal and thermomechanical simulation solvers.
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3U VPX RL Thermal Load Simulation Module
The 3U power test module is an ideal solution for evaluating heat dissipation in a rugged conduction cooled VPX cage or chassis. This card is a thermal load in the chassis to evaluate the heat dissipation. The chassis can be monitored with temp sensing probes and or FLIR imaging. Different wattages are selected by setting dip switches. The +5 and 3.3V loads are on the top of the module. The +12V and -12V loads are on the bottom side of the module.
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Environmental Simulation Testing
Innovative Testing Solutions, Inc.
We have multiple chamber capabilities of simulation most environmental conditions. Our chamber range in capacity from 1 ft3 to 64 ft3 volume. Specialty chambers include air-to-air thermal shock, inert gas injection oven, high/low pressure water spray and direct-injection LN2 chambers.
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Heat Cycling System
Yangzhou Power Electric Co., Ltd
High current test systems are used to test the thermal stability of equipment and components. The test system induces a current in the test object causing it to heat up.The system can perform the heat cycle testing for power cables type test and pre-qualification test according to IEC 60840, and IEC 62067 etc. Based on pre-qualification test needs, test system is divided into two parts: test sample loop and simulation temperature loop.
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Electronic System Design
ESD
Smart connected devices are everywhere, in homes, in transportation, and at work. This means electronic system design (ESD) is having a greater influence on almost every type of product requiring new simulation tools to help achieve electronic, electrical, mechanical, thermal, and connectivity goals. Altair’s simulation-driven design tools enable your team of specialized engineers to collaborate across all aspects of printed circuit board development from concept to manufacturing. Our products streamline your process, eliminate design iterations, and reduce time-to-market.
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Rapid Temperature Change Test Chamber
Sanwood Environmental Chambers Co ., Ltd.
Cover temperature,humidity, thermal shock with rapid temperature change rate, vibration testing. The simulation product detects whether the adaptability and characteristics of the product itself have changed under the combined conditions of temperature and humidity in the climate environment (high and low temperature operation & storage, temperature cycle, high temperature and high humidity, low temperature and low humidity, condensation experiment. etc.).
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OM Thermal Stress System
Conductor Analysis Technologies, Inc
The OM Thermal Stress System is a cost-effective performance based reliability test methodology which performs convection reflow assembly simulation and air-to-air thermal cycling. The methodology is utilized by both the IPC PCQR and the IPC 6012-QLM programs. OM systems are available for sale or lease, and test services are provided from both CAT and our service partners.
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Optical Design and Simulation Services
The key area of expertise and the basis for all developments at the Fraunhofer IOF is optical and mechanical design as well as the simulation and analysis of optical and opto-mechanical systems inclusive of thermal and thermo-optical effects. Extensive design and modeling tools enable the simulation and optimization of systems for the THz to X-ray range - from micro-optics to astronomical telescopes.
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Thermal Test Vehicles
TTV
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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Thermal Vacuum Chamber
Telstar Vacuum Solutions offers innovative custom solutions in design, construction and installation of space simulation thermal vacuum chambers, specially developed to optimize testing efficiency.
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Electronic System Design
ESD
Smart connected devices are everywhere, in homes, in transportation, and at work. This means electronic system design (ESD) is having a greater influence on almost every type of product requiring new simulation tools to help achieve electronic, electrical, mechanical, thermal, and connectivity goals. Altair’s simulation-driven design tools enable your team of specialized engineers to collaborate across all aspects of printed circuit board development from concept to manufacturing. Our products streamline your process, eliminate design iterations, and reduce time-to-market.
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Test House Services
At TS-Space Systems we have over 30 years experience in designing, building and operating vacuum systems for space simulation and materials testing. We have three in-house thermal vacuum chambers which are configurable for a range of temperatures for either monitored vacuum bakeout or thermal vacuum cycling. We design, build and operate these systems in-house which means we are more flexible than most test houses and are happy to modify feedthroughs, manufacture additional support equipment and even change the operation of the chambers, where possible, in order to accomodate customer requirements.
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Electronics
Electromagnetic, Signal Integrity, Thermal and Electro-Mechanical Simulation Solutions. The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs
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Vacuum Systems
Custom vacuum systems, and retrofits into existing systems, are also available.Electrogrip has extensive in-house and customer system design experience ...Mechanical, flow, and thermal simulation;Mechanical design and fabrication;Software system automation.DepEtchPro control software permits rapid automation, without programming:Process systems and robotic motion control are automated with job files and icon setup.Always under user control, hence permitting unlimited field upgrades.
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*AdvancedTCA, Type 11A, 5U 19" Horizontal, AC
11A05FJB58Y4HGBX
Elma's ATCA, AC, 5U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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*AdvancedTCA, Type 11A, 4U 19" Horizontal, DC
11A05GJA48Y3HMXX
Elma's ATCA, DC, 4U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fans, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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*AdvancedTCA, Type 11A, 6U 19" Horizontal, AC
11A06FJB68Y4HGBX
Elma's ATCA, AC, 6U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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product
*AdvancedTCA, Type 11A, 5U 19" Horizontal, DC
11A06FJB58Y4HMXX
Elma's ATCA, DC, 5U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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*AdvancedTCA, Type 11A, 3U 19" Horizontal, AC
11A02FJB38Y4HGBX
Elma's ATCA, AC, 3U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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*AdvancedTCA, Type 11A, 2U 19" Horizontal, DC
11A02FJB28Y3HMXX
Elma's ATCA, DC, 2U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
