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Front and Back Side Topography Defect Detection
LIGHTsEE
High throughputNanometer range vertical sensitivitySimultaneous double side inspectionNanotopography and Topography measurementDetection of Slip lines, particles, Hairline cracks, SOI voids, Comets, EPI defects…Compliant with thin or thick wafers, taiko wafers, highly warped wafers
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Optical Tensiometers
Theta Topography
Theta Topography is an innovative system capable of separating the effect of surface roughness to the contact angle result. As a result, roughness-corrected contact angles can be better compared with each other for research and quality control purposes.
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Non-contact Optical Surface Profiler
VS-OSP
The VersaSCAN OSP integrates the Base with a high-accuracy, high-speed laser displacement sensor. The OSP technique uses diffuse reflection mechanism to measure topography of a sample. OSP can be used to measure topography, as a very sensitive leveling mechanism, or charting topography to be implemented with other scanning probe techniques for constant-distance mode operation.
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Local and Lattice Stress Measurement
127 Raman
Local and Lattice Stress Measurement, Die level Topography for in-die and in-device stress and composition control.
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Scanning Electron Microscopes
SEM
Scanning Electron Microscopes (SEM) scan a sample with a focused electron beam and obtain images with information about the samples’ topography and composition.
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Analytical Services
Atomic Force Microscopy (AFM) allows for sub nanometer resolution imaging of surface topography and is able to quantify surface roughness at the angstrom scale. Our team can give you highly accurate measurements such as surface topography, dopant distribution, magnetic domain features, and a wide variety of other sample properties to give you the information you need to do great work.Park can provide measurements in the following areas:● Topography (surface roughness, grain size, step height, etc.)● Mechanical Properties (stiffness, etc.)● Electrical properties (capacitance, conductivity, etc.)● Thermal properties ● Magnetic properties These properties can be measured in air or liquid, depending on your needs.
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Sensors
NanoFocus Probe
Scan of 3D topography of high accurate featuresVery high point densitySuitable to perform non-contact roughness measurementsHigh flexibility using a range of different front lenses
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Areal Confocal 3D Measurement
µsurf
The measuring system of the µsurf-product line enable automated 3D surface measurements of roughness, topography, layer thickness and volume. µsurf-measuring systems are available in different designs: from compact mobile systems and laboratory solutions up to multisensor setups on granite portal for use near production lines.
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Muliprobe systems
AFM-Raman & TERS
AFM-Raman is a synergistic tool combining a sample's topography and chemical signature. The Nanonics platform provides true upright or inverted integration without altering the Raman's path allowing for the ultimate in Raman and AFM imaging. This seamless integration provides many advanced features such as: All modes of TERS operation on both conducting and non-conducting surfaces.
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Atomic Force Microscopy
Bruker’s industry-leading AFM microscopes provide the highest levels of performance, flexibility and productivity, and incorporate the very latest advances in atomic force microscopy techniques. Applications range from materials science to biology, from semiconductors to data storage devices, from polymers to optics with measurement of nanoscale topography, nano-mechanical, nano-electrical and nanoscale chemical mapping.
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Surface Imaging & Metrology Software
Mountains®
Analyze multiple types of surface data. Turn your surface data into accurate, visual surface analysis reports. See every feature with high quality real-time 3D imaging of surface topography. Characterize surfaces in accordance with the latest metrology standards.
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Optical Profilers
Finally, measurements of surface roughness and topography can be made for a price that's less than that of a stylus profilometer. The Profilm3D has sub-nanometer vertical resolution, which surpasses optical profilometers that cost 3x as much. It does so by using the same state-of-the-art measurement technologies as the most sensitive optical profilers available: vertical-scanning interferometry (VSI) and phase-shifting interferometry (PSI).
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Surface Measurement Instrument
SMI
Redefining speed and accuracy in non-contact metrology, the Optikos SMI is a high-speed surface topography instrument that characterizes spherical, toric, and aspheric surfaces. The SMI measures surface shape deviations of precision surfaces using wavefront analysis technology. Configured to measure such items as: micro-optics, ball lenses, and contact lens molds, the instrument allows users to easily measure aspheric and toric parts without the need for reference surfaces.
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Acoustic Target Impact Localization System
ATILS
In peace time, for training purposes, artillery units conduct their frequent target practicing.Both the skills of the gunners and the forward observers need to be improved, their communication cycle to be shortened.Forward observing is a dangerous task during war time, causing a justification to find other ways to localize impacts and adjust fires.Furthermore, the sheer lack of a line of sight, because of topography and/or weather, also thrives the need for other solutions to determine the impact coordinates.
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3D Optical Profilers
ZYGO's 3D Optical Profiler instruments enable precise, quantitative, ISO-compliant, non-contact surface measurement and characterization of micro- and nano-scale surface features, capturing up to two million data points in just seconds. Applications range from topography and waviness to roughness and microstructure characterization on samples as that vary from ultra-smooth sub-angstrom optical surfaces, to extremely rough and diffuse 3D printed surfaces.
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Optical Profilometers
Profilm3D® and Zeta™ optical profilometers provide fast, easy, non-contact solutions for 3D surface topography measurements. Our portfolio of optical profilers supports a variety of measurement techniques, including white light interferometry, True Color imaging and ZDot™ confocal grid structured illumination. KLA Instruments can help guide you to the right optical profiler solution for your unique needs.
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Metrology
KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Scanning Probe Microscopy/Atomic Force Microscopy (SPM/AFM Analysis)
Rocky Mountain Laboratories, Inc.
Scanning probe microscopy (SPM) refers to a family of measurement techniques that utilize a scanning probe. The most common measurement is Atomic Force Microscopy (AFM Analysis), which measures surface topography. Imaged areas can be from the nm scale to as large as 100 µm X 100 µm. Heights and depths of features can be measuredand many surface roughness parameters, e.g Ra, can be calculated. 3-D images can also be produced for dramatic data presentation. Magnetic and electrical response can also be measured with SPM.
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Substrate Manufacturing
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
