Showing results: 16 - 21 of 21 items found.
-
Rohde & Schwarz GmbH & Co. KG
The R&S®RTO2000,; R&S®RTO6 and R&S®RTP; oscilloscopes support triggering and decoding of PCI Express Gen 1.1 and 2.0 signals. In addition, the R&S®RTP supports Gen 3.0 signals. Users can set up decoding in seconds via the intuitive menu dialogs. For detailed analysis, results can be viewed as color-coded telegrams and/or in a table. Errors and other protocol-specific fields, such as TLP and OS are identified efficiently using the oscilloscopes' protocol trigger.
-
ES62X-CMPS -
ESDEMC Technology LLC
The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.
-
TPA-95 -
High Power Pulse Instruments GmbH
*Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements
-
Hanwa Electronic Ind. Co.,Ltd.
The tester can implement simulate operating characteristic of protective circuit In addition capable of the VFTLP test.
-
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
-
TLP Solutions, LLC
Application & retrofit, start up, training/tech support, and more from TLP Solutions
