Showing results: 241 - 255 of 485 items found.
-
WS-8800 -
NAPSON Corp.
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
-
Elcometer Limited
Produced specifically for the automotive aftermarket and Insurance Assessors, 3rd party consultants, body shops and used car sales, these kits provide an instant measure of the coating thickness of panels.An illuminated magnifier is supplied to enable close inspection of bodywork.Measurement parameters include:Surface temperatureSurface inspectionCoating thickness
-
CER – SE 500adv -
SENTECH Instruments GmbH.
* The SE 500adv combines ellipsometry and reflectometry, * Eliminates the ambiguity in layer thickness determination for transparent films, * Extends thickness measurement to 25000 nm. # Laser wavelength 632.8 nm# Spectral range of reflectivity from 450 nm to 920 nm wavelength# Spot size 80 ?m
-
VictoryPCB
Monthy Capability: 1200 Sq M/MonthLayer: 4 LayersMaterial: FR4 TG140Dimension: 335.14mm*245.65mmFinished board thickness: 1.6mm+/-0.13mmFinished copper thickness: 2ozMin Trace Width/Space: 8/8milMin hole size: 0.3mmMin hole wall copper: ≥25UMSoldermask Color: YellowSurface finishing: HALApplication field: Consumer electronics
-
LaserLinc
Precision measurement is our focus. Our laser and ultrasonic-based technologies provide non-contact diameter measurements for a wide range of materials. Our accurate suite of tools cover outside diameter (OD), ovality (eccentricity), wall thickness (coating thickness/material thickness), concentricity, inside diameter (ID), and more.
-
VX -
Dakota Ultrasonics
With the hand-held VX Ultrasonic Velocity gauge, you can determine material velocities by measuring a known thickness, entering a known thickness into the VX, and the material velocity will be displayed. The tool's backlit display is easy to read, even in dim light, and the unit operates for up to 200 hours on a single set of batteries.
-
Front Window Scanner For Wedge Angle Measurement -
Optik Elektronik Gerätetechnik GmbH
Scanning of complete automotive windshields to measure the wedge angle and thickness change, especially in the HUD area.
-
MTI Instruments
Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
-
EVG®50 -
EV Group
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
-
SRS-2010 -
NAPSON Corp.
*Resitivity map along with depth direction, thickness of epitaxial , depth of PN junctin and carier density profiles
-
thicknessGAUGE.laser profile -
Micro-Epsilon Group
thicknessGAUGE.laser profile sensor systems use laser profile scanners for the thickness measurement. These scanners project a laser line onto the surface to be measured. The laser line compensates for strip tilting and enables profile averaging. The laser line measuring technique makes it possible to measure the thickness of structured materials such as embossed surfaces and perforated plates.
-
2830 ZT -
Malvern Panalytical Ltd
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
-
National Technical Systems
Comparative tracking index (CTI) is used to assess the relative resistance of insulating materials to tracking. The CTI expressed as that voltage which causes tracking after 50 drops of 0.1 percent ammonium chloride solution have fallen on the material. The results of testing the nominal 3 mm thickness are considered representative of the material’s performance in any thickness.
-
RT-3000/RG-2000 (RG-3000) -
NAPSON Corp.
*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
-
capaNCDT -
Micro-Epsilon Group
Capacitive sensors are designed for non-contact measurement of displacement, distance and position, as well as for thickness measurement. Due to their high signal stability and resolution, capacitive displacement sensors are applied in laboratories and industrial measurement tasks. In production control, for example, capacitive sensors measure film thickness and application of the adhesive. Installed in machines, they monitor displacement and tool positions.